SIST EN 61760-4:2015

SLOVENSKI STANDARD
SIST EN 61760-4:2015
01-september-2015
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Surface mounting technology - Part 4: Standard method for classification, packaging,
labelling and handling of moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation,
Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface -- Partie 4: Méthode normalisée de classification,
d'emballage, d'étiquetage et de manipulation des appareils sensibles à l'humidité
Ta slovenski standard je istoveten z: EN 61760-4:2015
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 61760-4:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61760-4:2015

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SIST EN 61760-4:2015


EUROPEAN STANDARD EN 61760-4

NORME EUROPÉENNE

EUROPÄISCHE NORM
July 2015
ICS 31.190

English Version
Surface mounting technology - Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices
(IEC 61760-4:2015)
Technique du montage en surface (SMT) -  Oberflächenmontagetechnik -
Partie 4: Classification, emballage, étiquetage et Teil 4: Klassifikation, Verpackung, Kennzeichnung und
manipulation des dispositifs sensibles à l'humidité Handhabung feuchteempfindlicher Bauteile
(IEC 61760-4:2015) (IEC 61760-4:2015)
This European Standard was approved by CENELEC on 2015-06-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61760-4:2015 E

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SIST EN 61760-4:2015
EN 61760-4:2015
Foreword
The text of document 91/1244/FDIS, future edition 1 of IEC 61760-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61760-4:2015.

The following dates are fixed:
(dop) 2016-03-23
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-06-23
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61760-4:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

1)
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1.
ISO 62 NOTE Harmonized as EN ISO 62.

1)
Superseded by EN 60068-2-58:2015 (IEC 60068-2-58:2015): DOW = 2018-05-01.
2

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SIST EN 61760-4:2015
EN 61760-4:2015
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 60068-1 -  Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60749-20 -  Semiconductor devices - Mechanical EN 60749-20 -
and climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture
and soldering heat
IEC 61340-5-1 -  Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements
IEC 61760-2 -  Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage
conditions of surface mounting devices
(SMD) - Application guide
IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-hermetic
Solid State Surface Mount Devices

3

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SIST EN 61760-4:2015

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SIST EN 61760-4:2015




IEC 61760-4

®


Edition 1.0 2015-05




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Surface mounting technology –

Part 4: Classification, packaging, labelling and handling of moisture sensitive

devices




Technique du montage en surface (SMT) –

Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs


sensibles à l'humidité













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.190 ISBN 978-2-8322-2666-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61760-4:2015
– 2 – IEC 61760-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General information . 9
4.1 Moisture sensitive devices . 9
4.2 Moisture sensitivity level (MSL) . 10
4.3 Relation to other environmental test methods (humidity tests) . 10
5 Assessment of moisture sensitivity . 10
5.1 Identification of non moisture sensitive devices . 10
5.2 Classification . 10
6 Test procedure . 11
6.1 General . 11
6.1.1 Structurally similar components . 11
6.1.2 Verification and validation tests . 11
6.1.3 Selection of applicable soak conditions and temperature profile . 12
6.2 Drying . 12
6.3 Moisture soak . 12
6.4 Temperature load . 13
6.4.1 Classification temperature profile . 13
6.4.2 Classification temperature profile for special devices . 14
6.5 Recovery . 14
6.6 Final measurements . 14
6.6.1 Requirements . 14
6.6.2 Visual inspection . 15
6.6.3 Electrical measurements . 15
6.6.4 Non-destructive inspection (if required) . 15
6.7 Classification . 15
6.8 Information to be given in the relevant specification . 15
7 Requirements to packaging and labelling . 16
7.1 Packaging process . 16
7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs . 16
7.1.2 Evacuation and sealing . 17
7.2 Packaging material for dry pack . 17
7.2.1 Moisture barrier bag (MBB) . 17
7.2.2 Desiccant . 17
7.2.3 Humidity indicator . 19
7.3 Information to be given on labels . 20
8 Handling of moisture sensitive devices . 21
8.1 Storage . 21
8.1.1 Recommended storage conditions . 21
8.1.2 Shelf life . 21
8.1.3 Floor life . 21
8.2 ESD . 22

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SIST EN 61760-4:2015
IEC 61760-4:2015 © IEC 2015 – 3 –
8.3 Humidity indication . 22
8.3.1 Humidity indicator card (HIC) . 22
8.3.2 Moisture indicating desiccant . 22
8.4 Unpacking and re-packing . 22
9 Drying. 23
9.1 Drying options . 23
9.2 Methods . 24
9.2.1 General considerations for baking . 24
9.2.2 Bakeout times . 24
9.2.3 ESD protection . 25
9.2.4 Reuse of carriers . 25
9.2.5 Solderability limitations . 25
Annex A (informative) Moisture sensitivity of assemblies . 26
Annex B (informative) Mass/gain loss analysis . 27
Annex C (informative) Baking of devices . 28
C.1 Baking time and conditions . 28
C.2 Example of a baking process . 28
Annex D (normative) Moisture sensitivity labels . 30
D.1 Object . 30
D.2 Graphical symbols and labels . 30
D.2.1 Graphical symbol for moisture-sensitivity . 30
D.2.2 Moisture-sensitivity identification label (MSID) . 30
D.2.3 Moisture-sensitivity caution label (MSCL) . 31
Bibliography . 32

Figure 1 – Classification temperature profile . 13
Figure 2 – Examples of humidity indicator cards . 20
Figure C.1 – Baking process . 29
Figure D.1 – Standardized graphical symbol for use on equipment . 30
Figure D.2 – Alternative moisture sensitivity symbol (also in market use) . 30
Figure D.3 – MSID labels (examples) . 31

Table 1 – Moisture sensitivity levels . 11
Table 2 – Moisture soak conditions . 12
Table 3 – Parameters of the classification temperature profile . 14
Table 4 – Classification temperatures T . 14
c
Table 5 – MBB material properties . 17
Table 6 – Conditions for re-bake – Example for one type of plastic encapsulated
devices . 23
Table 7 – Conditions for baking prior to dry pack – Example for one type of plastic
encapsulated devices . 24

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SIST EN 61760-4:2015
– 4 – IEC 61760-4:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SURFACE MOUNTING TECHNOLOGY –

Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1244FDIS 91/1259/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61760, published under the general title Surface mounting
technology, can be found on the IEC website.

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SIST EN 61760-4:2015
IEC 61760-4:2015 © IEC 2015 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 61760-4:2015
– 6 – IEC 61760-4:2015 © IEC 2015
INTRODUCTION
Due to the higher temperature profiles of reflow soldering processes using tin-silver-copper
alloys or other lead-free solder alloys with higher melting temperatures than Sn-Pb eutectic
solder, the sensitivity of components against soldering heat, when being exposed to moisture
before soldering, becomes an increasingly important factor.
The currently existing standards describing the moisture sensitivity classification of devices
are applicable for plastic encapsulated semiconductors and similar solid state packages (e.g.
IEC 60749-20), but not for other types of components.
This part of IEC 61760 also extends the classification and packaging methods as described in
J-STD-020 and J-STD-033. It is intended to be used for such type of components, where
J-STD-020 and J-STD-033 are not required or not appropriate.

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SIST EN 61760-4:2015
IEC 61760-4:2015 © IEC 2015 – 7 –
SURFACE MOUNTING TECHNOLOGY –

Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices



1 Scope
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture
sensitivity levels related to soldering heat, and provisions for packaging, labelling and
handling.
This part of IEC 61760 extends the classification and packaging methods to such components,
where currently existing standards are not required or not appropriate. For such cases this
standard introduces additional moisture sensitivity levels and an alternative method for
packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices,
including specific through-hole devices (where the device supplier has specifically
documented support for reflow soldering), but not to
• semiconductor devices,
• devices for flow (wave) soldering.
NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD-
020 and J-STD-033, are described in the INTRODUCTION.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions
of surface mounting devices (SMD) – Application guide
IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-
hermetic Solid State Surface Mount Devices
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

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SIST EN 61760-4:2015
– 8 – IEC 61760-4:2015 © IEC 2015
3.1
moisture sensitive device
MSD
device, where during soldering the evaporation of absorbed moisture is likely to deteriorate its
electrical or mechanical performance compared to what is given in the relevant specification
Note 1 to entry: This note applies to the French language only.
3.2
moisture sensitivity level
MSL
rating indicating a device’s susceptibility to damage due to absorbed moisture when subjected
to reflow soldering
Note 1 to entry: This note applies to the French language only.
3.3
moisture barrier bag
MBB
bag designed to restrict the transmission of water vapour and used to pack moisture sensitive
devices
Note 1 to entry: This note applies to the French language only.
3.4
manufacturer’s exposure time
MET
maximum time after baking that the component manufacturer requires to process components
prior to sealing of the bag
Note 1 to entry: The manufacturer’s exposure time also includes the maximum time allowed at the distributor in
order to keep the bag open to split up its content into smaller shipments.
Note 2 to entry: This note applies to the French language only.
3.5
floor life
allowable time for a device or semi-finished assembly to be exposed to normal room
environment humidity and temperature after removal from a moisture barrier bag or storage
chamber and before a solder reflow process
3.6
shelf life
recommendation of time that products can be stored in the original packaging, during which
the defined quality of the goods remains acceptable under specified conditions of
transportation, storage and handling
3.7
active desiccant
absorbent material used to maintain a low relative humidity
3.8
unit of desiccant
amount of active desiccant that will absorb a minimum of 2,85 g of water vapour at 25 °C and
a relative humidity of 20 % within 24 h
3.9
moisture indicating desiccant
desiccant whose colour (hue) changes perceptibly, when a certain relative humidity is
exceeded

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SIST EN 61760-4:2015
IEC 61760-4:2015 © IEC 2015 – 9 –
Note 1 to entry: Typically a colour change due to a moisture indicating desiccant is from blue to pink, when the
change from dry state to wet state is detected.
3.10
humidity indicator card
HIC
card on which a moisture sensitive chemical is printed such that it changes colour from dry to
wet when the indicated relative humidity is exceeded
Note 1 to entry: This note applies to the French language only.
3.11
water vapour transmission rate
WVTR
measure of the permeability of a plastic film material to moisture, used to specify a moisture
barrier bag for dry packing
Note 1 to entry: This note applies to the French language only.
4 General information
4.1 Moisture sensitive devices
Certain materials, plastic polymers and fillers are hygroscopic and can absorb moisture
dependent on time and the storage environment. Absorbed moisture will vaporize during rapid
heating in the solder reflow process, generating
• pressure in the material,
• deformation,
• swelling,
• delamination,
• cracking,
• degradation of inner connection.
The penetration of moisture into the absorbing material is generally caused through exposure
to the ambient air. Moisture absorption or moisture penetrating into cavities can lead to
moisture concentrations in the device which are high enough to cause cracking and/or
delamination to the device during the soldering process (e.g. “popcorn phenomenon”), which
may adversely affect reliability.
NOTE “Popcorn phenomenon”: internal stress causes the package to bulge and then crack with an audible “pop”.
Moisture can also influence the bonding strength of adhesives, sealings, encapsulants,
plastics with galvanic coating, etc.
Moisture exposure also can induce the transport of ionic contaminations into the device,
thereby increasing the potential for circuit failure due to corrosion.
Hence it is necessary to dry moisture-sensitive devices, to seal them in a moisture barrier bag
and only to remove them immediately prior to soldering onto the PCB. The permissi
...