IEC 60749-9:2002
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9: Permanence du marquage
Vise à vérifier que les marquages sur les dispositifs à semiconducteurs ne deviendront pas illisibles lorsqu'ils seront soumis aux solvants ou aux solutions de nettoyage normalement utilisés pour éliminer les résidus de flux de soudage produits pendant l'assemblage des cartes à circuits imprimés. Cet essai est applicable à tous les types de boîtiers. Il y a lieu de considérer cet essai comme non destructif. Le contenu du corrigendum d'août 2003 a été pris en considération dans cet exemplaire.
General Information
- Status
- Published
- Publication Date
- 11-Apr-2002
- Technical Committee
- TC 47 - Semiconductor devices
- Drafting Committee
- WG 2 - TC 47/WG 2
- Current Stage
- DELPUB - Deleted Publication
- Start Date
- 03-Mar-2017
- Completion Date
- 26-Oct-2025
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
Overview
IEC 60749-9:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods focused on the permanence of marking on semiconductor devices. The standard ensures that markings on semiconductor packages remain legible after exposure to common solvents and cleaning solutions used during printed circuit board (PCB) assembly, particularly in solder flux residue removal processes. This standard is applicable across all semiconductor package types and is designed as a non-destructive test suitable for qualification and process monitoring.
The standard incorporates a corrigendum from August 2003 and aligns generally with IEC 60068-2-45 environmental testing guidelines, with specific adaptations for semiconductor testing requirements. It excludes laser marking procedures, focusing instead on conventional marking durability.
Key Topics
Purpose and Scope
Ensures that semiconductor device markings do not degrade or become illegible when exposed to cleaning solvents typical in PCB manufacturing workflows. This test is critical for maintaining traceability, identification, and regulatory compliance of semiconductor components.Solvent Types and Testing Conditions
The standard defines three types of solvents to simulate cleaning environments:- Solvent A: Mixture of isopropyl alcohol and mineral spirits or kerosene-based solutions, maintained at 20°C to 30°C.
- Solvent B: Semi-aqueous based solvent (defluxer), such as terpene or HCFC alternatives, matching environmental regulations.
- Solvent C: Mixture of deionized water, propylene glycol monomethyl ether, and monoethanolamine, tested at 63°C to 70°C.
Test Methodology
The marking permanence test involves controlled brushing of semiconductor markings with a specified toothbrush and solvents under defined pressure (0.6 N to 0.8 N). This brush stroke simulates typical cleaning actions during PCB assembly while ensuring repeatability and accuracy.Equipment Requirements
- Non-reactive brushes with hard, uniform bristles replaced upon wear
- Non-reactive containers for solvents
- Explosion-proof heating plates to maintain solvent temperature within set ranges
Non-destructive Nature
The test can be performed using electrical or mechanical rejects, preserving valuable components while verifying marking durability.
Applications
Electronic Manufacturing Quality Control
Semiconductor manufacturers and PCB assemblers use this standard to verify that device markings withstand cleaning and handling processes, preventing loss of critical identification during manufacturing.Supplier Qualification
Ensures suppliers provide devices whose markings meet durability specifications, essential for traceability, compliance with industry regulations, and warranty integrity.Process Monitoring
Allows ongoing assessment of marking quality in production environments, helping to detect issues with marking materials or processes before widespread use.Standard Compliance
Supports adherence to international semiconductor quality and reliability standards by verifying marking integrity under realistic exposure conditions.
Related Standards
IEC 60068-2-45 – Environmental Testing: Immersion in Cleaning Solvents
Provides the general environmental test framework that IEC 60749-9 tailors for semiconductor marking permanence.IEC 60749 Series – Semiconductor Devices Mechanical and Climatic Test Methods
Covers broader testing procedures for mechanical and climatic robustness of semiconductor packages beyond marking permanence.ISO/IEC Directives, Part 3
Guides preparation and maintenance of international standards, including this IEC 60749-9 edition.
Summary
IEC 60749-9:2002 delivers a crucial test method for verifying the durability and permanence of markings on semiconductor devices under solvent exposure conditions typical to PCB assembly cleaning. By specifying precise solvents, brushing techniques, and equipment, this standard supports manufacturers and quality teams in maintaining reliable semiconductor identification throughout production and use. Implementing this standard helps guarantee product traceability, reduce manufacturing errors, and comply with international semiconductor quality practices.
Frequently Asked Questions
IEC 60749-9:2002 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking". This standard covers: Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
IEC 60749-9:2002 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60749-9:2002 has the following relationships with other standards: It is inter standard links to IEC 60749:1996/AMD2:2001, IEC PAS 62175:2000, IEC 60749:1996/AMD1:2000, IEC 60749:1996, IEC 60749-9:2002/COR1:2003, IEC 60749-9:2017. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60749-9:2002 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
NORME CEI
INTERNATIONALE IEC
60749-9
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 9:
Permanence du marquage
Semiconductor devices –
Mechanical and climatic test methods –
Part 9:
Permanence of marking
Numéro de référence
Reference number
CEI/IEC 60749-9:2002
Numérotation des publications Publication numbering
Depuis le 1er janvier 1997, les publications de la CEI As from 1 January 1997 all IEC publications are
sont numérotées à partir de 60000. Ainsi, la CEI 34-1 issued with a designation in the 60000 series. For
devient la CEI 60034-1. example, IEC 34-1 is now referred to as IEC 60034-1.
Editions consolidées Consolidated editions
Les versions consolidées de certaines publications de la The IEC is now publishing consolidated versions of its
CEI incorporant les amendements sont disponibles. Par publications. For example, edition numbers 1.0, 1.1
exemple, les numéros d’édition 1.0, 1.1 et 1.2 indiquent and 1.2 refer, respectively, to the base publication,
respectivement la publication de base, la publication de the base publication incorporating amendment 1 and
base incorporant l’amendement 1, et la publication de the base publication incorporating amendments 1
base incorporant les amendements 1 et 2. and 2.
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constamment revu par la CEI afin qu'il reflète l'état under constant review by the IEC, thus ensuring that
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cette publication, y compris sa validité, sont dispo- relating to this publication, including its validity, is
nibles dans le Catalogue des publications de la CEI available in the IEC Catalogue of publications
(voir ci-dessous) en plus des nouvelles éditions, (see below) in addition to new editions, amendments
amendements et corrigenda. Des informations sur les and corrigenda. Information on the subjects under
sujets à l’étude et l’avancement des travaux entrepris consideration and work in progress undertaken by the
par le comité d’études qui a élaboré cette publication, technical committee which has prepared this
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NORME CEI
INTERNATIONALE IEC
60749-9
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 9:
Permanence du marquage
Semiconductor devices –
Mechanical and climatic test methods –
Part 9:
Permanence of marking
IEC 2002 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
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PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
– 2 – 60749-9 CEI:2002
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
MÉTHODES D'ESSAIS MÉCANIQUES ET CLIMATIQUES –
Partie 9: Permanence du marquage
AVANT-PROPOS
1) La CEI (Commission Electrotechnique Internationale) est une organisation mondiale de normalisation
composée de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI). La CEI a
pour objet de favoriser la coopération internationale pour toutes les questions de normalisation dans les
domaines de l'électricité et de l'électronique. A cet effet, la CEI, entre autres activités, publie des Normes
internationales. Leur élaboration est confiée à des comités d'études, aux travaux desquels tout Comité national
intéressé par le sujet traité peut participer. Les organisations internationales, gouvernementales et non
gouvernementales, en liaison avec la CEI, participent également aux travaux. La CEI collabore étroitement
avec l'Organisation Internationale de Normalisation (ISO), selon des conditions fixées par accord entre les
deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques représentent, dans la mesure
du possible un accord international sur les sujets étudiés, étant donné que les Comités nationaux intéressés
sont représentés dans chaque comité d’études.
3) Les documents produits se présentent sous la forme de recommandations internationales. Ils sont publiés
comme normes, rapports techniques ou guides et agréés comme tels par les Comités nationaux.
4) Dans le but d'encourager l'unification internationale, les Comités nationaux de la CEI s'engagent à appliquer de
façon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes
nationales et régionales. Toute divergence entre la norme de la CEI et la norme nationale ou régionale
correspondante doit être indiquée en termes clairs dans cette dernière.
5) La CEI n’a fixé aucune procédure concernant le marquage comme indication d’approbation et sa responsabilité
n’est pas engagée quand un matériel est déclaré conforme à l’une de ses normes.
6) L’attention est attirée sur le fait que certains des éléments de la présente Norme internationale peuvent faire
l’objet de droits de propriété intellectuelle ou de droits analogues. La CEI ne saurait être tenue pour
responsable de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
La Norme internationale CEI 60749-9 a été établie par le comité d'études 47 de la CEI:
Dispositifs à semiconducteurs.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
47/1604/FDIS 47/1620/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.
Cette méthode d'essais mécaniques et climatiques, relative à la permanence du marquage,
est le résultat de la réécriture complète de l’essai contenu dans l'article 2 du chapitre 4 de
la CEI 60749.
Cette publication a été rédigée selon les directives ISO/CEI, Partie 3.
Le comité a décidé que le contenu de cette publication ne sera pas modifié avant 2007.
A cette date, la publication sera
• reconduite;
• supprimée;
• remplacée par une édition révisée, ou
• amendée.
Le contenu du corrigendum d’août 2003 a été pris en considération dans cet exemplaire.
60749-9 IEC:2002 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 9: Permanence of marking
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-9 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1604/FDIS 47/1620/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This mechanical and climatic test method, as it relates to the permanence of marking, is a
complete rewrite of the test contained in clause 2, chapter 4 of IEC 60749.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of August 2003 have been included in this copy.
– 4 – 60749-9 CEI:2002
DISPOSITIFS À SEMICONDUCTEURS –
MÉTHODES D'ESSAIS MÉCANIQUES ET CLIMATIQUES –
Partie 9: Permanence du marquage
1 Domaine d’application
La présente partie de la CEI 60749 a pour objet de vérifier que les marquages sur les
dispositifs à semiconducteurs ne deviendront pas illisibles lorsqu’ils seront soumis aux
solvants ou aux solutions de nettoyage normaleme
...




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