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IEC

WG 3 - TC 47/SC 47F/WG 3

TC 47/SC 47F/WG 3

General Information

Status
Active
Work Field
Information technology
Parent
SC 47F - Micro-electromechanical systems

Frequently Asked Questions

WG 3 is a Technical Committee within the International Electrotechnical Commission (IEC). It is named "TC 47/SC 47F/WG 3". This committee has published 696 standards.

WG 3 develops IEC standards in the area of Information technology. Currently, there are 696 published standards from this technical committee.

The International Electrotechnical Commission (IEC) is the world's leading organization for the preparation and publication of international standards for electrical, electronic, and related technologies. Founded in 1906, the IEC provides a global platform for companies, industries, and governments to meet, discuss, and develop the international standards they require.

A Technical Committee (TC) in IEC is a group of experts responsible for developing international standards in a specific technical area. TCs are composed of national member body delegates and work through consensus to create standards that meet global industry needs. Each TC may have subcommittees (SCs) and working groups (WGs) for specialized topics.

Standardization Organization
ICS
Directive
Mandate
50
IEC
IEC 62047-53:2025(Main)
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device

IEC 62047-53:2025 defines the test methods for the performances of MEMS electrothermal transfer device.
The document is applicable to the MEMS electrothermal transfer devices used in airbags, petroleum and mineral detection, igniters and detonators.

  • Standard
    14 pages
    English language
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IEC
IEC 62047-50:2025(Main)
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones

IEC 62047-50:2025 defines the test conditions and test methods for the performance of MEMS capacitive microphones.
This document applies to MEMS capacitive microphones.

  • Standard
    13 pages
    English language
    sale 15% off
IEC
IEC 62047-44:2024(Main)
Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices

IEC 62047-44:2024 describes terminology, definitions and test methods that are used to evaluate and determine the dynamic performance of MEMS (Micro-Electromechanical Systems) resonant electric‑field‑sensitive devices. It also specifies sample requirements and test equipment for dynamic performances of MEMS resonant electric‑field‑sensitive devices. The statements made in this document are also applicable to MEMS resonant electric‑field‑sensitive devices with various driving mechanisms such as electrostatic, electrothermal, electromagnetic, piezoelectric, etc.

  • Standard
    19 pages
    English language
    sale 15% off
IEC
IEC 62047-40:2021(Main)
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold

IEC 62047-40:2021(E) specifies the test conditions and methods of micro-electromechanical inertial shock switch threshold. This document applies to normally open micro-electromechanical inertial shock switch.

  • Standard
    11 pages
    English language
    sale 15% off
IEC
IEC 62047-41:2021(Main)
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators

IEC 62047-41:2021 specifies the terminology, essential ratings and characteristics, and measuring methods of RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) circulators and isolators.

  • Standard
    65 pages
    English and French language
    sale 15% off
IEC
IEC 62047-33:2019(Main)
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

IEC 62047-33:2019 (E) defines terms, definitions, essential ratings and characteristics, as well as test methods applicable to MEMS piezoresistive pressure-sensitive device. This document applies to piezoresistive pressure-sensitive devices for automotive, medical treatment, electronic products.

  • Standard
    24 pages
    English language
    sale 15% off
IEC
IEC 62047-34:2019(Main)
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer

IEC 62047-34:2019 (E) describes test conditions and test methods of electric character, static performances and thermal performances for MEMS pressure-sensitive devices. This document applies to test for both open and closed loop piezoresistive MEMS pressure devices on wafer.

  • Standard
    16 pages
    English language
    sale 15% off
IEC
IEC 62047-32:2019(Main)
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators

IEC 62047-32:2019 specifies the test method and test condition for the nonlinear vibration of MEMS resonators. The statements made in this document apply to the development and manufacture for MEMS resonators.

  • Standard
    37 pages
    English and French language
    sale 15% off
50