IEC 60749-5:2003
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation
Décrit un essai continu de durée de vie utilisant la température et l'humidité avec polarisation pour évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides.
General Information
- Status
- Published
- Publication Date
- 16-Jan-2003
- Technical Committee
- TC 47 - Semiconductor devices
- Drafting Committee
- WG 2 - TC 47/WG 2
- Current Stage
- DELPUB - Deleted Publication
- Start Date
- 10-Apr-2017
- Completion Date
- 26-Oct-2025
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
Overview
IEC 60749-5:2003 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a steady-state temperature humidity bias life test for semiconductor devices. This test method aims to evaluate the reliability and durability of non-hermetic packaged solid-state devices when exposed to humid environments under continuous electrical bias and steady temperature conditions. By simulating real-world operational stresses involving temperature, humidity, and electrical bias, the standard provides manufacturers and testers with a consistent, reliable procedure to identify device weaknesses and predict performance over time.
Key Topics
Purpose and Scope
IEC 60749-5 focuses on assessing the robustness of semiconductor devices encapsulated in non-hermetic packages, where moisture ingress could degrade device performance. The standard applies to steady-state testing under specified temperature and relative humidity conditions with an applied bias voltage.Test Conditions
The testing involves subjecting devices to defined temperature and humidity levels in controlled chambers, typically within the range of 85°C and 85% relative humidity, but adjustable based on device specifications. The duration of bias life testing varies to accelerate failure mechanisms like corrosion, delamination, or electrical degradation.Equipment Requirements
Testing chambers must maintain precise temperature and relative humidity levels while providing electrical bias to the device. Equipment design aims to minimize contamination (ionic or particulate) that could otherwise skew results. Controls for avoiding ionic contamination include restricting dust, careful material selection, and deionized water usage for humidity generation.Device Preparation and Stress Application
Devices under test are physically prepared to expose them to uniform stress conditions. The bias applied during testing replicates operational electrical conditions relevant to the part’s intended use. The test continuously monitors device functionality, noting time to failure or parameter drift indicating reliability issues.Documentation and Reporting
The standard outlines requirements for recording all test parameters, including temperature, humidity, bias level, test duration, and device test conditions. Comprehensive reporting supports data reproducibility and standardizes reliability assessment in device qualification processes.
Applications
Reliability Qualification of Semiconductor Devices
Manufacturers apply IEC 60749-5 to qualify ICs and other solid-state devices for use in environments exposed to moisture and elevated temperatures, such as automotive electronics, consumer devices, and industrial control systems. The test verifies packaging integrity and material compatibility under accelerated aging conditions.Quality Control Testing in Production
During production, this test assists in ongoing quality assurance, helping detect process variations affecting device endurance or susceptibility to environmental stress failures. It helps maintain product consistency and reduces field failures related to moisture-induced degradation.Failure Analysis and Root Cause Diagnosis
IEC 60749-5 supports failure investigations by reproducing environmental and electrical stresses under controlled laboratory conditions. This can help isolate failure mechanisms such as corrosion, insulation breakdown, or mechanical deterioration within non-hermetic packages.Design Verification and Improvement
Device designers use results from this standard’s test to evaluate different packaging materials, sealing techniques, and moisture barrier properties, driving innovations that improve overall product longevity in humid operating conditions.
Related Standards
IEC 60749-4:2004 - Damp Heat, Steady-State, Highly Accelerated Stress Test (HAST)
This standard complements IEC 60749-5 by providing accelerated humidity and temperature testing methods without bias, useful for different stages of reliability assessment and accelerated life testing.IEC 60068-2-78 - Environmental Testing – Damp Heat, Steady State
Covers environmental testing procedures for temperature and humidity cycling, supporting a broader context for semiconductor device climate resilience testing.JEDEC JESD22-A101 – Temperature-Humidity-Bias Test
A harmonized standard used primarily in the semiconductor industry for similar bias humidity life tests, applicable alongside IEC 60749-5 for cross-industry qualification.
Practical Value
By adopting IEC 60749-5:2003, semiconductor manufacturers, test labs, and quality control teams gain:
- A standardized method ensuring consistent evaluation of humidity-induced reliability risks.
- Accelerated testing that simulates real environmental abuse in a shortened timeframe, reducing time-to-market for new devices.
- Data to support product warranty and qualification claims by scientifically documenting device durability.
- Insights into design and process improvements that enhance packaging robustness against humidity-related failures.
Implementing this standard into reliability testing protocols is essential for ensuring the longevity and performance of non-hermetic semiconductor devices used in humid and demanding environmental applications.
Keywords: IEC 60749-5, semiconductor device testing, steady-state temperature humidity bias test, non-hermetic packaging, reliability evaluation, humidity bias life test, environmental stress testing, solid-state devices, electronic component qualification, accelerated life testing.
Frequently Asked Questions
IEC 60749-5:2003 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test". This standard covers: Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
IEC 60749-5:2003 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60749-5:2003 has the following relationships with other standards: It is inter standard links to IEC 60749:1996/AMD2:2001, IEC PAS 62161:2000, IEC 60749:1996/AMD1:2000, IEC 60749:1996, IEC 60749-5:2017. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60749-5:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
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