IEC 60749-15:2020

IEC 60749-15 ®
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

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IEC 60749-15 ®
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-8686-9

– 2 – IEC 60749-15:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 7
4.3 Heatsinks or shielding . 7
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 8
6 Procedure . 8
6.1 Test method . 8
6.2 Ageing and pre-conditioning of specimens . 8
6.3 Preparation of the solder bath . 8
6.4 Use of flux . 8
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 9
6.8 Failure criteria . 9
7 Summary . 9
Bibliography . 10

Table 1 – Parameters for solder dipping. 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

– 4 – IEC 60749-15:2020 RLV © IEC 2020
International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This third edition cancels and replaces the second edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3, Terms and definitions;
b) clarification of the use of a soldering iron for producing the heating effect;
c) inclusion an option to use accelerated ageing.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of
semiconductors, the clauses of this standard apply.
2 General
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:
External visual examination
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

– 6 – IEC 60749-15:2020 RLV © IEC 2020
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
colophony
DEPRECATED: rosin
natural resin obtained as the residue after removal of turpentine from the oleo-resin of the
pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin
acid esters
Note 1 to entry: "Rosin" is a synonym for colophony, and is deprecated because of the common confusion with
the generic term "resin".
3.2
lead-free solder
alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used
for joining components to substrates or for coating surfaces
[SOURCE: IEC 60194:2015, 75.1904, modified – The words "as its constituent" have been
added to the definition.]
3.3
resistance to soldering heat
ability of device to withstand the highest temperature of the termination or lead in soldering
process, within applicable temperature range of solder alloy
4 Test apparatus
4.1 Solder pot
A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot
dimensions shall allow full immersion of the leads without touching the bottom. The apparatus
shall be capable of maintaining the solder at the temperature specified in Table 1.

Table 1 – Parameters for solder dipping
Condition A Condition B
Parameter
(for wave solder) (for soldering iron)
Temperature of molten solder °C 260 ± 5 350 ± 5
Number of immersions
≤2 ≤2
–1
Immersion rate mm s 25 ± 5 25 ± 5
Dwell time s
10 ± 5 10 ± 5
–1
Emersion rate mm s 25 ± 5 25 ± 5
Distance between solder bath and device body mm
1,5 ± 0,5 1,5 ± 0,5
Parameter SnPb solder Pb-free solder
Temperature of molten solder °C 260 ± 5 270 ± 5
Number of immersions ≤ 2 ≤ 2
−1
Immersion rate mm s 25 ± 6 25 ± 6
Dwell time s
+2 +2
10 7
0 0
−1
Emersion rate mm s 25 ± 6 25 ± 6

4.2 Dipping device
A mechanical dipping device shall be used that is capable of controlling the rates of
immersion and emersion of the leads and providing the dwell time as specified in Table 1.
4.3 Heatsinks or shielding
If applicable, heatsinks or shielding shall be attached to the devices prior to the test and shall
be as specified in the relevant specification.
5 Materials
5.1 Solder
The solder specification shall be as follows.
Chemical composition:
– for SnPb solder, the composition in percentage by weight shall be as follows:
Tin: 59 % to 65 %;
Lead: the remainder.
Sn60Pb40 or Sn63Pb37 (Sn ± 1 %) chemical composition
– for Pb-free solder, the composition in percentage by weight shall be as follows:
Silver: 3 % to 4 %;
Copper: 0,5 % to 1 %;
Tin: the remainder.
The solder shall not contain impurities which will adversely affect its properties.

– 8 – IEC 60749-15:2020 RLV © IEC 2020
Other solders and their applicable bath temperatures may be used as specified detailed in the
relevant specification.
5.2 Flux
If flux is applied prior to solder dipping, the flux shall consist of 25 % by weight of colophony
in 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification.
6 Procedure
6.1 Test method
The method used in this procedure requires the specimen to be dipped into a solder bath
under specified conditions. The solder bath method is the one which simulates most closely
the soldering procedures of flow soldering and similar soldering processes. In circumstances
where the solder dip method is considered to impracticable the specimen can be tested by the
application of a heated soldering iron under controlled conditions. This is described in
IEC 60068-2-20.
6.2 Ageing and pre-conditioning of specimens
If required by the relevant specification, the test conditioning shall be preceded by
accelerated ageing such as steam ageing, damp heat conditioning, dry heat conditioning or
unsaturated pressurized vapour conditioning. Accelerated ageing shall be performed in
accordance with IEC 60068-2-20.
Any other special pre-conditioning of the specimens prior to testing shall be as specified
detailed in the relevant specification. This preparation may include operations such as
bending or other relocation of leads, and the attachment of heat sinks or protective shielding
prior to solder dipping.
6.3 Preparation of the solder bath
The molten solder shall be stirred to assure that the temperature is uniform. The dross shall
be skimmed from the surface of the molten solder just prior to dipping the part.
6.4 Use of flux
Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux
prior to solder dip; excess flux shall be removed by draining for a suitable time.
6.5 Solder dip
The part shall be attached to the dipping device (see 4.2) and the leads immersed in the
molten solder until to within 1 mm of the body of the device under test reaches the dimensions
specified in Table 1. The parameters for solder temperature, dwell time, number of
immersions and rates of immersion and emersion are defined in Table 1. Unless otherwise
detailed in the procurement specification, Condition A shall be used. After the dipping process,
the part shall be allowed to cool in air and, if flux has been used, residues shall be removed
with isopropanol or ethanol.
6.6 Precautions
Prior to and after the solder immersion, precautionary measures shall be taken to prevent
undue exposure of the part to the heat radiated by the solder bath.

6.7 Measurements
Hermeticity tests for hermetic devices, visual examination and electrical measurements that
consist of parametric and functional tests, shall be made as specified in the relevant
specification.
Hermeticity tests for hermetic devices and visual examination shall be made in accordance
with IEC 60749-8 and IEC 60749-3 respectively. Electrical measurements that consist of
parametric and functional tests shall be made as required by the relevant specification.
6.8 Failure criteria
A device shall be defined as a failure if hermeticity for hermetic devices cannot be
demonstrated in accordance with IEC 60749-8, if parametric limits are exceeded or if
functionality cannot be demonstrated under nominal and worst-case conditions specified in
the relevant specification. Mechanical damage such as cracking, chipping or breaking of the
package (10× – 20× magnification to be inspected with a magnification of 10× to 20×) and
failure to meet the requirements of IEC 60749-3 will also be considered a failure, provided
such damage was not induced by fixturing or handling. Devices shall be classified as failures
if parametric limits are exceeded or if functionality cannot be demonstrated under nominal and
worst-case conditions specified in the relevant specification.
7 Summary
The following details shall be specified in the relevant specification:
a) use of heatsinks or shielding, if applicable (see 4.3);
b) flux composition, if applicable (see 5.2);
c) solder composition, if other than detailed in this document (see 5.1);
d) pre-conditioning of specimens, if applicable (see 6.2);
e) time of immersion and number of immersions, if other than as specified in Table 1;
f) condition (A or B), time and depth of immersion if other than as specified in Table 1 6.5;
f) method of hermeticity tests, visual examination and electrical measurements (see 5.6);
g) failure criteria of hermeticity tests, visual examination and electrical measurements
(see 6.8);
h) sample size.
– 10 – IEC 60749-15:2020 RLV © IEC 2020
Bibliography
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

___________
IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants
– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9

Table 1 – Parameters for solder dipping. 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard
...