SIST EN ISO 11553-1:2020

SLOVENSKI STANDARD
01-junij-2020
Nadomešča:
SIST EN ISO 11553-1:2009
Varnost strojev - Laserski obdelovalni stroji - 1. del: Splošne varnostne zahteve
(ISO 11553-1:2020)
Safety of machinery - Laser processing machines - Part 1: General safety requirements
(ISO 11553-1:2020)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 1: Anforderungen an die
Sicherheit von Lasern (ISO 11553-1:2020)
Sécurité des machines - Machines à laser - Partie 1: Exigences de sécurité laser (ISO
11553-1:2020)
Ta slovenski standard je istoveten z: EN ISO 11553-1:2020
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EN ISO 11553-1
EUROPEAN STANDARD
NORME EUROPÉENNE
April 2020
EUROPÄISCHE NORM
ICS 13.110; 31.260 Supersedes EN ISO 11553-1:2008
English Version
Safety of machinery - Laser processing machines - Part 1:
Laser safety requirements (ISO 11553-1:2020)
Sécurité des machines - Machines à laser - Partie 1: Sicherheit von Maschinen -
Exigences de sécurité laser (ISO 11553-1:2020) Laserbearbeitungsmaschinen - Teil 1: Anforderungen
an die Sicherheit von Lasern (ISO 11553-1:2020)
This European Standard was approved by CEN on 13 January 2020.

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this
European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references
concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management
Centre has the same status as the official versions.

CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia,
Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway,
Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and
United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION

EUROPÄISCHES KOMITEE FÜR NORMUNG

CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 11553-1:2020 E
worldwide for CEN national Members.

Contents Page
European foreword . 3

European foreword
This document (EN ISO 11553-1:2020) has been prepared by Technical Committee ISO/TC 172 "Optics
and photonics" in collaboration with Technical Committee CEN/TC 123 “Lasers and photonics” the
secretariat of which is held by DIN.
This European Standard shall be given the status of a national standard, either by publication of an
identical text or by endorsement, at the latest by October 2020, and conflicting national standards shall
be withdrawn at the latest by October 2020.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN shall not be held responsible for identifying any or all such patent rights.
This document supersedes EN ISO 11553-1:2008.
This document has been prepared under a mandate given to CEN by the European Commission and the
European Free Trade Association, and supports essential requirements of EU Directive(s).
For the relationship with EU Directive(s) see informative Annex ZA, which is an integral part of this
document.
According to the CEN-CENELEC Internal Regulations, the national standards organizations of the
following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of
North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the
United Kingdom.
Endorsement notice
The text of ISO 11553-1:2020 has been approved by CEN as EN ISO 11553-1:2020 without any
modification.
Annex ZA
(informative)
Relationship between this European Standard and the essential
requirements of Directive 2006/42/EC aimed to be covered
This European Standard has been prepared under a Commission’s standardization request M/396
(Machinery) "Mandate to CEN and CENELEC for standardisation in the field of machinery" to provide
one voluntary means of conforming to essential requirement 1.5.12 of Directive 2006/42/EC of the
European Parliament and of the Council of 17 May 2006 on machinery, and amending Directive
95/16/EC (recast).
Once this standard is cited in the Official Journal of the European Union under that Directive,
compliance with the normative clauses of this standard given in Table ZA.1 confers, within the limits of
the scope of this standard, a presumption of conformity with the corresponding essential requirements
of that Directive, and associated EFTA regulations.
Table ZA.1 — Correspondence between this European Standard and Directive 2006/42/EC
Essential Requirements Clause(s)/sub-clause(s) Remarks/Notes
of Directive 2006/42/EC of this EN
1.5.12 Clause 5, 6, 7 and 8.
1.7.4.2, m,  Related to the aspect of
radiation and emission.
WARNING 1 — Presumption of conformity stays valid only as long as a reference to this
European Standard is maintained in the list published in the Official Journal of the European
Union. Users of this standard should consult frequently the latest list published in the Official
Journal of the European Union.
WARNING 2 — Other Union legislation may be applicable to the product(s) falling within the
scope of this standard.
INTERNATIONAL ISO
STANDARD 11553-1
Second edition
2020-04
Safety of machinery — Laser
processing machines —
Part 1:
Laser safety requirements
Sécurité des machines — Machines à laser —
Partie 1: Exigences de sécurité laser
Reference number
ISO 11553-1:2020(E)
©
ISO 2020
ISO 11553-1:2020(E)
© ISO 2020
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
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below or ISO’s member body in the country of the requester.
ISO copyright office
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Email: copyright@iso.org
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Published in Switzerland
ii © ISO 2020 – All rights reserved

ISO 11553-1:2020(E)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Hazards generated by laser radiation . 5
4.1 General . 5
4.2 Laser radiation hazards/sources of laser radiation emission . 6
4.3 Laser radiation hazards induced by external effects (interferences) . 7
4.4 Characteristics of laser radiation . 7
5 Safety requirements and measures . 8
5.1 General requirements . 8
5.2 Risk assessment with regard to laser radiation hazards . 8
5.3 Implementation of risk reduction measures. 9
5.3.1 General. 9
5.3.2 Safety measures against laser radiation hazards in dependence of the locations . 9
5.3.3 Safety measures against laser radiation hazards.10
5.3.4 Engineering control measures .13
6 Verification of the safety requirements and risk reduction measures .14
7 Information for use .15
8 Labelling .16
Annex A (informative) Potential hazards .18
Bibliography .21
ISO 11553-1:2020(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www .iso .org/ patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT) see www .iso .org/
iso/ foreword .html.
This document was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee
SC 9, Laser and electro-optical systems, in collaboration with IEC/TC 76, Optical radiation safety and laser
equipment.
This second edition cancels and replaces the first edition (ISO 11553-1:2005), which has been technically
revised with the following main changes:
— the terms "beam delivery systems", "beam path components", "beam shaping components", "beam
switching components" and "fibre optic cable" and "fibre connector" were added;
— the document was restructured;
— the Title was adapted;
— other hazards than laser radiation hazards are not considered in this document but are described
in Annex A;
— operating modes (automatic mode, setting mode, manual intervention mode, service mode) and the
operating mode selector switch were added;
— Clause 5 is separated in requirements regarding different locations and the different modes of
operation;
— in Clause 6 the verification procedures were described in more detail;
— Annex B was deleted.
A list of all the parts of ISO 11553 can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
iv © ISO 2020 – All rights reserved

ISO 11553-1:2020(E)
Introduction
The Machinery Safety Directive issued by the European Parliament and the Council of the EC outlines
essential and mandatory requirements that must be met in order to ensure that machinery is safe. In
response, CEN/CENELEC initiated a programme to produce safety standards for machines and their
applications. This document is one in that series.
It has been prepared as a harmonized standard to provide a means of conforming to the essential safety
requirements of the Machinery Directive and associated EFTA Regulations.
This document is a type B standard as stated in ISO 12100. The provisions of this document may be
supplemented or modified by a type C standard.
For machines which are covered by the scope of a type C standard and which have been designed and
built according to the provision of that standard, the provisions of that type C standard take precedence
over the provisions of this type B standard.
The purpose of this document is to prevent injuries to persons by
— listing potential laser radiation hazards generated by machines containing lasers,
— specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions,
— providing references to pertinent standards, and
— specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.
INTERNATIONAL STANDARD ISO 11553-1:2020(E)
Safety of machinery — Laser processing machines —
Part 1:
Laser safety requirements
1 Scope
This document describes laser radiation hazards arising in laser processing machines, as defined in 3.7.
It also specifies the safety requirements relating to laser radiation hazards, as well as the information
to be supplied by the manufacturers of such equipment (in addition to that prescribed by IEC 60825).
Requirements dealing with noise as a hazard from laser processing machines are included in
ISO 11553-3:2013.
This document is applicable to machines using laser radiation to process materials.
It is not applicable to laser products, or equipment containing such products, which are manufactured
solely and expressly for the following applications:
— photolithography;
— stereolithography;
— holography;
— medical applications (per IEC 60601-2-22);
— data storage.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 3864 (all parts), Graphical symbols — Safety colours and safety signs
ISO 11145:2018, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO 12100:2010, Safety of machinery — General principles for design — Risk assessment and risk reduction
ISO 13849-1:2015, Safety of machinery — Safety-related parts of control systems — Part 1: General
principles for design
ISO 13849-2:2012, Safety of machinery — Safety-related parts of control systems — Part 2: Validation
ISO 13850:2012, Safety of machinery — Emergency stop function — Principles for design
IEC 60204-1:2016, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1:2014, Safety of laser products — Part 1: Equipment classification and requirements
IEC 60825-4:2006, Safety of laser products — Part 4: Laser guards
IEC 62061:2005, Safety of machinery — Functional safety of safety-related electrical, electronic and
programmable electronic control systems
ISO 11553-1:2020(E)
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 11145:2018, ISO 12100:2010,
IEC 60825-1:2014 and IEC 60825-4:2006 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at http:// www .iso .org/ obp.
— IEC Electropedia: available at http:// www .electropedia .org/
3.1
beam delivery system
system comprised of all components, including all optical beam components and potential beam paths
and enclosures, which when combined, transfer laser radiation emitted from the laser (according to
definition in IEC 60825-1:2014) to the workpiece. The beam delivery system can include all elements
for guiding, shaping and switching the laser beams as well as the enclosure of and support for the beam
path components
[SOURCE: IEC 60825-4:2006/AMD 2:2011, G.2.1, modified — replaced "workpiece. These components may
include" by "workpiece and where the components can include" and changed laser beam to laser beams.]
3.2
beam path component
optical component which lies on a defined beam path
Note 1 to entry: See IEC 60825-1:2014, 3.16.
EXAMPLE A beam steering mirror, a focus lens, a fibre optic cable or a fibre optic cable connector.
3.3
beam shaping component
optical component integrated in the beam path to transform the profile or cross-section of the laser
beam by means of apertures, reflective, refractive or diffractive optical components
EXAMPLE Lens or integrating optical element for hardening applications.
3.4
beam switching component
optical component or an assembly of components introduced in the beam path to direct or divert, under
external control, the beam path along (a) predetermined direction(s)
Note 1 to entry: The external control allows the beam path to be switched from one predetermined direction to
another.
3.5
fibre optic cable
optical beam guiding component that enables the transfer of laser radiation along a transparent medium
Note 1 to entry: The fibre optic cable can be equipped with sensors to monitor breakage and/or temperature.
Note 2 to entry: A fibre optic cable can have a glass or another core that carries the laser radiation and
is surrounded by cladding. The outside of the fibre is protected by cladding and can be further protected by
additional layers of other materials such as polymer or a metal to protect the fibre from mechanical deformation,
ingress of water, etc. In this document, this term also includes other forms of transmission devices such as
waveguides.
3.6
fibre connector
fibre component, that connects the fibre optic cable with other components in the beam path
Note 1 to entry: The fibre connector can be equipped with sensors to monitor its position (connected/
disconnected).
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ISO 11553-1:2020(E)
Note 2 to entry: Typically, fibre connectors connect the fibre with the laser and the laser processing head.
3.7
laser processing machine
machine in which (an) embedded laser(s) provide(s) sufficient energy or power to melt, evaporate, or
cause a phase transition in at least a part of the workpiece, and which is ready to use in function and safety
3.8
hazard area
danger zone
space within and/or around machinery in which a person can be exposed to a hazard
Note 1 to entry: Laser hazard area, within which the beam irradiance or radiant expose exceeds the MPE including
the possibility of accidental misdirection of the laser beam (see definition according to IEC 60825-1:2014).
3.9
process zone
area where the laser beam interacts with the material of the workpiece
3.10
location with controlled access
location where the hazard is inaccessible except to authorized persons who have received adequate
training in laser safety and servicing of the system involved
Note 1 to entry: The access to the location is controlled by authorization systems, e.g. keys, password.
Note 2 to entry: See Table 1.
EXAMPLE Service engineers that need to work in a guarded laser hazard area, or in excess of the MPE
respectively. Protective measures include, besides technical and administrative means, adequate personal
protective equipment (laser protective eyewear, protective clothing).
3.11
location with restricted access
location where the hazard is inaccessible to the public but may be accessible to other observers or other
personnel untrained in laser safety
Note 1 to entry: The location with restricted access, for which personnel are kept from being exposed to the laser
radiation hazards by guards/walls, barriers or other methods.
Note 2 to entry: See Table 1.
EXAMPLE Performing service at a laser processing machine located in a shop floor, which is the restricted
area. The laser hazard area is screened by means of vertical mobile laser guards/walls, which are labelled with
safety signs respectively. Reflected laser radiation can propagate to upper floors or scaffold platforms. Personnel
having access to the shop floor is trained in organizational measures, so that they follow the organizational
safety measures (prohibitions/warnings).
3.12
location with unrestricted and uncontrolled access
location where access is not limited or controlled
Note 1 to entry: All people, including the public can have access to the location.
Note 2 to entry: See Table 1.
Note 3 to entry: If the machine is used under public access, servicing can take place by generating locations with
restricted access or locations with controlled access.
EXAMPLE Typically, these machines are exhibited or demonstrated on fairs and exhibitions. Since the public
can have access to the location, no hazards may emanate from the laser processing machine.
ISO 11553-1:2020(E)
Table 1 — Description of locations
Location Controlled Restricted Unrestricted and uncontrolled
Authorized and trained Personnel untrained in laser
People All, including the public
in laser safety safety but not the public

3.13
automatic mode
production
operating mode, during which the machine is used as intended (normal
use), including
— loading and unloading of parts and/or materials to be processed,
— processing during which the laser beam works alone or in conjunction with other tools
Note 1 to entry: During automatic mode (normal use) safeguarding equipment is closed.
Note 2 to entry: The loading/unloading can take place fully or partly automated or manual.
3.14
setting mode
operating mode, during which laser adjustments or settings are carried
out by the operator
Note 1 to entry: This is required for changes e.g. of the workpiece, the processing movement paths or the process
parameters. During setting mode safeguarding equipment is open, but safety measures, such as significantly
reduced speed, or step-mode, reduced laser output power, allow the operator to intervene in the process.
3.15
manual intervention mode
operating mode, during which single workpieces can be laser processed
and the process can be observed by the operator
3.16
service mode
operating mode, in which the machine is operated, to carry out
corrective actions
EXAMPLE Fault diagnosis, equipment strip-down and repairing, cleaning of optical elements or adjustments
or alignment.
3.17
operating mode selector switch
switch or another selection device, which allows the use of the laser
processing machine in several control or operating modes, requiring different protective measures
and/or work procedures and which can be locked in each position
Note 1 to entry: The selection device includes but is not limited to software.
3.18
modification
change to the machine, which makes it capable of processing materials in a manner which differs from
the original design, or which makes it capable of processing materials differently from how it was
envisaged in the original design, or which affects the safety characteristics of a machine
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ISO 11553-1:2020(E)
3.19
subassembly
constituent part needed for proper performance of the laser processing machine
Note 1 to entry: A laser processing subassembly can be of any laser class in accordance with IEC 60825-1:2014.
3.20
workpiece
material intended to be processed by laser radiation, i.e. the target of the laser beam
3.21
maximum permissible exposure
MPE
level of laser radiation to which, under normal circumstances, persons may be exposed without
suffering adverse effects
Note 1 to entry: The MPE levels represent the maximum level to which the eye or skin can be exposed without
consequential injury immediately or after a long time and are related to the wavelength of the laser radiation,
the pulse duration or exposure duration, the tissue at risk and, for visible and near infra-red laser radiation in
the range 400 nm to 1 400 nm, the size of the retinal image. Maximum permissible exposure levels are (in the
existing state of knowledge) specified in IEC 60825-1:2014, Annex A.
Note 2 to entry: The MPE values given in IEC 60825-1:2014, Annex A are informative and are provided so that
the manufacturer can calculate the NOHD, perform a risk analysis and inform the user about safe usage of the
product. Exposure limits for the eye and the skin of employees in the workplace and the general public are in
many countries specified in national laws. These legally binding national exposure limits might differ from the
MPEs given in IEC 60825-1:2014, Annex A.
[SOURCE: IEC 60825-1:2014, 3.59, modified — in Notes to entry, included IEC 60825-1:2014 before
Annex A indication for clarity.]
3.22
nominal ocular hazard area
NOHA
area within which the beam irradiance or radiant exposure exceeds the appropriate corneal maximum
permissible exposure (MPE), including the possibility of accidental misdirection of the laser beam
Note 1 to entry: If the NOHA includes the possibility of viewing through optical aids, this is termed the
"extended NOHA".
[SOURCE: IEC 60825-1:2014, 3.64]
3.23
foreseeable exposure limit
FEL
maximum laser exposure on the front surface of the laser guard, within the maintenance inspection
interval, assessed under normal and reasonably foreseeable fault conditions
[SOURCE: IEC 60825-4:2006, 3.4]
4 Hazards generated by laser radiation
4.1 General
A number of different hazards can emanate from a laser processing machine. This document is
(exclusively) addressed to the specific hazards resulting from laser radiation arising in laser processing
machines.
Secondary hazards, which are caused by laser beam/material interaction, such as the generation of
hazardous substances (fumes, vapours, gases), fire/explosion risks or the generation of secondary
radiation, e.g. UV-radiation or ionizing radiation, are not considered in this document.
ISO 11553-1:2020(E)
Other hazards which can emanate from a laser processing machine are given in Annex A.
Particular hazards are also covered by harmonized standards (examples):
For noise reduction and noise measurement methods for laser processing machines and hand-held
processing devices and associated auxiliary equipment (accuracy grade 2) see ISO 11553-3:2013,
Annex A.
For assessment and reduction of risks arising from radiation (laser and ionizing radiation excluded)
emitted by machinery see EN 12198-1 to EN 12198-3.
For the evaluation of the emission of airborne hazardous substances, generated during laser
material processing (such as particulate and gaseous substances; e.g. fumes, vapours, gases) see
EN 1093 (all parts).
For reduction of risks to health resulting from hazardous substances emitted by machinery see
ISO 14123-1 and ISO 14123-2.
4.2 Laser radiation hazards/sources of laser radiation emission
Laser radiation hazards can originate from a direct laser beam or a reflected/scattered laser beam. The
normal use as well as malfunctions/reasonably foreseeable fault conditions have to be considered.
Possible emission sources of a direct beam are:
a) aperture of an embedded laser source,
b) beam delivery system within a laser processing machine,
c) laser beam emitted from the processing head (to the workpiece),
d) laser beam emitted from a scanning unit (to the workpiece).
Possible emission sources of a reflected beam are:
— elements (with reflective surface) within the beam delivery system of the laser processing machine,
— the workpiece holder (if the workpiece is missing),
— elements in the processing zone,
— elements inside the housing of a machine (e.g. handling system, suction pipes, parts of guards),
— the workpiece, processed by the laser processing machine.
The optical properties (e.g. surface roughness and reflectivity) of the material exposed to the laser
beam decisively determine the kind of reflection (direct/specular reflection or scattered reflection) and
thus the risk level. This has impact on both the foreseeable exposure limit (FEL) at the inner surface of
a machine enclosure/guard or the resulting irradiance or the radiant exposure at a machine workplace
or at a certain distance to the machine.
Inadequate design or malfunctions of laser components and machinery equipment can also be the
reason for laser radiation hazards/emission (or a misguided laser beam):
— damaged optical fibre cable,
— damaged passive optical elements (e.g. mirrors, lenses),
— misaligned beam path (inadequate optical elements, incorrectly positioned),
— not properly working active beam guiding and shaping elements,
— not properly working handling system or robot positioning of the laser processing head,
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ISO 11553-1:2020(E)
— gaps in the enclosure/guard of a laser processing machine, through which laser radiation can
propagate,
— damage of protective enclosure/guards/screens.
NOTE Information on reasonably foreseeable fault conditions related to beam guidance is given in
IEC 60825-4:2006, Annex B.
Inadequate design of safety functions, and safety related parts of control systems (SRP/CS) respectively,
for the safe isolation or deactivation of the laser beam (e.g. by shutters, relays controlling power supply to
the laser) can cause severe laser radiation risks. In the following, safety functions are exemplarily given:
— emergency stop;
— opening of maintenance covers or doors for workpiece input and output with access to laser
radiation;
— opening of doors to enter laser cabins with access to the laser hazard area;
— disassembling (manually) of fibre connectors with access to the direct laser beam;
— active control of guards and windows with regard to damage by laser radiation.
4.3 Laser radiation hazards induced by external effects (interferences)
Power conditions and the environment in which the laser processing machine operates may cause the
machine to malfunction, thus giving rise to hazardous conditions related to laser radiation and/or
making it necessary for someone to intervene within hazard zones.
Environmental interferences include
— temperature,
— humidity,
— external shock/vibration,
— vapours, dust or gases from the environment,
— electromagnetic/radio frequency interference,
— source voltage interruption/fluctuation, and
— insufficient hardware/software compatibility and integrity of machine parts.
EXAMPLE Environmental conditions can cause adverse impacts on the laser beam characteristics, which
can deteriorate absorption efficiency; shock/vibration can cause misalignment of optical elements and thus the
laser beam.
4.4 Characteristics of laser radiation
The hazards related to laser radiation depend on the characteristics of the radiation.
For a hazard analysis and a risk assessment, the laser radiation emitted from a laser processing machine
is characterized by including but not limited to the following:
— wavelength;
— operating mode (cw, pulsed);
— beam profile (mode, energy distribution);
— beam quality codes: BPP, M , K;
ISO 11553-1:2020(E)
— polarization;
— foreseeable exposure limit (FEL) at the inner side of an enclosure/guard;
— irradiance/radiant exposure at a machine workplace or specified distance to the laser machine;
— maximum exposure time.
5 Safety requirements and measures
5.1 General requirements
The extent to which hazards are covered is indicated in the Scope.
Manufacturers shall ensure the safety of laser processing machines by
a) hazard identification and risk assessment,
b) implementation of safety measures to minimize risks by laser radiation,
c) verification of the safety measures, and
d) provision of appropriate information for the user.
Based on the risk assessment (see 5.2), appropriate safety measures against laser radiation shall be
incorporated into the laser processing machine by design and manufacture.
5.2 Risk assessment with regard to laser radiation hazards
The accessibility to hazardous laser radiation decisively depends on the status of a laser machine.
Therefore, a risk assessment with regard to laser radiation hazards shall be performed:
— for the whole life cycle of the machine, as applicable, (for examples see ISO 12100:2010);
— for all operating modes (The operating modes described in Clause 3 are only examples. The operating
modes of the machine incl. terminology and content should be defined by the risk assessment of the
manufacturer.);
— after each modification of the machine by the person or organization responsible for the
modification; and
— for each reasonably foreseeable misuse/operation not included by the intended use.
A risk assessment includes but is not limited to:
a) hazards caused by the direct or reflected laser beam;
b) hazard zones, particularly those associated with
1) the laser or the laser system,
2) the laser beam path/beam delivery system,
3) the process zone,
4) the laser hazard area, and
5) the area in which laser radiation can dazzle people;
c) "interferences” listed in 4.3.
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ISO 11553-1:2020(E)
The results of the risk assessment shall be duly documented. See ISO 12100:2010 for principles for risk
assessment.
5.3 Implementation of risk reduction measures
5.3.1 General
Safety measures against laser radiation hazards shall be incorporated in the machine by design and
manufacture as specified in 5.3.2 to 5.3.4. Safety measures against laser hazards shall follow the
priority principle according to ISO 12100:2010.
5.3.2 Safety measures against laser radiation hazards in dependence of the locations
NOTE In the following, requirements for safety measures against laser radiation hazards are given in
dependence of the location, where the laser processing machine operates.
5.3.2.1 Safety measures at locations with unrestricted and uncontrolled access
For laser processing machines operating in locations with unrestricted and uncontrolled access, the
possibility of people being exposed to hazardous levels of laser radiation exceeding the accessible
emission limit (AEL) for Class 1 according to IEC 60825-1:2014 shall be eliminated during all operating
modes (production and any other operating mode).
To satisfy these requirements, the following conditions shall be met:
— Unauthorized human access to a hazard zone shall be prevented solely by engineering safety
measures as stipulated in IEC 60825-1:2014 and ISO 12100:2010.
— Guarding shall be applied to protect against laser radiation.
— SRP/CS shall be used to safely isolate the laser radiation, the requirements of ISO 13849-1:2015
shall be met.
NOTE Most commonly by means of an enclosure or guards/screens as described in IEC 60825-4:2006.
EXAMPLE Typically, these machines are exhibited or demonstrated on fairs and exhibitions. Since the public
can have access to the location, no hazards may emanate from the laser processing machine.
5.3.2.2 Safety measures at locations with restricted access
For laser processing machines operating in locations with restricted access, predominantly engineering
safety measures specified in IEC 60825-1:2014 and ISO 12100:2010 shall be taken to prevent human
access to a laser hazard area (NOHA).
To satisfy these requirements, the following conditions shall be met:
a) Engineering safety measures for guarding and for shielding of laser radiation shall reduce the
irradiance below the MPE of eye and skin. SRP/CS for the safe isolation of the laser radiation shall
comply with ISO 13849-1:2015.
b) In addition to engineering measures organizational measures might be necessary (e.g. for operating
mode “service”) to prevent human access to hazardous laser radiation. Exposure above the MPE
shall be eliminated by additional use of administrative/organizational safety measures.
Organizational safety measures shall be carried out with secondary priority in accordance with
ISO 12100:2010 and IEC 60825-1:2014. The manufactures shall inform the user, how to carry out the
organizational measures in order to avoid risks (exceed MPE) by laser radiation.
ISO 11553-1:2020(E)
If the laser hazard area is shielded or partially shielded by laser guards the manufacturer shall inform
the user how to determine the FEL and provide adequate laser guards (with sufficient PEL according to
IEC 60825-1:2014).
If the laser safety is provided by distance the manufacturer shall inform the user how to determine
the NOHA. The manufacturer shall inform the user, how to install barriers (e.g. with barrier tapes) at
the respective Nominal Ocular Hazard Distances. He shall provide information how to implement the
organisational measures in training/education and safety instructions.
EXAMPLE Performing service at a laser processing machine located in a shop floor, which is the restricted
area. The laser hazard area is screened by means of vertical mobile laser guards/walls, which are labelled
with safety signs respectively. Reflected laser radiation can propagate to upper floors or scaffold platforms.
Personnel having access to the shop floor is trained in organizational measures, to follow the organizational
safety measures (prohibitions/warnings). By this, the residual risk by laser radiation can be eliminated by
organizational measures; here e.g. prohibition of entry to upper floors.
5.3.2.3 Safety measures at locations with controlled access
For laser processing machines operating in locations with controlled access, the possibility of people
being exposed to levels of laser radiation exceeding the maximum permissible exposure (MPE and
eye
MPE ) shall be eliminated.
skin
To satisfy this requirement, the following conditions shall be met in addition to all safety measures
related to operating modes, where 5.3.3.2 to 5.3.3.5 apply.
a) Unauthorized human access to the laser hazard zone shall be prevented predominantly by
engineering safety measures as specified in IEC 60825-1:2014 and ISO 12100:2010. The
manufacturer shall specify the kind of authorization control enabling/preventing access to the
laser hazard zone (e.g. door with key, password/transponder).
b) If authorized access (e.g. by key or password/transponder) is necessary for laser processing
machines operating in locations with controlled access (e.g. for service mode, see also 5.3.3.4)
the manufacturer shall provide information on how to work safely in a laser hazard area (see
IEC 60825-1:2014).
Exposure above the MPE in the controlled area shall be eliminated by use of engineering and
administrative controls, including Personal Protective Equipment (PPE). The manufacturer shall
provide the following information to the user:
— Engineering measures: Emergency stop in the laser hazard area.
— Organizational measures: The qualification of personnel authorized to access the laser hazard
zone, which means level of training and education of the personnel and on safety instructions
given to the personnel.
— PPE: The required personal protective equipment (type, level of protection).
EXAMPLE Service engineers that need to work in a guarded laser hazard area, or in excess of the MPE
respectively. Protective measures include, besides technical and administrative means, adequate personal
protective equipment (laser protective eyewear, protective clothing).
5.3.3 Safety measures against laser radiation hazards
NOTE In the following, design requirements for safety measures against laser radiation haz
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