SIST EN 60749-4:2017
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)
IEC 60749-4:2017(E) provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:
a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
c) allowance of additional time-to-test delay or return-to-stress delay.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 4: Feuchte Wärme, konstant, Prüfung mit hochbeschleunigter Wirkung (HAST) (IEC 60749-4:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4: Essai continu fortement acceléré de contrainte de chaleur humide (HAST) (IEC 60749-4:2017)
L’IEC 60749-4:2017 décrit un essai de contrainte de température et d’humidité fortement accéléré (HAST, highly accelerated temperature and humidity stress test) qui est réalisé dans le but d’évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) clarification des exigences relatives à la température, à l’humidité relative et à la durée d’exposition, détaillées dans le Tableau 1;
b) ajout de recommandations suggérant de placer une ou des résistances dans le montage d’essai, afin d’éviter d’endommager la carte d’essai ou le dispositif soumis à essai (DUT, Device Under Test);
c) spécification d’une autorisation d’extension du temps d’établissement des conditions d’essai ou du temps de retour à la contrainte.
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 4. del: Preskušanje z vlažno vročino, v ustaljenem stanju in z močno pospešenim obremenjevanjem (HAST) (IEC 60749-4:2017)
Ta del standarda IEC 60749 določa preskus z močno pospešenim temperaturnim in vlažnostnim obremenjevanjem (HAST) za namene vrednotenja zanesljivosti nehermetično pakiranih polprevodniških elementov v vlažnih okoljih.
General Information
- Status
- Published
- Publication Date
- 08-Aug-2017
- Technical Committee
- I11 - Imaginarni 11
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 21-Jun-2017
- Due Date
- 26-Aug-2017
- Completion Date
- 09-Aug-2017
Relations
- Effective Date
- 20-Jun-2017
Overview
EN 60749-4:2017 (IEC 60749-4:2017) defines the Highly Accelerated Stress Test (HAST) for assessing the reliability of non‑hermetic packaged semiconductor devices in humid environments. The method uses elevated temperature, humidity and electrical bias to accelerate moisture penetration and the same failure mechanisms targeted by steady-state temperature/humidity bias tests. This edition clarifies environmental requirements, recommends current-limiting in test setups, and allows for additional time-to-test or return-to-stress delays.
Key Topics
- Purpose: Provide a rapid, destructive stress test to reveal moisture-related failure modes in non‑hermetic packages.
- Test scope: Applies to non‑hermetic semiconductor packages; HAST results may be used alongside or instead of the 85/85 steady-state test (IEC 60749-5), with 85/85 data taking priority when both are performed.
- Test apparatus: Requires a pressure-capable chamber with controlled temperature, relative humidity and electrical feedthroughs. Chambers must support ramp-up and ramp-down while maintaining set conditions.
- Mounting and contamination control: Devices under test should be mounted to minimize thermal gradients and placed away from chamber walls. Board, socket and wiring materials must be chosen to minimize ionic contamination and corrosion artefacts.
- Water quality: De‑ionized water with the specified minimum resistivity (see clause 5.7) is required for vapour generation to avoid ionic contamination.
- Biasing and protection: The standard recommends including current-limiting resistor(s) in the test circuit to prevent damage to test boards or devices under test (DUTs). Bias configurations and reporting requirements are defined in the standard (see clause 6 and Table 2).
- Test conditions and reporting: Test conditions (temperature, relative humidity and duration) are selected from Table 1. Temperature profiles and calibration records are recommended to validate stress cycles.
Applications
- Qualification testing of non‑hermetic packaged integrated circuits for consumer, automotive and industrial electronics where moisture ingress is a concern.
- Accelerated reliability screening during product development to detect early-life humidity-related failures.
- Comparative evaluation of encapsulant or seal materials, board-level designs and assembly processes for moisture robustness.
Related Standards
- IEC 60749-5 / EN 60749-5 - Steady-state temperature humidity bias life test (85 °C/85 % RH) - referenced as the complementary steady-state method.
- Normative and informative references listed in Annex ZA and clause 2 of EN 60749-4:2017 provide cross-references and application guidance.
Practical value: EN 60749-4:2017 gives test engineers a standardized HAST procedure and reporting basis, helping organizations accelerate reliability feedback while maintaining consistency with international semiconductor test practices.
Keywords: EN 60749-4:2017, HAST, damp heat, non-hermetic, semiconductor reliability, humidity bias test, test apparatus, Table 1.
Frequently Asked Questions
SIST EN 60749-4:2017 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)". This standard covers: IEC 60749-4:2017(E) provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition: a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1; b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage; c) allowance of additional time-to-test delay or return-to-stress delay.
IEC 60749-4:2017(E) provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition: a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1; b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage; c) allowance of additional time-to-test delay or return-to-stress delay.
SIST EN 60749-4:2017 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 60749-4:2017 has the following relationships with other standards: It is inter standard links to SIST EN 60749-4:2004. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
SIST EN 60749-4:2017 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat,
steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 4: Feuchte
Wärme, konstant, Prüfung mit hochbeschleunigter Wirkung (HAST) (IEC 60749-4:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4:
Essai continu fortement acceléré de contrainte de chaleur humide (HAST) (IEC 60749-
4:2017)
Ta slovenski standard je istoveten z: EN 60749-4:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 60749-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-4:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 4: Damp heat, steady state, highly accelerated stress test
(HAST)
(IEC 60749-4:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 4: Essai continu Prüfverfahren - Teil 4: Feuchte Wärme, konstant, Prüfung
fortement acceléré de contrainte de chaleur humide (HAST) mit hochbeschleunigter Wirkung (HAST)
(IEC 60749-4:2017) (IEC 60749-4:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60749-4:2017 E
European foreword
The text of document 47/2346/FDIS, future edition 2 of IEC 60749-4, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-4:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn
This document supersedes EN 60749-4:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-4:2017 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is
available here: www.cenelec.eu.
Publication Year Title EN/HD Year
1)
IEC 60749-5 - Semiconductor devices - Mechanical EN 60749-5 -
and climatic test methods - Part 5:
Steady-state temperature humidity bias
life test
1) To be published.
IEC 60749-4 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4002-1
– 2 – IEC 60749-4:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 HAST test – General remarks . 5
5 Test apparatus . 6
5.1 Test apparatus requirements . 6
5.2 Controlled conditions . 6
5.3 Temperature profile . 6
5.4 Devices under stress . 6
5.5 Minimize release of contamination . 6
5.6 Ionic contamination . 6
5.7 De-ionized water . 6
6 Test conditions . 6
6.1 Test conditions requirements . 6
6.2 Biasing guidelines . 7
6.3 Choosing and reporting . 8
7 Procedure . 8
7.1 Test device mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 8
7.5 Bias . 8
7.6 Readout . 9
7.7 Handling . 9
7.8 Calibration records . 9
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9
Table 1 – Temperature, relative humidity and duration requirements . 7
Table 2 – Bias and reporting requirements . 8
IEC 60749-4:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 4: Damp heat, steady state,
highly accelerated stress test (HAST)
FOREWORD
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International Standard IEC 60749-4 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following signif
...
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