Name: SIST EN 60191-4:2002
Brand: SIST
SKU: bd9c72c7-3ee7-433c-9a42-1372f918ceac
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Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

Mechanische Normung von Halbleiterbauelementen -- Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs -- Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteurs

Donne des recommandations pour la désignation des boîtiers et pour la classification en formes des boîtiers pour les dispositifs à semiconducteurs.

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)

General Information

Status: Withdrawn
Publication Date: 31-Aug-2002
Withdrawal Date: 02-Mar-2026

ICS: 31.080.01 - Semiconductor devices in general
: 31.240 - Mechanical structures for electronic equipment

Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields

Current Stage: 9900 - Withdrawal (Adopted Project)
Start Date: 02-Mar-2026
Due Date: 25-Mar-2026
Completion Date: 03-Mar-2026

Ref Project: EN 60191-4:1999 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Relations

Replaced By: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Effective Date: 07-Jun-2011

Referred By: SIST EN 60191-6-21:2010 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-6:2005 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-3:2002 - Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits
Effective Date: 03-Feb-2026

Referred By: SIST EN 60747-15:2004 - Discrete semiconductor devices -- Part 15: Isolated power semiconductor devices
Effective Date: 03-Feb-2026

Referred By: SIST EN 61360-1:2003/A1:2004 - Standard data element types with associated classification scheme for electric components -- Part 1: Definitions - Principles and methods
Effective Date: 03-Feb-2026

Referred By: SIST EN 60068-2-6:2001 - Environmental testing -- Part 2: Tests - Test Fc: Vibration (sinusoidal)
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-6-16:2008 - Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-6-12:2011 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Effective Date: 03-Feb-2026

Referred By: SIST EN 61360-4:2006 - Standard data element types with associated classification scheme for electric components -- Part 4: IEC reference collection of standard data element types and component classes
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-1:2008 - Mechanical standardization of semiconductor devices -- Part 1: General rules for the preparation of outline drawings of discrete devices
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-6:2010 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
Effective Date: 03-Feb-2026

Referred By: SIST EN 60191-6-20:2010 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
Effective Date: 03-Feb-2026

Referred By: SIST EN 62258-1:2007 - Semiconductor die products -- Part 1: Requirements for procurement and use
Effective Date: 03-Feb-2026

Amended By: SIST EN 60191-4:2002/A1:2005 - Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Effective Date: 21-Sep-2010

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SIST EN 60191-4:2002

English language (22 pages)

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Frequently Asked Questions

What is SIST EN 60191-4:2002?

SIST EN 60191-4:2002 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages". This standard covers: Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

What is the scope of SIST EN 60191-4:2002?

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

What ICS categories does SIST EN 60191-4:2002 belong to?

SIST EN 60191-4:2002 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general; 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.

What standards are related to SIST EN 60191-4:2002?

SIST EN 60191-4:2002 has the following relationships with other standards: It is inter standard links to SIST EN 60191-4:2014, SIST EN 60191-6-21:2010, SIST EN 60191-6:2005, SIST EN 60191-3:2002, SIST EN 60747-15:2004, SIST EN 61360-1:2003/A1:2004, SIST EN 60068-2-6:2001, SIST EN 60191-6-16:2008, SIST EN 60191-6-12:2011, SIST EN 61360-4:2006, SIST EN 60191-1:2008, SIST EN 60191-6:2010, SIST EN 60191-6-20:2010, SIST EN 62258-1:2007, SIST EN 60191-4:2002/A1:2005. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

How can I access SIST EN 60191-4:2002?

SIST EN 60191-4:2002 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)

SIST EN 60191-4:2002

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package (IEC 60191-4:1999)Mechanische Normung von Halbleiterbauelementen -- Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für HalbleiterbauelementeNormalisation mécanique des dispositifs à semiconducteurs -- Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteursMechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages31.240Mehanske konstrukcije za elektronsko
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