IEC 63287-2:2023

IEC 63287-2 ®
Edition 1.0 2023-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Guidelines for reliability qualification plans –
Part 2: Concept of mission profile

Dispositifs à semiconducteurs – Lignes directrices concernant les plans de
qualification de la fiabilité –
Partie 2: Concept de profil de mission
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IEC 63287-2 ®
Edition 1.0 2023-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Guidelines for reliability qualification plans –

Part 2: Concept of mission profile

Dispositifs à semiconducteurs – Lignes directrices concernant les plans de

qualification de la fiabilité –

Partie 2: Concept de profil de mission

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01  ISBN 978-2-8322-6708-0

– 2 – IEC 63287-2:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Mission profile . 5
4.1 Concept of mission profile . 5
4.2 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (1) . 6
4.3 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (2) . 8
4.4 Example of reliability test plan considering the mission profile of automotive
cabin peripherals application . 9
5 Calculation examples of mission profiles (Calculation of sample and test time of
life tests) . 10
Bibliography . 15

Figure 1 – Example of mission profile for automotive application . 6

Table 1 – Trial calculation example of equivalent time under operating life test based
on consideration of the mission profile (automotive application in the engine
peripheral) . 7
Table 2 – Trial calculation example of number of samples/test time of operating life
test with consideration of the mission profile (Automotive application in the engine
peripheral) . 7
Table 3 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the engine peripheral) . 8
Table 4 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (Automotive application in the engine peripheral) . 9
Table 5 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the cabin peripheral) . 9
Table 6 – Trial calculation example of number of samples/test time of high temperature
operating life test with consideration of the mission profile (Automotive application in
the cabin peripheral) . 10
Table 7 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 11
Table 8 – Calculation examples of mission profiles (Calculation of sample and test time
of life tests) . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile

FOREWORD
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IEC 63287 Part 2 has been prepared by IEC technical committee 47: Semiconductor devices.
It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2796/FDIS 47/2803/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 63287-2:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
This International Standard is to be read in conjunction with IEC 63287-1.
A list of all parts in the IEC 63287 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
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specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
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of its contents. Users should therefore print this document using a colour printer.

SEMICONDUCTOR DEVICES –
GUIDELINES FOR RELIABILITY QUALIFICATION PLANS –

Part 2: Concept of mission profile

1 Scope
This part of IEC 63287 gives guidelines for the development of reliability qualification plans
using the concept of mission profile, based on the environmental conditioning and proposed
usage of the product. This document is not intended for military- and space-related applications.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 63287-1:2021, Semiconductor devices – Generic semiconductor qualification guidelines –
Part 1: Guidelines for IC reliability qualification
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
failure mode
style classification of a fault phenomenon which causes product failure
Note 1 to entry: Disconnection, a short circuit, occasional loss, abrasion, characteristic deterioration, etc. are typical
items considered as failure modes.
4 Mission profile
4.1 Concept of mission profile
In designing the reliability test plan, the test plan greatly changes depending on how the
environmental conditions of the LSI is assumed. For example, in the case of electronic units for
automotive application installed in the vicinity of the engine, operational temperature gradually
rises by the heat generated by the engine but the temperature decreases after the engine stops,
meaning that the unit is not always subjected to sever temperature conditions. The set of
changing environmental temperature conditions and their time ratio is called the “mission
profile”. Because mission profile depends on multiple factors such as operational duty of LSI,
installation environment, generation of heat by peripheral parts, etc., it cannot be
unconditionally standardized. Therefore, it is important to agree the mission profile between the
LSI vendor and the user and decide on accurate test conditions.

– 6 – IEC 63287-2:2023 © IEC 2023
Figure 1 shows an example of mission profile, with the ambient temperature and the estimated
hours of operation at that temperature differing between installation around the engine and
around the cabin for cases of automotive application with an estimated lifetime of 15 years
(7 500 operational hours). A design method for the reliability test plan using the mission profile
shown in Figure 1 is given in 4.2. For comparison, as an example of change in the test plan
content due to the difference of mission profile, a design method for lifetime of 15 years (12 000
operational hours) as application for engine peripherals is given in 4.3
Trial calculation procedures of test time and number of test samples are based on
JEITA ED-4701/002.
Figure 1 – Example of mission profile for automotive application
4.2 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (1)
Table 1 below shows the trial calculation of the reliability test plan (number of samples and time
for the reliability test), based on the mission profile of on-vehicle application in the engine
peripheral shown in Figure 1, taking the operating life test as an example. Table 1 is an example
assuming general automotive applications in Japan with a presupposition of 500 annual
operational hours.
In designing a test plan for the operating life test, only the hours of operation in the mission
profile shall be regarded as the stress time in the LSI use environment. In this example, the rise
in junction temperature (∆Tj) during operation is assumed as 20 °C and the test temperature is
set as Ta = 125 °C. As shown in Table 1, conducting about 279 hours of operating life test at
125 °C gives stress equivalent to 15 years of actual use.

Table 1 – Trial calculation example of equivalent time under operating life test based on
consideration of the mission profile (automotive application in the engine peripheral)
Convert hours of operation to equivalent time
Mission profile
under acceleration condition
(environment of actual use)
125 °C temperature
Test conditions
b
acceleration +
125 °C temperature
b
Hours of
acceleration only
a
3,96 V voltage
Ta Tj
operation
c
acceleration
0 °C 20 °C 500 h 0,3 h 0,02 h
55 °C 75 °C 1 000 h 53 h 4 h
125 °C
85 °C 105 °C 4 500 h 1 530 h 109 h
3,96 V
105 °C 125 °C 1 000 h 1 000 h 71 h
(Voltage in actual use
3,3 V)
125 °C 145 °C 500 h 1 327 h 95 h
Total 7 500 h 3 910 h 279 h
a
Tj = Ta + 20 °C (Assumption)
b
Ea = 0,7 eV (Formula (1))
c
β = 4 (Formula (2))
Table 2 uses the reliability test plan of IEC 63287-1. It shows the calculated values based on
the number of samples and test time of operating life test in the case of 90 % confidence level
and less than 0,1 % total of confirmation level of wear-out failure in the above mission profile
(15 years of actual use).
NOTE The reliability tests of IEC 63287-1 are conducted by accelerating voltage, temperature, humidity, etc. of the
actual use environment.
Table 2 – Trial calculation example of number of samples/test time of operating life test
with consideration of the mission profile (Automotive application in the engine
peripheral)
Reliability test scale to
Assumed
Failure Acceleration Test confirm the life of Reference:
Test items failure
distribution parameter conditions 15 years/0,1 % AEC-Q100
mode
(Confidence level 90 %)
Ea = 0,7 eV Number
125 °C
of test 45 pcs 231 pcs 231 pcs
(Formula (1))
High samples
Weibull
3,96 V
temperature
distribution
voltage
TDDB
operating
(Voltage in
acceleration
m = 3 Test
life test
actual use
1 037 h 601 h 1 000 h
time
β = 4 (Formula
3,3 V)
(2))
TDDB = time-dependent dielectric breakdown

As shown above, designing test plan with consideration of the mission profile is effective in the
case of application with large temperature change in environment of actual use. Therefore, use
of mission profile in conducting efficient test is recommended.

– 8 – IEC 63287-2:2023 © IEC 2023
4.3 Example of reliability test plan considering the mission profile of automotive
engine peripherals application (2)
Table 3 shows an example of change in the test plan content due to the difference of mission
profile. Table 3 is an example assuming general automotive applications in North America and
Europe with a presupposition of 800 hours (12 000 hours/15 years) of annual operational hours,
intended by AEC-Q100.
Similarly to the design of the test plan of the operating life test in 4.2, only the hours of operation
in the mission profile shall be regarded as the stress time in the LSI use environment. The rise
in junction temperature (∆Tj) during operation is assumed as 20 °C and the test temperature
was set as Ta = 125 °C. Table 3 shows the trial calculation example of conversion of operational
hours to equivalent time under operating life test. Here, the assumed failure mode is time-
dependent dielectric breakdown (TDDB). The temperature acceleration is estimated as
Ea = 0,7 eV (Formula (1)) and the voltage acceleration as β = 4 (Formula (2)) for the trial
calculation. As shown in Table 3, conducting about 528 hours of operating life test at 125 °C
gives stress equivalent to 15 years of actual use.
Table 3 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the engine peripheral)
Convert hours of operation to equivalent time
Mission profile
under acceleration condition
(environmental conditions of
125 °C temperature
actual use)
Test conditions
b
acceleration +
125 °C temperature
b
acceleration only
Hours of 3.96 V voltage
a
Ta Tj
c
operation
acceleration
0 °C 20 °C 500 h 0,3 h 0,02 h
55 °C 75 °C 500 h 27h 2 h
125° C
85 °C 105 °C 8 000 h 2 719h 194 h
3,96 V
105 °C 125 °C 2 000 h 2 000h 143 h
(Voltage in actual use
3,3 V)
125 °C 145 °C 1 000 h 2 654 h 189 h
Total 12 000 h 7 400 h 528 h
a
Tj = Ta + 20 °C (Assumption)
b a
Ea = 0,7 eV (Formula )
c b
β = 4 (Formula )
Table 4 shows the calculated values based on the reliability test plan of IEC 63287-1. It shows
the calculated values based on the number of samples and test time of operating life test in the
case of 90 % confidence level and 0,1 % or less total of confirmation level of wear-out failures
in the above mission profile (15 years of actual use).
NOTE The reliability tests of IEC 63287-1 are conducted by accelerating voltage, temperature, humidity, etc. of the
actual use environment.
Table 4 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (Automotive application in the engine peripheral)
Reliability test scale to
Assumed
Failure Acceleration Test confirm the life of Reference:
Test items failure
distribution parameter conditions 15 years/0.1 % AEC-Q100
mode
(Confidence level 90 %)
Ea = 0,7 eV Number
125 °C
of test 45 pcs 231 pcs 231 pcs
(Formula (1))
High samples
Weibull
3,96 V
temperature
distribution
voltage
TDDB
operating
(Voltage in
acceleration
m = 3 Test
life test
actual use
1 961 h 1 137 h 1 000 h
time
β = 4 (Formula
3,3 V)
(2))
As shown above, the difference in mission profile changes the reliability test plan (number of
samples and time for the reliability test), even if it is under the same test conditions. The concept
of mission profile allows the development of a suitable test plan for individual applications.
4.4 Example of reliability test plan considering the mission profile of automotive
cabin peripherals application
The mission profile below shows the design procedure of a reliability test plan (number of
samples and time for the reliability test) for automotive application in the cabin peripheral of
Figure 1.
In designing a test plan for the operating life test, only the hours of operation in the mission
profile shall be regarded as the stress time in the LSI use environment. In this example, the trial
calculation example of conversion of operational hours to equivalent time under operating life
test is shown in Table 6 for the case where rise in junction temperature (∆Tj) during operation
is assumed as 20 °C and the test temperature is set as Ta = 125 °C. Here, the assumed failure
mode is TDDB. The temperature acceleration is estimated as Ea = 0,7 eV (Formula (1)) and
the voltage acceleration as β = 4 (Formula (2)) for the trial calculation. As shown in Table 5,
conducting about 130 hours of operating life test at 125 °C gives stress equivalent to 15 years
of actual use.
Table 5 – Trial calculation example of equivalent time under operating life test with
consideration of the mission profile (automotive application in the cabin peripheral)
Mission profile
Convert hours of operation to equivalent time
(environmental conditions of
under acceleration condition
actual use)
Test conditions
125 °C temperature
b
acceleration +
Hours of 125 °C temperature
a
Ta Tj
b
operation
acceleration only
3,63 V voltage
c
acceleration
0 °C 20 °C 400 h 0,3 h 0,1 h
125 °C
30 °C 50 °C 1 800 h 15,8 h 4,2 h
3,63 V
50 °C 75 °C 1 100 h 41,8 h 11,2 h
(Voltage in actual use
65 °C 85 °C 4 200 h 430,1 h 114,9 h
3,3 V)
Total 7 500 h 488h 130,4 h
a
Tj = Ta + 20 °C (Assumption)
b a
Ea = 0,7 eV (Formula )
c b
β = 4 (Formula )
– 10 – IEC 63287-2:2023 © IEC 2023
Table 6 shows the calculated values based on the reliability test plan of IEC 63287-1. It shows
the calculated values based on the number of samples and test time of operating life test in the
case of 90 % confidence level and 0,1 % or less total of confirmation level of wear-out failures
in the above mission profile (15 years of actual use).
NOTE The reliability tests of IEC 63287-1 are conducted by accelerating voltage, temperature, humidity, etc. of the
actual use environment.
Table 6 – Trial calculation example of number of samples/test time
of high temperature operating life test with consideration of the mission
profile (Automotive application in the cabin peripheral)
Reliability test scale to
Assumed
Failure Acceleration Test confirm the life of Reference:
Test items failure
distribution parameter conditions 15 years/0,1 % AEC-Q100
mode
(Confidence level 90 %)
Ea = 0,7 eV Number
125 °C
of test 45 pcs 231 pcs 231 pcs
(Formula (1))
High samples
Weibull
3,63 V
temperature
distribution
voltage
TDDB
operating
(Voltage in
acceleration
m = 3 Test
life test
actual use
484 h 281 h 1 000 h
time
β = 4 (Formula
3,3 V)
(2))
As shown above, consideration of the concept of mission profile is effective in the case of
applications with a large temperature change in the environment of actual use. Therefore, use
of mission profile in conducting efficient test is recommended. As a calculation, an example of
mission profile, in comparison with the example of AEC-Q100 is shown in Clause 5.
5 Calculation examples of mission profiles (Calculation of sample and test
time of life tests)
Table 7 and Table 8 show examples of trial calculations substituting acceleration conditions
and acceleration model used in JEITA EDR-4708B by the mission profile of AEC-Q100, and
comparing the sample size and time. AEC Q100 only provides an example.

Table 7 – Calculation examples of mission profiles (Calculation of sample and test time of life tests)
Acceleration EDR-4708B AEC-Q100
conditions/Assumed
Mission profile Acceleration model
Calculated sample Specified
failure mode
Test items size/time sample
size/time
0,1 %-Lifetime at
EDR-4708B AEC-Q100 EDR-4708B AEC-Q100 EDR-4708B AEC-Q100
CL90 % LTPD Standard
High temperature 15 years/3,3 V
operating life test
TDDB
20 °C/500 h
(Comparison between
m = 3
75 °C/1 000 h  
E 1 1

a
EDR-4708B engine
α =exp –
 
T

15 years Ea = 0,7 eV Ea = 0,7 eV E  1 1 231 pcs/601 h 231 pcs/1 000 h
 
105 °C/4 500 h
peripherals kT T a
  12
 α =exp –
 
T
application (1) and 87 °C/12 000 h β = 4 125 °C kT T 50 pcs/1 000 h (1 393 h)
125 °C/1 000 h  
 12

AEC-Q100) α exp βV−V
( )}
{
V 21
125 °C
145 °C/500 h
3,96 V
Operating hour
counter 7 500 h
High temperature
15 years/3.3 V
operating life test
20 °C/500 h
TDDB
(Comparison between
75 °C/500 h
m = 3

EDR-4708B engine E  
 1 1 
a
α =exp –
105 °C/8 000 h  
peripherals T 
E  
15 years Ea = 0,7 eV Ea = 0,7 eV  1 1  231 pcs/1 137 h 231 pcs/1 000 h
kT T a
 
 12
 α =exp –
application (2) and  
T
125 °C/2 000 h
87°C/12 000 h β = 4 125 °C kT T 339 pcs/1 000 h (1 393 h)

 12

AEC-Q100)
α exp βV−V
{ ( )}
145 °C/ 1000 h
V 21
125 °C
Operating hour
3,96 V
counter
12 000 h
High temperature 15 years/3.3 V
TDDB
operating life test
20 °C/400 h
m = 3

E  1 1
 
(Comparison between a
50 °C/1 800 h α =exp –
 
T 
E  
EDR-4708B cabin 15 years Ea = 0,7 eV Ea = 0,7 eV  1 1  231 pcs/1 000 h
kT T a
 
 12
 α =exp – 231 pcs/281 h
 
75 °C/1 100 h T
peripherals
87 °C/12 000 h β = 4 125 °C kT T (1 393 h)

 12

application and AEC-
85 °C/4 200 h
α exp βV(−V)
{ }
V 21
125 °C
Q100)
Operating hour
3,63 V
counter 7 500 h
=
=
=
– 12 – IEC 63287-2:2023 © IEC 2023

Acceleration EDR-4708B AEC-Q100
Mission profile conditions/Assumed Acceleration model
Calculated sample Specified
failure mode
Test items size/time sample
size/time
0,1 %-Lifetime at
EDR-4708B AEC-Q100 EDR-4708B AEC-Q100 EDR-4708B AEC-Q100
CL90 % LTPD Standard
High temperature TDDB
operating life test
m = 3 
E  1 1

a
Trial
α =exp –
 
T

E  
15 years Ea = 0,7 eV Ea = 0,7 eV kT T  1 1  231 pcs/802 h 231 pcs/1 000 h
calculation by
  a
 12
α =exp –
 
T
AEC-Q100
87 °C/12 000 h β = 4 125 °C kT T 119 pcs/1 000 h (1 393 h)
 
 12

mission profile
α exp βV(−V)
{ }
125 °C V 21
3,63 V
=
Table 8 – Calculation examples of mission profiles (Calculation of sample and test time of life tests)
Acceleration EDR-4708B
AEC-Q100
Mission profile conditions/Assumed Acceleration model
Calculated
Specified
failure mode
sample
Test items sample
size/time
size/time
EDR-4708B AEC-Q100 EDR-4708B AEC-Q100 EDR-4708B AEC-Q100 0,1 %-Lifetime
LTPD Standard
at CL90 %
High temperature Trial
Degradation
storage test calculation by
of wire bond
AEC-Q100
15 years
area
mission profile
 
E   E  
 1 1   1 1  45 pcs/379 h
a a
α =exp – α =exp –
87 °C 150 °C 45 pcs/1 000 h
   
T T
m = 4
Non-operating
kT T kT T 15 pcs/500 h
   
 12  12
 
12 000 h
time = 119 400
Ea = 1,0 eV
h
150 °C
at 55 °C
Temperature Corrosion of
humidity bias test metallic fine
wiring
(Relative humidity Ea = 0,8 eV
  
E 11
model) m = 4 a
Trial 15 years    P
E 11 −
P = 3    231 pcs/1 708 h
a
P  
− RH
   k TT 231 pcs/1 000 h
calculation by t  ut
  
RH
Ea = 0,8 eV k TT
A ⋅exp
32 °C/74 %RH t  ut
85 °C/85 %R   
f 1 963 pcs/
AEC-Q100 A ⋅exp
 (960 h)
f RH

u
P = 3 H 1 000 h
RH
mission profile 131 400 h

u
85 °C/85 %R Vccmax
H
Vccmax
Temperature Corrosion of
humidity bias test metallic fine
Ea = 0,8 eV
wiring
(Absolute water
n
Trial  
15 years E  11
P = 3 a
vapor pressure m = 4
V  P −
  478 pcs/1 000 h 231 pcs/1 000 h
 
calculation by
p2  
RH
k TT
32 °C/74 %RH
model) t  ut
85 °C/85 %R α =  
 
AEC-Q100 n = 2 vp A ⋅exp
f 231 pcs/1 200 h (960 h)
 
H V
RH
131 400 h
mission profile p1
u
 
85 °C/85 %R
Vccmax
H
Vccmax
– 14 – IEC 63287-2:2023 © IEC 2023

Acceleration EDR-4708B
AEC-Q100
Mission profile conditions/Assumed Acceleration model
Calculated
failure mode Specified
sample
Test items sample
size/time
size/time
EDR-4708B AEC-Q100 EDR-4708B AEC-Q100 EDR-4708B AEC-Q100
0,1 %-Lifetime
LTPD Standard
at CL90 %
Temperature Corrosion of
humidity storage metallic fine
test wiring
Ea = 0,8 eV
Trial 15 years      
E 11 E 11
a a
(Relative humidity m = 4 P P
− −
      231 pcs/96 h
calculation by P = 3
  
RH RH
k TT k TT
model) 32 °C/74 %RH t  ut t  ut 231 pcs/95 h
   
AEC-Q100 Ea = 0,8 eV A ⋅exp A ⋅exp
  (53 h)
f f
130 °C/85 %
RH RH
mission profile 131 400 h
 
u u
P = 3 RH
130 °C/85 %
RH
Temperature Corrosion of
humidity storage metallic fine
Ea = 0,8 eV
n
test wiring
Trial   
15 years E 11
a
P
V  −
   231 pcs/55 h 231pcs/96h
calculation by P = 3 p2
 
(Absolute water m = 4 RH k TT
32 °C/74 %RH t
  ut
α =
 
AEC-Q100 A ⋅exp
vp
25 pcs/96 h (53 h)
vapor pressure f
130 °C/85 %  
n = 2 V
RH
131 400 h
mission profile p1
u
model)  
RH
130 °C/85 %
RH
Temperature cycle Au wire
test 15 years fracture
2 634 pcs/
Trial
n = 4
ΔT = 76 °C m = 4 1 000 cycles 231 pcs/1 000 h
calculation by
n n
α = ∆T÷∆T α = ∆T÷∆T
– ( ) ( )
AEC-Q100 ∆T 21 ∆T 21
54 750 cycles n = 4 231 pcs/
(1 034 cycles)
55 °C/150 °C
mission profile
1 838 cycles
(10 cycles/day) –
55 °C/150 °C
Bibliography
IEC 60068-2-1, Environmental testing – Part 2-1: Tests: Test A: Cold
IEC 60068-2-30, Environmental testing – Part 2-30: Tests: Test Db: Damp heat cyclic
(12 h + 12 h cycle)
IEC 60749-11, Semiconductor devices – Mechanical and climatic test methods – Part 11: Rapid
change of temperature – Two-fluid-bath method
JEITA EDR-4704A, Application Guide of the Accelerated Life Test for Semiconductor Devices,
Japan Electronics and Information Technology Industries Association (JEITA), 2007
JEDEC JESD94A, Application Specific Qualification Using Knowledge Based Test Methodology,
JEDEC JEP122, Failure Mechanisms and Models for Semiconductor Devices
JP001, Joint publication. foundry process. qualification guidelines. (Wafer Fabrication
Manufacturing Sites)
IECQ (Parts 01-03), IEC Quality Assessment System for Electronic Components (IECQ System)
JEDEC JESD74, Early Life Failure Rate Calculation
JEITA EDR-4705, Report on Failure Mechanism of LSI and Reliability Test Method
JEDEC JESD47, Failure mechanism based stress test qualification for integrated circuits
JEDEC JEP122, Failure Mechanisms and Models for Semiconductor Devices
JEDEC JESD85, Calculating Failure Rates in Units of FITS
JEITA EDR-4708, Guideline for LSI Reliability Qualification Plan
AEC Q100, Stress Test Qualification for Integrated Circuits
JEITA ED-4701/002 Procedure of the test time and the sample size determination for the life
tests
___________
– 16 – IEC 63287-2:2023 © IEC 2023
SOMMAIRE
AVANT-PROPOS . 17
1 Domaine d’application . 19
2 Références normatives . 19
3 Termes et définitions . 19
4 Profil de mission . 20
4.1 Concept de profil de mission . 20
4.2 Exemple de plan d’essai de fiabilité prenant en considération le profil de
mission de l’application automobile des périphériques du moteur (1) . 20
4.3 Exemple de plan d’essai de fiabilité prenant en considération le profil de
mission de l’application automobile des périphériques du moteur (2) . 22
4.4 Exemple de plan d’essai de fiabilité prenant en considération le profil de
mission de l’application automobile des périphériques de la cabine . 24
5 Exemples de calcul de profils de mission (Calcul de l’échantillon et de la durée
d’essai des essais de durée de vie) . 25
Bibliographie . 30

Figure 1 – Exemple de profil de mission pour une application automobile . 20

Tableau 1 – Exemple de calcul d’approximation de la durée équivalente dans le cadre
de l’essai de durée de vie en fonctionnement, prenant en considération le profil
de mission (Application automobile dans le périphérique du moteur). 21
Tableau 2 – Exemple de calcul d’approximation du nombre d’échantillons/de la durée
de l’essai de durée de vie en fonctionnement, prenant en considération le profil
de mission (Application automobile dans le périphérique du moteur). 22
Tableau 3 – Exemple de calcul d’approximation de la durée équivalente dans le cadre
de l’essai de durée de vie en fonctionnement, prenant en considération le profil
de mission (Application automobile dans le périphérique du moteur). 23
Tableau 4 – Exemple de calcul d’approximation de la durée équivalente dans le cadre
de l’essai de durée de vie en fonctionnement, prenant en considération le profil
de mission (Application automobile dans le périphérique du moteur). 23
Tableau 5 – Exemple de calcul d’approximation de la durée équivalente dans le cadre
de l’essai de durée de vie en fonctionnement, prenant en considération le profil
de mission (Application automobile dans le périphérique de la cabine) . 24
Tableau 6 – Exemple de calcul d’approximation du nombre d’échantillons/de la durée
de l’essai de durée de vie en fonctionnement à haute température, prenant
en considération le profil de mission (Application automobile dans le périphérique
de la cabine) . 25
Tableau 7 – Exemples de calcul de profils de mission (Calcul de l’échantillon et de la
durée d’essai des essais de durée de vie) . 26
Tableau 8 – Exemples de calcul de profils de mission (Calcul de l’échantillon et de la
durée d’essai des essais de durée de vie) . 28

COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
LIGNES DIRECTRICES CONCERNANT LES PLANS
DE QUALIFICATION DE LA FIABILITÉ –

Partie 2: Concept de profil de mission

AVANT-PROPOS
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...