SIST EN 62258-5:2007
(Main)Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation
Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation
Specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Halbleiter-Chip-Erzeugnisse - Teil 5: Anforderungen für Angaben hinsichtlich der elektrischen Simulation
Produits à puce de semi-conducteur -- Partie 5: Exigences pour l'information concernant la simulation électrique
La CEI 62258-5:2006 a été élaborée afin de faciliter la production, la fourniture et l'utilisation des produits de puce de semiconducteurs, comprenant:
- les plaquettes;
- la puce nue séparée;
- les puces et les plaquettes avec des structures de connexion fixées;
- les puces et les plaquettes à encapsulation minimale ou partielle.
La présente partie de la CEI 62258 spécifie les informations requises pour faciliter l'utilisation des données et des modèles de simulation du comportement électrique et la vérification de la fonctionnalité correcte des systèmes électroniques qui comprennent les puces à semi-conducteurs nues, avec ou sans structures de connexion, et/ou les puces à semi-conducteurs à emballage minimal. Elle est destinée à venir en aide à toutes les personnes impliquées dans la chaîne d'approvisionnement des dispositifs de puce afin de se conformer aux exigences de la CEI 62258-1 et de la CEI 62258-2.
Cette publication doit être lue conjointement avec la CEI 62258-1:2009 et la CEI 62258-2:2011.
Izdelki iz polprevodniških čipov - 5. del: Zahteve za informacije v zvezi z električno simulacijo (IEC 62258-5:2006)
General Information
Relations
Overview - EN 62258-5:2006 (IEC 62258-5:2006)
EN 62258-5:2006, published by CLC / IEC, defines the requirements for information concerning electrical simulation of semiconductor die products. It covers wafers, singulated bare die, die with connection structures and minimally packaged die. The standard specifies what electrical data and simulation models suppliers must provide to enable accurate simulation of device behaviour and verification of system functionality. EN 62258-5 is intended to be used together with IEC/EN 62258‑1 (procurement and use) and IEC/EN 62258‑2 (exchange data formats).
Key topics and technical requirements
EN 62258-5 lists the information that should accompany any electrical simulation model. Key elements include:
- Model metadata
- Model file name and creation date
- Model description and scope (including limitations)
- Model source / originator
- Simulator compatibility
- Supported simulation program(s) and specific program versions
- Compliance level (e.g., SPICE level or equivalent)
- Device connectivity and terminal data
- Pad capacitance and node references
- Input/output buffer electrical models and compliance level
- ESD protection description and any ESD models
- Timing simulation
- Timing/behavioural models for time-based verification (e.g., VITAL, Verilog or other waveform/vector formats where applicable)
- Connection redistribution and package terminal parameters
- Redistribution trace resistance, capacitance and inductance (self and mutual), preferably in matrix form and with tolerances
- Electrical parameters for bumps, balls, bond‑wires or other alternate terminals
- Supporting information
- Annex A provides informative guidance on using electrical simulation models
Practical applications and intended users
EN 62258-5 supports practical tasks across the semiconductor supply chain:
- Who uses it
- die suppliers and manufacturers
- IC designers and verification engineers
- PCB/system integrators and signal integrity engineers
- Test engineers and procurement teams
- Typical applications
- Signal propagation and signal-integrity analysis
- Functional verification of systems containing bare or minimally packaged die
- Timing verification and timing closure
- Testability and manufacturing test planning
- Exchanging simulation-ready models between suppliers and customers
Related standards
- IEC/EN 62258-1 - Requirements for procurement and use
- IEC/EN 62258-2 - Exchange data formats
By standardizing the required model data and metadata, EN 62258-5 improves interoperability of simulation models (SPICE, IBIS, VHDL/Verilog timing, etc.), reduces integration risk and speeds system-level verification when using semiconductor die products.
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EUROPEAN STANDARD
EN 62258-5
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes ES 59008-4-4:1999
English version
Semiconductor die products
Part 5: Requirements for information
concerning electrical simulation
(IEC 62258-5:2006)
Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 5: Exigences pour l'information Teil 5: Anforderungen für Angaben
concernant la simulation électrique hinsichtlich der elektrischen Simulation
(CEI 62258-5:2006) (IEC 62258-5:2006)
This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-5:2006 E
Foreword
The text of document 47/1869/FDIS, future edition 1 of IEC 62258-5, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-5 on 2006-09-01.
This standard is to be used in conjunction with EN 62258-1 and EN 62258-2.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
(dow) 2009-09-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-5:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 61691-2 NOTE Harmonized as EN 61691-2:2001 (not modified).
IEC 62014-1 NOTE Harmonized as EN 62014-1:2002 (not modified).
__________
- 3 - EN 62258-5:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 62258-1 - Semiconductor die products EN 62258-1 2005
Part 1: Requirements for procurement and
use
1) 2)
IEC 62258-2 - Semiconductor die products EN 62258-2 2005
Part 2: Exchange data formats
1)
Undated reference.
2)
Valid edition at date of issue.
INTERNATIONAL IEC
STANDARD 62258-5
First edition
2006-08
Semiconductor die products –
Part 5:
Requirements for information
concerning electrical simulation
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale M
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 62258-5 IEC:2006(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references.6
3 Terms and definitions.6
4 General .6
5 Requirements for information on electrical simulation models.7
5.1 Information on the electrical simulation model.7
5.2 Information on device connectivity .8
5.3 Information on the timing simulation model .8
5.4 Information on connection redistribution.8
5.5 Information on package terminals .9
Annex A (informative) Supporting information .10
Bibliography .12
62258-5 IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 5: Requirements for information
concerning electrical simulation
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62258-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard should be read in conjunction with IEC 62258-1 and IEC 62258-2.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1869/FDIS 47/1882/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62258-5 IEC:2006(E)
The structure of IEC 62258, as currently conceived, consists of the following parts under the
general title Semiconductor die products:
Part 1: Requirements for procurement and use
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage (Technical
Report)
Part 4: Questionnaire for die users and suppliers (Technical Report) (in preparation)
Part 5: Requirements for information concerning electrical simulation
Part 6: Requirements for information concerning thermal simulation
Part 7: XML schema for data exchange (Technical Report) (in preparation)
Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
62258-5 IEC:2006(E) – 5 –
INTRODUCTION
th
This standard is based on the work carried out in the ESPRIT 4 Framework project GOODDIE
which resulted in the publication of the ES 59008 series of European specifications.
Organisations that helped prepare this part of IEC 62258 includes the ESPRIT ENCAST
project, the Die Products Consortium, JEITA, JEDE
...
Frequently Asked Questions
SIST EN 62258-5:2007 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation". This standard covers: Specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
SIST EN 62258-5:2007 is classified under the following ICS (International Classification for Standards) categories: 31.080.99 - Other semiconductor devices; 31.200 - Integrated circuits. Microelectronics. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 62258-5:2007 has the following relationships with other standards: It is inter standard links to SIST-TS ES 59008-4-4:2007. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase SIST EN 62258-5:2007 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of SIST standards.
본 기사는 SIST EN 62258-5:2007 표준에 대해 논의하고 있으며, 반도체 다이 제품의 전기 시뮬레이션 정보에 관련된 요구 사항을 기술하고 있습니다. 이 표준은 웨이퍼, 개별적인 베어 다이, 연결 구조물이 부착된 다이 및 웨이퍼, 부분적으로 캡슐화된 다이 등을 포함한 반도체 다이 제품의 생산, 공급 및 사용을 용이하게 하기 위해 개발되었습니다. 이 표준은 맨 둘레의 전기적인 연결 구조물을 포함한 베어 반도체 다이와/또는 최소한으로 포장된 반도체 다이가 포함된 전자 시스템의 열 특성을 시뮬레이션하고 올바른 기능을 확인하기 위해 필요한 정보를 결정합니다. 이 표준은 다이 장치 공급망에 관여하는 모든 이해관계자가 IEC 62258-1 및 IEC 62258-2의 요구 사항을 준수하는 데 도움을 주기 위해 개발되었습니다.
The article discusses the SIST EN 62258-5:2007 standard, which outlines requirements for information concerning electrical simulation of semiconductor die products. The standard aims to facilitate the production, supply, and use of various types of semiconductor die products, including wafers, singulated bare die, and die with attached connection structures. It specifies the information needed to simulate the thermal behavior and ensure the proper functioning of electronic systems that incorporate these die products. The standard is designed to help stakeholders in the die device supply chain comply with the requirements set forth in IEC 62258-1 and IEC 62258-2.
この記事は、SIST EN 62258-5:2007規格について議論し、半導体ダイ製品の電気シミュレーションに関する要件を説明しています。この規格は、ウェハ、個別のベアダイ、接続構造が付いたダイやウェハ、部分的にカプセル化されたダイなどの半導体ダイ製品の生産、供給、使用を容易にするために開発されました。この規格は、電気的な接続構造を持つベア半導体ダイや、最小限にパッケージ化された半導体ダイを含む電子システムの熱特性のシミュレーションや正しい機能の検証に必要な情報を特定します。この規格は、ダイデバイスのサプライチェーンに関与するすべての関係者がIEC 62258-1およびIEC 62258-2の要件を遵守するのに役立つことを意図しています。
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