ASTM B32-20

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: B32 − 08 (Reapproved 2014) B32 − 20
Standard Specification for
Solder Metal
This standard is issued under the fixed designation B32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope Scope*
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including
but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-
silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points.
Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this
specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and
flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical
conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data
Sheet (MSDS)(SDS) for this product/material as provided by the manufacturer, to establish appropriate safety safety, health, and
healthenvironmental practices, and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization
established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued
by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2. Referenced Documents
2.1 ASTM Standards:
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Pine Chemical Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Pine Chemical Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Pine Chemicals and Hydrocarbons, by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
This specification is under the jurisdiction of ASTM Committee B02 on Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee B02.02 on Refined
Lead, Tin, Antimony, and Their Alloys.
Current edition approved Oct. 1, 2014Oct. 1, 2020. Published October 2014October 2020. Originally approved in 1919. Last previous edition approved in 20082014 as
B32B32 – 08 (2014).– 08. DOI: 10.1520/B0032-08R14.10.1520/B0032-20.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
B32 − 20
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder (Withdrawn 1994)
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique (Withdrawn 1983)
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
E87 Methods for Chemical Analysis of Lead, Tin, Antimony and Their Alloys (Photometric Method) (Withdrawn 1983)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
2.2 Federal Standard:
Fed. Std. No. 123 Marking for Shipment (Civil Agencies)
2.3 Military Standard:
MIL-STD-129 Marking for Shipment and Storage
3. Terminology
3.1 Definitions:
3.1.1 producer, n—the primary manufacturer of the material.
3.2 Definitions of Terms Specific to This Standard:
3.2.1 lot, n—Thethe term “lot” as used in this specification is defined as follows:
3.2.1.1 Discussion—
For solid solder metal, a lot consists of all solder of the same type designation, produced from the same batch of raw materials
under essentially the same conditions, and offered for inspection at one time.
3.2.1.2 Discussion—
For flux–core solder, a lot consists of all solder of the same core mixture, produced from the same batch of raw materials under
essentially the same conditions and offered for inspection at one time.
3.2.2 lot number,,number, n—Thethe term “lot number” as used in this specification refers to an alphanumeric or numerical
designation for a lot which is traceable to a date of manufacture.
4. Classification
4.1 Type Designation—The type designation uses the following symbols to properly identify the material:
4.1.1 Alloy Composition—The composition is identified by a two-letter symbol and a number. The letters typically indicate the
chemical symbol for the critical element in the solder and the number indicates the nominal percentage, by weight, of the critical
element in the solder. The designation followed by the letters A or B distinguishes between different alloy grades of similar
composition (see Table 1).
4.1.2 Form—The form is indicated by a single letter in accordance with Table 2.
4.1.3 Flux Type—The flux type is indicated by a letter or combination of letters in accordance with Table 3.
4.1.4 Core Condition and Flux Percentage (applicable only to flux-cored solder)—The core condition and flux percentage is
identified by a single letter and a number in accordance with Table 4.
4.1.5 Powder Mesh Size and Flux Percentage (applicable only to solder paste)—The powder mesh size and flux percentage is
identified by a single letter and a number in accordance with Table 5.
5. Ordering Information
5.1 Orders for material under this specification indicate the following information, as required, to adequately describe the desired
material.
5.1.1 Type designation (see 4.1),
5.1.2 Detailed requirements for special forms,
The last approved version of this historical standard is referenced on www.astm.org.
Available from Global Engineering Documents, 15 Inverness Way, East Englewood, CO 80112-5704, http://global.ihs.com.
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://www.dodssp.daps.mil.
B32 − 20
TABLE 1 Solder Compositions - wt% (range or maximum)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 max 0.02 0.005 . . . 430 221 430 221 L13965
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 430 221 L13965
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 . . . 450 233 464 240 L13950
D
E Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 349 L13935
D
HA Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 . . . 420 216 440 227 L13955
D
HB Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 . . 460 238 660 349 L13952
D
HN Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 . . 440 225 660 350 L13933
D
PT Rem 0.2 0.25–4.0 0.05–0.50 0.25–4.0 0.005 0.005 0.15 0.01 0.02 0.005 0.005 0.01-0.25 . 430 221 435 224
D
AC Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75-3.75 0.05 0.02 0.005 0.001 . . 403 206 453 234 L13964
D
OA Rem 0.2 0.05 0.05–0.3 2.0–4.0 0.005 0.005 0.5–1.5 0.05 0.04† 0.05 . . . 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 . . . 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 . 0.04-0.20 419 215 660 350 L13931
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 . . . 440 225 660 350 L13939
A
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last right-hand place of figures used in expressing
the specified limit, in accordance with the rounding method of Practice E29.
B
Temperatures given are approximations and for information only.
C
For alloys not identified, named elements shall conform to the following tolerances (wt%): >5% ±0.5%, >=5%±<5 % ± 0.5 %, >=5 % ± 0.25 %; Impurity elements (maximum): Sn-0.2, Pb-0.2, Sb-0.5, Ag-0.015, Cu-0.08,
Cd-0.005, Al-0.05, Bi-0.15, As-0.02,As-0.05, Fe-0.02, Zn-0.005.
D
Grades E and OA are covered by U.S. patents held by Engelhard Corp, Mansfield, MA, and Oatey Co. Cleveland, OH respectively. Federated Fry Metals, Altoona, PA and Taracorp Inc., Atlanta, GA have applied for
patents on grades AC and TC respectively. Grades HA, HB, and HN are covered by patents assigned to J. W. Harris Co., Cincinnati, OH. Grade PT is covered by a patent issued to Precise Alloys Corporation, Bronx,
NY. Interested parties are invited to submit information regarding identification of acceptable alternatives to these patented items to the Committee on Standards, ASTM International Headquarters, 100 Barr Harbor Drive,
West Conshohocken, PA 19428. Your comments will receive careful consideration at a meeting of the responsible technical committee, which you may attend.
† OA value for FE 10 was corrected editorially.

B32 − 20
TABLE 1 Solder Compositions - wt% (range or maximum) (continued)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Ce Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14
°F °C °F °C
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 354 179 372 189 L13620
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . . . 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . . . 361 183 441 227 L54951
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 460 238 L54916
Sn40B 39.5–41.5 Rem 1.8–2.4 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 448 231 L54918
Sn35A 34.5–36.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 447 247 L54851
Sn35B 34.5–36.5 Rem 1.6–2.0 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 470 243 L54852
Sn30A 29.5–31.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 491 255 L54821
Sn30B 29.5–31.5 Rem 1.4–1.8 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 482 250 L54822
Sn25A 24.5–26.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 511 266 L54721
Sn25B 24.5–26.5 Rem 1.1–1.5 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 365 185 504 263 L54722
Sn20A 19.5–21.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 361 183 531 277 L54711
Sn20B 19.5–21.5 Rem 0.8–1.2 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 363 184 517 270 L54712
Sn15 14.5–16.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 437 225 554 290 L54560
Sn10A 9.0–11.0 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 514 268 576 302 L54520
Sn10B 9.0–11.0 Rem 0.20 1.7–2.4 0.08 0.001 0.005 0.03 0.02 0.02 0.005 . . . 514 268 570 299 L54525
Sn5 4.5–5.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 586 308 594 312 L54322
Sn2 1.5–2.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . . . 601 316 611 322 L54210
Ag1.5 0.75–1.25 Rem 0.40 1.3–1.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . . . 588 309 588 309 L50132
Ag2.5 0.25 Rem 0.40 2.3–2.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . . . 580 304 580 304 L50151
Ag5.5 0.25 Rem 0.40 5.0–6.0 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . . . 580 304 716 380 L50180
A
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last right-hand place of figures used in expressing
the specified limit, in accordance with the rounding method of Practice E29.
B
Temperatures given are approximations and for information only.

B32 − 20
TABLE 2 Form
Symbol Form
B Bar
I Ingot
P Powder
R Ribbon
A
S Special
W Wire
A
Includes pellets, preforms, etc.
TABLE 3 Flux Type
Symbol Description
S Solid, no flux
R Rosin, nonactivated
RMA Rosin, mildly activated
RA Rosin, activated
OA Organic, water-soluble
OS Organic, organic solvent-soluble (other than R, RMA, or RA)
IS Inorganic acids and salts
TABLE 4 Core Condition and Flux Percentage
Condition
Condition
Symbol
D Dry powder
P Plastic
Percentage
Flux Percentage by Weight
Symbol
Nominal Min Max
1 1.1 0.8 1.5
2 2.2 1.6 2.6
3 3.3 2.7 3.9
4 4.5 4.0 5.0
A
6 6.0 5.1 7.0
A
Not applicable to flux types R, RMA, and RA.
TABLE 5 Powder Mesh Size and Flux Percentage
Size Symbol Powder Mesh Size
A <325
B <200
C <100
Percentage Symbol Flux Percentage by Weight
Min Max
1 1 5
2 6 10
3 11 15
4 16 20
5 21 25
6 26 30
7 >30
5.1.3 Dimensions of ribbon and wire solder (see 9.2),
5.1.4 Unit weight,
5.1.5 Packaging (see Section 18),
5.1.6 Marking (see Section 17),
5.1.7 ASTM specification number and issue, marked on (a) purchase order and (b) package or spool, and
5.1.8 Special requirements, as agreed upon between supplier and purchaser.
B32 − 20
6. Materials and Manufacture
6.1 The producer must have each lot of solder metal as uniform in quality as practicable and of satisfactory appearance in
accordance with best industrial practices. Each bar, ingot, or other form in which the solder is sold must be uniform in composition
with the entire lot.
7. Chemical Composition
7.1 Solder Alloy—The solder alloy composition is as specified in Table 1.
NOTE 1—By mutual agreement between supplier and purchaser, analysis may be required and limits established for elements or compounds not specified
in Table 1.
7.2 Flux (applicable to flux-core ribbon, wire, and solder paste):
7.2.1 Type R—The flux is composed of Grade WW or WG gum rosin of Test Methods D509. The rosin shall have a
toluene–insoluble matter content of not more than 0.05 weight % in accordance with Test Method D269, a minimum acid number
of 160 mg KOH/1 g sample in accordance with Test Methods D465, a minimum softening point of 70°C in accordance with Test
Methods E28, and a minimum saponification number of 166 in accordance with Test Methods D464. When solvents or plasticizers
are added, they must be nonchlorinated.
7.2.2 Type RMA—The flux is composed of rosin conforming to 7.2.1. Incorporated additives provide a material meeting the
requirements of 8.1.2 for type RMA. When solvents or plasticizers are added, they must be nonchlorinated.
7.2.3 Type RA—The flux is composed of rosin conforming to 7.2.1. Incorporated additives provide a material meeting the
requirements of 8.1.2 for Type RA. When solvents or plasticizers are added, they must be nonchlorinated.
7.2.4 Type OA—The flux is composed of one or more water-soluble organic materials.
7.2.5 Type OS—The flux is composed of one or more water-insoluble organic materials, other than Types R, RMA, and RA, which
are soluble in organic solvents.
7.2.6 Type IS—The flux is composed of one or more inorganic salts or acids with or without an organic binder and solvents.
8. Physical Properties and Performance Requirements
8.1 Solder Paste—Solder paste must exhibit smoothness of texture (no lumps) and the absence of caking and drying.
8.1.1 Powder Mesh Size—The solder powder mesh size shall be as specified (see 5.1.1 and 4.1.5) when the extracted solder
powder is tested as specified in 13.4.
8.1.2 Viscosity—The viscosity of solder paste and the method used to determine the viscosity must be agreed upon between the
supplier and purchaser. The following variables must be taken into account when relating one viscosity measurement to another
type of viscometer used, spindle size and shape, speed (r/min), temperature of sample, and the use or non-use of a helipath.
8.2 Requirements for Flux—The flux must meet the physical and performance requirements specified in Table 6 as applicable.
8.2.1 Solder Pool—When solder is tested as specified in 13.3.2, there must be no spattering, as indicated by the presence of flux
particles outside the main pool of residue. The flux must promote spreading of the molten solder over the coupon to form integrally
thereon a coat of solder that shall feather out to a thin edge. The complete edge of the solder pool must be clearly visible through
the flux residue.
8.2.2 Dryness—When solder is tested as specified in 13.3.2, the surface of the residue must be free of tackiness, permitting easy
and complete removal of applied powdered chalk.
8.2.3 Chlorides and Bromides Test—When the extracted flux is tested as specified in 13.3.6, the test paper will show no chlorides
or bromides by a color change of the paper to off-white or yellow white.
B32 − 20
TABLE 6 Requirements for Flux
Test Type R Type RMA Type RA Other Flux Types Method Section
Weight of flux see Table 4 see Table 4 see Table 4 see Table 4 13.3.1
A
Solder pool see 8.2.1 see 8.2.1 see 8.2.1 see 8.2.1 13.3.2
B
Spread factor 80 min 80 min 80 min not required 13.3.3
C
Dryness see 8.2.2 see 8.2.2 see 8.2.2 not required 13.3.4
Resistivity of water extract 100 000 min 100 000 50 000 not required 13.3.5
(Ω·cm)
D
Chlorides and bromides see 8.2.3 see 8.2.3 not required not required 13.3.6
E
Copper mirror pass pass not required not required 13.3.7
A
Applicable only to composition 60/40.
B
Applicable only to composition 60/40 in the form of flux-core wire or solderpaste.
C
Applicable only to composition 60/40 in the form of flux-core wire.
D
Applicable only to flux-core wire and solderpaste.
E
Applicable only to flux-core wire.
8.2.4 Copper Mirror Test—When tested as specified in 13.3.7, the extracted flux will have failed the test if, when examined against
a white background, complete removal of the copper film is noted, as evidenced by the white background showing through, and
must be rejected. Discoloration of the copper due to a superficial reaction or to only a partial reduction of the thickness of the
copper film is not cause for rejection.
9. Dimensions and Unit Weight
9.1 Bar and Ingot Solder—The dimensions and unit weight of bar and ingot solder will be as agreed upon between supplier and
purchaser.
9.2 Wire solder (solid and flux-cored)—The dimensions and unit weight of wire solder are specified in 5.1.3 and 5.1.4. The
tolerance on the specified outside diameter shall be 65 % or 60.002 in. (0.05 mm), whichever is greater.
9.3 Other Forms:
9.3.1 Dimensions for ribbon and special forms will be agreed upon between supplier and purchaser.
9.3.2 The unit weight of solder paste is specified in 5.1.4.
10. Workmanship, Finish, and Appearance
10.1 All forms of solder must be processed in such a manner as to be uniform in quality and free of defects that will affect life,
serviceability, or appearance.
11. Sampling
11.1 Care must be taken to ensure that the sample selected for testing is representative of the material. The method of sampling
consists of one of the following methods:
11.1.1 Samples taken from the final solidified cast or fabricated product.
11.1.2 Representative samples obtained from the lot of molten metal during casting. The molten sample is poured into a cool mold,
forming a bar approximately ⁄4 in. (6.4 mm) thick.
11.2 Frequency of Sampling—Frequency of sampling for determination of chemical composition shall be in accordance with Table
7. For spools and coils, the sample is obtained by cutting back 6 ft (1.8 m) of wire from the free end and then taking the next 6
ft for test. In other forms, an equivalent sample is selected at random from the container.
11.3 Other Aspects of Sampling—Other aspects of sampling conforms in the case of bar and ingots, to Practice E88. For fabricated
solders the appropriate reference is Practice E55.
B32 − 20
TABLE 7 Frequency of Sampling
Number of Samples (spools,
Size of Lot, lb (kg)
coils, containers or pieces)
Up to 1000 (450), incl 3
Over 1000 to 10 000 (450 to 4500), incl 5
Over 10 000 (4500) 10
12. Specimen Preparation
12.1 Flux-Cored Ribbon and Wire Solder and Solder Paste—Each sample of flux-cored ribbon or wire solder or solder paste is
melted in a clean container under oil and mixed thoroughly. After the flux has risen to the top, the alloy is poured carefully into
a cool mold (care should be taken to allow the flux and alloy to separate completely), forming a bar approximately ⁄4 in. (6.4 mm)
thick. The bar is cleaned of flux residue and sampled for analysis as specified in 12.3.
12.1.1 Flux Extraction Procedure:
12.1.1.1 Flux-Cored Solder—The flux core is extracted as follows: Cut a length of the flux-cored solder weighing approximately
150 g and seal the ends. Wipe the surface clean with a cloth moistened with acetone. Place the sample in a beaker, add sufficient
distilled water to cover the sample, and boil for 5 to 6 min. Rinse the sample with acetone and allow to dry. Protecting the solder
surface from contamination, cut the sample into ⁄8 in. (9.5 mm) (maximum) lengths without crimping the cut ends. Place the cut
lengths in an extraction tube of a chemically clean soxhlet extraction apparatus and extract the flux with reagent grade, 99 %
isopropyl alcohol until the return condensate is clear. The resistivity of water extract, copper mirror, and chlorides and bromides
tests are performed using a test solution prepared by concentrating the solids content in the flux extract solution to approximately
35 % by weight by evaporation of the excess solvent. The exact solids content of the test solution are determined on an aliquot,
dried to constant weight in a circulating air oven maintained at 85 6 3°C.
12.1.1.2 Solder Paste—The flux is extracted as follows: Place 200 mL of reagent grade, 99 % isopropyl alcohol in a chemically
clean Erlenmeyer flask. Add 40 6 2 g of solder paste to the flask, cover with a watch glass, and boil for 10 to 15 min using medium
heat. Allow the powder to settle for 2 to 3 min and decant the hot solution into a funnel containing filter paper, collecting the flux
extract in a chemically clean vessel.
NOTE 2—The solution in isopropyl alcohol does not necessarily have to be clear. The resistivity of water extract and chlorides and bromides tests shall
be performed using a test solution prepared by concentrating the solids content in the flux extract solution to approximately 35 % by weight by evaporation
of the excess solvent. The exact solids content of the test solution shall be determined on an aliquot, dried to constant weight in a circulating air oven
maintained at 85 6 3°C.
12.2 Solid Ribbon and Wire Solder—Each sample of solid ribbon and wire solder is prepared in accordance with 12.1, as
applicable.
12.3 Bar and Ingot Solder—Each sample piece is cut in half and one half marked and held in reserve. The remaining half is melted
in a clean container, mixed thoroughly and poured into a cool mold, forming a bar approximately ⁄4 in. (6.4 mm) thick. Sampling
is performed by one of the following methods:
12.3.1 Sawing—Saw cuts are made across the bar at equal intervals of not more than 1 in. (2.5 cm) throughout its length. If it is
impractical to melt the bar or ingot as specified abo
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