SIST EN 60191-6-6:2002

Overview

EN 60191-6-6:2001 (adopted by CLC; identical to IEC 60191-6-6:2001) is a mechanical standardization document and design guide for fine pitch land grid array (FLGA) packages. It provides common outline drawings and dimensional rules for surface-mounted semiconductor device packages whose terminal pitch is ≤ 0.80 mm and whose package body outline is square. The standard defines how outline drawings should be prepared so designers, manufacturers and PCB engineers share a consistent geometric reference for FLGA footprints.

Key Topics

• Scope and applicability: FLGA packages with square body outlines and terminal pitch less than or equal to 0.80 mm.
• Outline drawing conventions: Standardized views, symbols and annotation rules for package outlines to ensure consistent mechanical documentation.
• Dimensional references: Common dimensions and reference points used for defining package body, land patterns and terminal locations (as applicable to FLGA scope).
• Material and structure neutrality: Guidance applies to all types of package structures and composed materials within the FLGA definition.
• Interoperability focus: Emphasis on producing drawings that support cross-supplier compatibility, CAD libraries, and automated manufacturing processes.

Applications

• Package design and development: Semiconductor package engineers use the standard as a design guide to produce compliant FLGA outlines.
• PCB footprint creation: PCB designers and CAD librarians rely on the standardized outline drawings to create reliable land patterns for surface mount assembly.
• Manufacturing and assembly: SMT process engineers and contract manufacturers use the drawings to set up pick-and-place, solder paste application and inspection criteria.
• Quality, testing and procurement: Test engineers, QA teams and purchasing departments reference the standard to verify mechanical compatibility between component suppliers and board designs.
• Cross-vendor interoperability: Enables consistent mechanical interfaces across multiple suppliers, reducing rework and design iteration.

Benefits (practical value)

• Reduces ambiguity in package outlines and footprint interpretation.
• Speeds up PCB layout and component library creation.
• Improves first-pass yield in assembly by aligning mechanical tolerances and documentation.
• Facilitates international compliance by referencing a harmonized EN/IEC standard.

Related Standards

• IEC/EN 60191 series (general mechanical standardization for semiconductor devices) - EN 60191-6-6 aligns specifically with IEC 60191-6-6:2001.
• Other parts of the 60191 series cover outline drawing rules for different package families and pitches (consult the IEC/EN catalogue for applicable parts).

Keywords: FLGA, fine pitch land grid array, surface-mounted semiconductor device packages, outline drawings, mechanical standardization, terminal pitch ≤ 0.80 mm, design guide, land grid array (LGA), SMD footprints.