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EUROPEAN STANDARD
EN 60749-35
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 35: Acoustic microscopy for plastic encapsulated
electronic components
(IEC 60749-35:2006)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 35: Microscopie acoustique Teil 35: Ultraschallmikroskopie
pour composants électroniques für kunststoffverkappte Bauelemente
à boîtier plastique der Elektronik
(CEI 60749-35:2006) (IEC 60749-35:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-35:2006 E
Foreword
The text of document 47/1863/FDIS, future edition 1 of IEC 60749-35, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-35 on 2006-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
__________
Endorsement notice
The text of the International Standard IEC 60749-35:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60749-20 NOTE  Harmonized as EN 60749-20:2003 (not modified).
__________
NORME CEI
INTERNATIONALE
IEC
60749-35
INTERNATIONAL
Première édition
STANDARD
First edition
2006-07
Dispositifs à semiconducteurs – Méthodes
d’essais mécaniques et climatiques –
Partie 35:
Microscopie acoustique pour composants
électroniques à boîtier plastique

Semiconductor devices – Mechanical and
climatic test methods –
Part 35:
Acoustic microscopy for plastic encapsulated
electronic components
 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

60749-35  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.11
2 Terms and definitions .11
3 Test apparatus .19
3.1 Reflective acoustic microscope system.19
3.2 Through transmission acoustic microscope system.19
3.3 Reference packages or standards .19
3.4 Sample holder .19
4 Procedure .21
4.1 General .21
4.2 Equipment setup .21
4.3 Performance of acoustic scans.21

Annex A (informative) Acoustic microscopy check sheet (example only – not a
mandatory template) .25
Annex B (informative) Potential image pitfalls .35
Annex C (informative) Some limitations of acoustic microscopy .37
Annex D (informative) Reference checklist for presenting applicable scanned data.39

Bibliography.43

Figure 1 – Example of A-mode display.11
Figure 2 – Example of B-mode display (bottom half of picture on left) .13
Figure 3 – Example of C-mode display.13
Figure 4 – Example of through transmission display.15
Figure 5 – Diagram of a reflective acoustic microscope system.17
Figure 6 – Diagram of a through transmission acoustic microscope system .17

60749-35  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 35: Acoustic microscopy for plastic encapsulated
electronic components
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-35 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition cancels and replaces IEC/PAS 62191 published in 2000, which was based on
a Joint (IPC/JEDEC) Industry Standard. This edition constitutes a technical revision.

60749-35  IEC:2006 – 7 –
The text of this standard is based on the following documents:
FDIS Report on voting
47/1863/FDIS 47/1877/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60749 consists of the following parts, under the general title Semiconductor devices –
Mechanical and climatic test methods:
Part 1: General
Part 2: Low air pressure
Part 3: External visual inspection
Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Part 5: Steady-state temperature humidity bias life test
Part 6: Storage at high temperature
Part 7: Internal moisture content measurement and the analysis of other residual gases
Part 8: Sealing
Part 9: Permanence of marking
Part 10: Mechanical shock
Part 11: Rapid change of temperature – Two-fluid-bath method
Part 12: Vibration, variable frequency
Part 13: Salt atmosphere
Part 14: Robustness of terminations
Part 15: Resistance to soldering temperature for through-hole mounted devices
Part 16: Particle impact noise detection (PIND)
Part 17: Neutron irradiation
Part 18: Ionizing radiation (total dose)
Part 19: Die shear strength
Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and
soldering heat
Part 21: Solderability
Part 22: Bond strength
Part 23: High temperature operating life
Part 24: Accelerated moisture resistance – Unbiased HAST
Part 25: Temperature cycling
Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)
Part 27: Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)

60749-35  IEC:2006 – 9 –
Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM)
(under consideration)
Part 29: Latch-up test
Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Part 31: Flammability of plastic-encapsulated devices (internally induced)
Part 32: Flammability of plastic-encapsulated devices (externally induced)
Part 33: Accelerated moisture resistance – Unbiased autoclave
Part 34: Power cycling
Part 35: Acoustic microscopy for plastic encapsulated electronic components
Part 36: Acceleration, steady state
Part 37: Board level drop test method of components for handheld electronic products (to
be published)
Part 38: Soft error rate testing of electronic components (under consideration)
Part 39: Measurement of moisture diffusivity and water solubility in organic materials used
for semiconductor components (to be published)
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60749-35  IEC:2006 – 11 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 35: Acoustic microscopy for plastic encapsulated
electronic components
1 Scope
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic
encapsulated electronic components. This standard provides a guide to the use of acoustic
microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.)
reproducibly and non-destructively in plastic packages.
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.1
A-mode
acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given
acoustic microscope
NOTE An A-mode display contains amplitude and phase/polarity information as a function of time of flight at a
single point in the X-Y plane. In this test method, A-mode is primarily used for focussing the acoustic microscope.
See Figure 1.
Time
IEC  1333/06
Figure 1 – Example of A-mode display
2.2
B-mode
acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic
microscope. A B-mode scan contains amplitude and phase/polarity information as a function
of time of flight at each point along the scan line
NOTE A B-mode scan furnishes a two-dimensional (cross-sectional) description along a scan line (X or Y). In this
test method B-mode is used to provide cross-sectional acoustic information. When scanned, B-mode can be used
to track the depth of a defect. See Figure 2.
Amplitude
60749-35  IEC:2006 – 13 –
C-mode
display
Line of
B-mode
scan
B-mode
display
IEC  1334/06
Figure 2 – Example of B-mode display (bottom half of picture on left)
2.3
back-side substrate view area
interface between the encapsulant and the back of the substrate within the outer edges of the
substrate surface (refer to Annex A, type IV)
2.4
C-mode
acoustic data collected in an X-Y plane at depth (Z) using a reflective acoustic microscope
NOTE 1 A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane. A C-
mode scan furnishes a two-dimensional (area) image of echoes arising from reflections at a particular depth (Z).
See Figure 3.
NOTE 2 C-mode is the preferred mode for scanning devices to determine compliance to the criteria of
IEC 60749-20.
IEC  1335/06
Figure 3 – Example of C-mode display

60749-35  IEC:2006 – 15 –
2.5
through transmission mode
acoustic data collected in an X-Y plane throughout the depth (Z) using a through transmission
acoustic microscope
NOTE A through transmission mode scan contains only amplitude information at each point in the scan plane. A
th
...