SIST EN 60749-1:2004
(Main)Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 1: Allgemeines
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 1: Généralités
Applicable aux dispositifs à semiconducteurs (dispositifs discrets et circuits intégrés)et établit des dispositions communes à toutes les autres parties de la série.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002)
General Information
- Status
- Published
- Publication Date
- 30-Jun-2004
- Technical Committee
- I11 - Imaginarni 11
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 01-Jul-2004
- Due Date
- 01-Jul-2004
- Completion Date
- 01-Jul-2004
Relations
- Effective Date
- 07-Jun-2022
- Effective Date
- 13-May-2010
Overview
Standard reference: EN 60749-1:2003 (CLC/CENELEC adoption of IEC 60749-1:2002)
EN 60749-1:2003 establishes the general provisions that apply across the EN/IEC 60749 series for mechanical and climatic test methods of semiconductor devices. It is applicable to both discrete devices and integrated circuits and defines the framework, terminology and test conditions that are common to the individual test-method parts (EN 60749-2, EN 60749-3, etc.). This part is intended to ensure consistent, repeatable approaches to environmental testing, measurement and reporting across device categories and procurement specifications.
Key Topics
- Scope and applicability: Defines the series' common provisions and clarifies that specific procurement specifications take precedence in case of conflict.
- Standard atmospheric conditions: Specifies general test conditions and measurement environments. Typical ranges called out include:
- Test temperature: 15 °C to 35 °C (general testing)
- Measurement temperature: 25 °C ± 5 °C (electrical measurements)
- Relative humidity: 45 % to 75 % where appropriate
- Air pressure: 86 kPa to 106 kPa
- Electrical measurements: Guidance on when initial, monitored and final measurements are required, referencing acceptance and reliability clauses in the relevant IEC 60747/60748 parts.
- Use of defective specimens: Permits use of electrically defective devices for certain mechanical tests (for example, solderability or lead fatigue) where electrical functionality is not required to assess the mechanical property.
- Series structure and maintenance: Each test method in the 60749 series is a stand-alone document (sequentially numbered). Individual parts can be updated independently; annex ZA is normative in the EN edition.
Applications
EN 60749-1:2003 is useful for:
- Manufacturers defining consistent reliability testing programs for semiconductor components.
- Test laboratories implementing environmental, mechanical and climatic test set-ups that must conform to European/IEC practice.
- Procurement teams and quality engineers who need a common baseline for acceptance criteria, reporting and contract compliance.
Benefits include improved repeatability of test results, clearer measurement conditions for electrical testing, and harmonized reporting across device families.
Related Standards
- IEC 60749 series / EN 60749-xx: Individual test methods (e.g., vibration, shock, solderability, rapid change of temperature) referenced by clause and part number.
- IEC 60747 series: Semiconductor devices – discrete devices (device-specific acceptance and reliability clauses).
- IEC 60748 series: Semiconductor devices – integrated circuits.
- IEC 60050: International Electrotechnical Vocabulary (terms and definitions).
For procurement and detailed test procedures, consult the relevant EN/IEC 60749 part (EN 60749-2, -3, etc.) and the device-specific acceptance and reliability clauses in IEC 60747/60748.
Frequently Asked Questions
SIST EN 60749-1:2004 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor devices - Mechanical and climatic test methods -- Part 1: General". This standard covers: Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.
Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.
SIST EN 60749-1:2004 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 60749-1:2004 has the following relationships with other standards: It is inter standard links to SIST EN 60749:2002 + A1:2002, SIST EN 60749:2002 + A1:2002. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase SIST EN 60749-1:2004 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of SIST standards.
Standards Content (Sample)
SLOVENSKI SIST EN 60749-1:2004
STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
(IEC 60749-1:2002)
ICS 31.080.01 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 60749-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2003
ICS 31.080.01 Supersedes EN 60749:1999 + A1:2000 + A2:2001
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 1: General
(IEC 60749-1:2002)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische Prüfverfahren
et climatiques Teil 1: Allgemeines
Partie 1: Généralités (IEC 60749-1:2002)
(CEI 60749-1:2002)
This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-1:2003 E
Foreword
The text of document 47/1638/FDIS, future edition 1 of IEC 60749-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-1 on 2002-09-24.
This European Standard, together with the other parts of the series EN 60749, supersedes
EN 60749:1999 + A1:2000 + A2:2001, in which the test methods were contained in one standard
which was subdivided into chapters relating to mechanical test methods, climatic test methods and
miscellaneous test methods.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Each test method governed by this standard and which is part of the series is a stand-alone
document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no grouping of
test methods). The list of these tests will be available in the CENELEC internet site and in the
catalogue.
Updating of any of the individual test methods is independent of any other part.
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-1:2002 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-1:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical - -
Vocabulary (IEV)
IEC 60747 Series Semiconductor devices - Discrete EN 60747 Series
devices
IEC 60748 Series Semiconductor devices - Integrated - -
circuits
NORME CEI
INTERNATIONALE IEC
60749-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 1:
Généralités
Semiconductor devices –
Mechanical and climatic test methods –
Part 1:
General
IEC 2002 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
H
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
60749-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD . 5
INTRODUCTION .9
1 Scope .11
2 Normative references.11
3 Terms, definitions and letter symbols.11
4 Standard atmospheric conditions .11
5 Electrical measurements.13
6 Use of electrically defective devices .13
60749-1 © IEC:2002 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 1: General
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as
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