Test Method for Detection of Epitaxial Spikes (Withdrawn 1999)

SCOPE
1.1 This test method covers the detection of epitaxial spikes on silicon wafers. It is applicable to any wafer diameter or surface orientation.  
1.2 This test method is a pass or fail test for the presence of spikes on a wafer. If there are relatively few spikes and they are not close together the test method can also be used to count spikes.  
1.3 For purposes of this test method, a detectable spike is one with a nominal height of 4 [mu]m or more.  
1.4 This test method does not have the ability to measure spike heights.  
1.5 This test method is ordinarily nondestructive but its use may require subsequent cleaning of the tested wafers.  
1.6 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Withdrawn
Publication Date
31-Dec-1992
Withdrawal Date
09-Jan-1999
Technical Committee
Current Stage
Ref Project

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Standard
ASTM F815-88(1993)e1 - Test Method for Detection of Epitaxial Spikes (Withdrawn 1999)
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NOTICE:¬This¬standard¬has¬either¬been¬superseded¬and¬replaced¬by¬a¬new¬version¬or
discontinued.¬Contact¬ASTM¬International¬(www.astm.org)¬for¬the¬latest¬information.
e1
Last ASTM Designation: F 815 – 88 (Reapprovead 1993)
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Co
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