SIST EN 60191-4:2014

SLOVENSKI STANDARD
01-maj-2014
1DGRPHãþD
SIST EN 60191-4:2002
SIST EN 60191-4:2002/A1:2005
SIST EN 60191-4:2002/A2:2005
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni
sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)
Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de
codification et classification en formes des boîtiers pour dispositifs à semiconducteurs
Ta slovenski standard je istoveten z: EN 60191-4:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60191-4
NORME EUROPÉENNE
March 2014
EUROPÄISCHE NORM
ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002

English version
Mechanical standardization of semiconductor devices -
Part 4: Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013)
Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 4: Système de codification et Teil 4: Codierungssystem für Gehäuse
classification en formes des boîtiers pour und Eingruppierung der Gehäuse nach
dispositifs à semiconducteurs der Gehäuseform für
(CEI 60191-4:2013) Halbleiterbauelemente
(IEC 60191-4:2013)
This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-4:2014 E
Foreword
The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D,
Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-
CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014.
The following dates were fixed:
– latest date by which the EN has to be implemented (dop) 2014-09-21
at national level by publication of an identical
national standard or by endorsement
– latest date by which the national standards conflicting (dow) 2016-11-14
with the EN have to be withdrawn
This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and A2:2002.
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European
Standard without any modification.

IEC 60191-4 ®
Edition 3.0 2013-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –

Part 4: Coding system and classification into forms of package outlines for

semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 4: Système de codification et classification en formes des structures des

boîtiers pour dispositifs à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080 ISBN 978-2-8322-1155-7

– 2 – 60191-4  IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Coding system of package outlines for semiconductor devices . 5
3 Classification into forms of package outlines for semiconductor devices . 5
4 Coding system for semiconductor-device packages . 6
4.1 General . 6
4.2 New descriptive codes . 6
4.3 Descriptive designators . 6
4.3.1 General remarks . 6
4.3.2 Minimum descriptive designator . 6
4.3.3 Terminal-position prefix. 8
4.3.4 Package-body-material prefix . 8
4.3.5 Package-specific feature prefix . 9
4.3.6 Lead-form and terminal-count suffixes . 9
4.3.7 Detailed information field . 11
5 Coding system of package-outline styles . 12
Annex A (informative) Examples of descriptive coding system application . 15
Annex B (informative) Derivation and application of the descriptive coding system –
Common package names . 22

Figure 1 – Descriptive coding for semiconductor device packages . 7
Figure 2 – Relationship of codes to profile . 10
Figure A.1 – Typical package styles and descriptive coding system (1 of 4) . 17
Figure A.2 – Examples of lead forms (or terminal shapes) . 21
Figure B.1 – Descriptive coding system for common name of semiconductor-device
package . 22

Table 1 – Package-outline-style codes. 8
Table 2 – Terminal-position prefixes . 9
Table 3 – Prefixes for predominant package-body material . 10
Table 4 – Prefixes for package-specific features . 10
Table 5 – Suffixes for lead form (or terminal shape) . 12
Table A.1 – Descriptive coding system application . 16
Table B.1 – Basic package code and names . 23
Table B.2 – Common package name and descriptive code examples . 24

60191-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-4 has been prepared by subcommittee 47D: Semiconductor
devices packaging, of IEC technical committee 47: Semiconductor devices.
This third edition cancels and replaces the second edition published in 1999,
Amendment 1:2001 and Amendment 2:2002.This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

– 4 – 60191-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
47D/837/FDIS 47D/848/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, published under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

60191-4  IEC:2013 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages

1 Scope
This part of IEC 60191 specifies a method for the designation of package outlines and for the
classification of forms of package outlines for semiconductor devices and a systematic method
for generating universal descriptive designators for semiconductor device packages.
The descriptive designator provides a useful communication tool but has no implied control for
assuring package interchangeability.
2 Coding system of package outlines for semiconductor devices
The following coding system will be used in the publications concerning mechanical
standardization:
– first: a three-digit serial number (000 to 999);
– second: a single reference letter indicating the form as shown in Table 1;
– third: a two-digit serial number (00 to 99) to indicate a variant of an outline drawing.
The use of prefix P to indicate a provisional drawing remains unchanged.
Examples
– 101A00
– 050G13
– P 101F01
3 Classification into forms of package outlines for semiconductor devices
The package outline drawings for semiconductor devices are classified into forms according to
the following scheme:
– form A: single-ended
– form B: heat-sink-mounted
– form C: stud-mounted
– form D: axial-leaded
– form E: surface-mounted
– form F: single-ended, heat-sink-mounted
– form G: dual and quad in-line
– form H: axial lead-less.
– 6 – 60191-4  IEC:2013
4 Coding system for semiconductor-device packages
4.1 General
The standard coding system is a method for identifying the physical features of an electronic
device package family. The system is predicated upon a minimum two-character designator,
which indicates the package outline style. This designator can be extended, through the use of
optional, user-selected fields, to provide additional package information such as terminal
position and count, terminal form, package shape, and predominant body material.
4.2 New descriptive codes
If a new package that does not conform to one of the designated field character codes is being
proposed, a new code may be recommended for standardization.
4.3 Descriptive designators
4.3.1 General remarks
The package outline style code is the only compulsory field within this descriptive designation
system. Additional information may be provided using optional prefixes and suffixes described
by the system. In general, these fields are independent of one another. Unless otherwise
indicated herein, the users of this system may pick and choose which of these fields they wish
to implement for their specific application (see Figure 1). The descriptive designator may be
extended with additional information, provided this information is separated from the
descriptive designator by a slash (/) (see 4.3.7).
NOTE Basic package codes and names are presented in Table B.1.
4.3.2 Minimum descriptive designator
The minimum descriptive designator is a two-letter code that classifies device packages into
standard package outline styles. These styles identify general external physical features.
Common two-letter descriptive codes or abbreviations are included, such as CC, FP, SO, GA.
Figure A.1 shows two-letter codes for various device package outline styles and depicts
examples of each. Table 1 lists the two-letter package-outline-style codes described in
Clause 5.
60191-4  IEC:2013 – 7 –
Optional unless Minimum
Optional – Optional material prefix descriptive – Optional Optional
designator designator
P – S Q C C – J 3 2
Material Features Position Package Form Count

Terminal count
(4.3.6.1, 4.3.6.2)
A one-, two-, or
three-digit suffix
Lead form
(4.3.6.1, 4.3.6.2,
Table 5, Figure A.2)
A single-letter suffix
Package outline style
(4.3.2, Table 1, Figure A.1)
A double-letter designator
Terminal position
(4.3.3, Table 2)
A single-letter prefix
Package-specific features
(4.3.5, Table 4)
A single-letter or multi-
letter prefix
Package-body material
(4.3.4, Table 3)
A single-letter prefix
IEC  2560/13
Figure 1 – Descriptive coding for semiconductor device packages

– 8 – 60191-4  IEC:2013
Table 1 – Package-outline-style codes
Form Code Outline style
E CC Chip-carrier package
B CP Clamped package (press-pack)
A CY Cylinder or can package
D/E DB Disk-button package
F FM Flange-mount package
A FO Fibre optic device package
E FP Flatpack package
G GA Grid-array package
G IL In-line package. The preferred designator is IP.
G IP
In-line package or inserted package. Restrict to DIP/SIP/ZIP.
D/H LF Long-form horizontal package
MA Microelectronic assembly
B MP Power module package
MW Microwave package
B PF Press-fit package
C PM Post-(stud-) mount package
E SO* Small-outline package
A SS Special-shape package
UC Uncased chip
VP Vertical surface-mount package
XA-XZ Non-defined family; vendor or user option
* Industry practice sometimes uses "P" for "package" in the location normally occupied by this field (except that
there is no preceding hyphen), for example SOP.

4.3.3 Terminal-position prefix
The two-letter, package-outline-style code may be supplemented with a single-letter prefix that
identifies the physical terminal positions or, if applicable, the interconnect land pattern.
Examples of three-letter designators include common acronyms or abbreviations, such as DIP,
LCC (QCC preferred), PGA, QFP, SIP, ZIP.
NOTE 1 A terminal is defined as an externally available point of connection.
NOTE 2 The proper terminal-position prefix is determined by the interconnect land structure. For example, the
code for a single row of terminals formed into a staggered configuration would be "Z".
Table 2 gives a list of one-letter, terminal-position prefix codes.
4.3.4 Package-body-material prefix
The three-letter descriptive designator (see 4.3.2) may be further supplemented by a single-
letter prefix that identifies the predominant package-body material. This prefix shall not be
used unless the terminal-position prefix described in 4.3.2 is also used. Examples of such four-
letter descriptive designators include common acronyms or abbreviations, such as CDIP, PDIP,
PLCC (PQCC preferred), MELF, PQFP.
Table 3 gives a list of one-letter package-body-material prefix codes.

60191-4  IEC:2013 – 9 –
If the package-body material is other than one of those defined in Table 3, the letter "X" shall
be used within the descriptive designator to signify a special or new material and shall later be
replaced with an IEC-approved code.
4.3.5 Package-specific feature prefix
Package-specific features may be described through the use of a multiletter prefix. The
package-specific feature prefix shall be set off from the following portion of the descriptive
designator by a dash (–).
Table 4 gives a list of package-specific feature prefix codes. Figure 2 shows the relationship of
codes to profile and pitch.
4.3.6 Lead-form and terminal-count suffixes
4.3.6.1 General lead-form and number of terminals
The general lead form (or terminal shape) and/or the number of terminals on a package may
be described through the use of two fields, the lead-form suffix and the terminal-count suffix.
These two fields shall be set off from the preceding portion of the descriptive designator by a
dash (–).
Users of this system may choose to use the lead-form suffix, or the terminal-count suffix, or
both. If the lead-
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