IEC 60749-37:2022
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un accéléromètre
IEC 60749-37:2022 est disponible sous forme de IEC 60749-37:2022 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-37:2022 fournit une méthode d’essai destinée à évaluer et comparer la performance de chute des composants électroniques à montage en surface dans des applications de produits électroniques portatifs dans un environnement d’essai accéléré, où une flexion excessive d’une carte de circuit imprimé provoque une défaillance de produit. Le but est de normaliser la carte d'essai et la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des composants à montage en surface, en reproduisant les mêmes modes de défaillances que ceux observés normalement au cours d'un essai au niveau du produit. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- correction d’une erreur technique précédente concernant les conditions d’essai;
- mises à jour afin de refléter les progrès technologiques.
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IEC 60749-37 ®
Edition 2.0 2022-10
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
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IEC 60749-37 ®
Edition 2.0 2022-10
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5882-8
– 2 – IEC 60749-37:2022 RLV © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope and object . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Test apparatus and components . 8
4.1 Test apparatus . 8
4.2 Test components . 8
4.3 Test board . 8
4.4 Test board assembly . 9
4.5 Number of components and sample size . 9
5 Test procedure . 10
5.1 Test equipment and parameters . 10
5.2 Pre-test characterization . 12
5.3 Drop testing . 14
6 Failure criteria and failure analysis . 15
7 Summary . 16
Annex A (informative) Preferred board construction, material, design and layout . 18
A.1 Preferred board construction, material and design . 18
A.2 Preferred test board size, layout, and component locations . 20
Bibliography . 24
Figure 1 – Typical drop test apparatus and mounting scheme for PCB assembly .
Figure 1 – Drop test apparatus detail . 11
Figure 2 – Calculation of velocity change . 12
Figure 3 – Fundamental mode of vibration of PCB supported with four screws .
Figure 3 – Typical shock test half-sine pulse graphic and formulae . 14
Figure A.1 – Recommended test board size and layout .
Figure A.1 – Board footprint and BGA layout . 22
Figure A.2 – Test vehicle with 4 component placement (top side – left)
and 1 component at center location (bottom side – right). . 23
Table 1 – Quantity of test boards and components required for testing . 10
Table 2 – Component locations for test boards .
Table A.1 – Test board stack-up and material . 18
Table A.2 – Mechanical property requirements for dielectric materials . 19
Table A.3 – Recommended test board pad sizes and solder mask openings . 20
Table A.4 – X, Y locations for components’ centre .
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 37: Board level drop test method using an accelerometer
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes made to
the previous edition IEC 60749-37:2008. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.
– 4 – IEC 60749-37:2022 RLV © IEC 2022
IEC 60749-37 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-B111A, cancels and replaces the first
edition published in 2008. lt is used with permission of the copyright holder, JEDEC Solid State
Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) correction of a previous technical error concerning test conditions;
b) updates to reflect improvements in technology.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2651/CDV 47/2719/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found in the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
INTRODUCTION
Handheld electronic products fit into the consumer and portable market segments. Included in
handheld electronic products are cameras, calculators, cell phones, cordless phones, pagers,
palm size PCs, personal computer memory card international association (PCMCIA) cards,
smart cards, personal digital assistants (PDAs) and other electronic products that can be
conveniently stored in a pocket and used while held in user’s hand.
These handheld electronic products are more prone to being dropped during their useful service
life because of their size and weight. This dropping event can not only cause mechanical failures
in the housing of the device but also create electrical failures in the printed circuit board (PCB)
assemblies mounted inside the housing due to transfer of energy through PCB supports. The
electrical failures may sometimes result from various failure modes such as cracking of the
circuit board, track cracking on the board, cracking of solder interconnections between the
components and the board, and component cracks. The primary driver of these failures is
excessive flexing of the circuit board due to input acceleration to the board created from
dropping the handheld electronic product. This flexing of the board causes relative motion
between the board and the components mounted on it, resulting in component
...
IEC 60749-37 ®
Edition 2.0 2022-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un
accéléromètre
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 19 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
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IEC 60749-37 ®
Edition 2.0 2022-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un
accéléromètre
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5837-8
– 2 – IEC 60749-37:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and components . 7
4.1 Test apparatus . 7
4.2 Test components . 8
4.3 Test board . 8
4.4 Test board assembly . 8
4.5 Number of components and sample size . 9
5 Test procedure . 9
5.1 Test equipment and parameters . 9
5.2 Pre-test characterization . 11
5.3 Drop testing . 12
6 Failure criteria and failure analysis . 13
7 Summary . 14
Annex A (informative) Preferred board construction, material, design and layout . 15
A.1 Preferred board construction, material and design . 15
A.2 Preferred test board size, layout, and component locations . 17
Bibliography . 20
Figure 1 – Drop test apparatus detail . 10
Figure 2 – Calculation of velocity change . 11
Figure 3 – Typical shock test half-sine pulse graphic and formulae . 12
Figure A.1 – Board footprint and BGA layout . 18
Figure A.2 – Test vehicle with 4 component placement (top side – left) and
1 component at center location (bottom side – right). . 19
Table 1 – Quantity of test boards and components required for testing . 9
Table A.1 – Test board stack-up and material . 15
Table A.2 – Mechanical property requirements for dielectric materials . 16
Table A.3 – Recommended test board pad sizes and solder mask openings . 17
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 37: Board level drop test method using an accelerometer
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-37 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-B111A, cancels and replaces the first
edition published in 2008. lt is used with permission of the copyright holder, JEDEC Solid State
Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) correction of a previous technical error concerning test conditions;
b) updates to reflect improvements in technology.
– 4 – IEC 60749-37:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2651/CDV 47/2719/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts of the IEC 60749 series, und
...
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