IEC 60749-9:2017

IEC 60749-9 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 9: Permanence of marking
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 9: Permanence du marquage

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IEC 60749-9 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 9: Permanence of marking
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 9: Permanence du marquage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-7383-8

– 2 – IEC 60749-9:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Equipment . 6
5 Safety precautions . 7
6 Procedure . 7
6.1 Solvents test . 7
6.2 Tape pull test . 7
7 Failure criteria . 8
8 Summary . 8
Bibliography . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 9: Permanence of marking
FOREWORD
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International Standard IEC 60749-9 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.

– 4 – IEC 60749-9:2017 © IEC 2017
This bilingual version (2019-09) corresponds to the monolingual English version, published in
2017-03.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2348/FDIS 47/2373/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 9: Permanence of marking
1 Scope
The purpose of this part of IEC 60749 is to determine whether the marks on solid state
semiconductor devices will remain legible when subjected to the application and removal of
labels or the use of solvents and cleaning solutions commonly used during the removal of
solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or
process monitor testing. The test is considered non-destructive. Electrical or mechanical
rejects can be used for the purpose of this test.
NOTE 1 This procedure does not apply to laser branded packages.
Many available solvents that could be used are either not sufficiently active, too stringent, or
even dangerous to humans when in direct contact or when fumes are inhaled.
NOTE 2 The composition of solvents used in this document is considered typical and representative of the
desired stringency as far as the usual coatings and markings are concerned.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purpose of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
solvent A
mixture consisting of the following:
• one part by volume of isopropyl alcohol;
• three parts by volume of volatile petroleum spirits with a flash point greater than 60 °C, or
• three parts by volume of a mixture of 80 % by volume of kerosene and 20 % by volume of
ethylbenzene
Note 1 to entry: The solvent should be maintained at a temperature of 20 °C to 30 °C.
3.2
solvent B
semi-aqueous based solvent, (defluxer), e.g. a terpene, ali
...