IEC 60749-15:2010

IEC 60749-15 ®
Edition 2.0 2010-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d’essai mécaniques et climatiques –
Partie 15: Résistance à la température de soudage pour dispositifs par trous
traversants
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IEC 60749-15 ®
Edition 2.0 2010-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d’essai mécaniques et climatiques –
Partie 15: Résistance à la température de soudage pour dispositifs par trous
traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
G
CODE PRIX
ICS 31.080.01 ISBN 978-2-88912-231-8
– 2 – 60749-15 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
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International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2003 and constitutes a
technical revision. The significant changes with respect from the previous edition include:
– editorial change in the scope,
– addition of lead-free solder chemical composition specification.

60749-15 © IEC:2010 – 3 –
The text of this standard is based on the following documents:
FDIS Report on voting
47/2067/FDIS 47/2078/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices -
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged
until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60749-15 © IEC:2010
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of
semiconductors, the clauses of this standard apply.
2 General
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
3 Test apparatus
3.1 Solder pot
A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot
dimensions shall allow full immersion of the leads without touching the bottom. The apparatus
shall be capable of maintaining the solder at the temperature specified in Table 1.
3.2 Dipping device
A mechanical dipping device shall be used that is capable of controlling the rates of
immersion and emersion of the leads and providing the dwell time as specified in Table 1.
3.3 Heatsinks or shielding
If applicable, heatsinks or shielding shall be attached to the devices prior to the test and shall
be as specified in the relevant specification.

60749-15 © IEC:2010 – 5 –
Table 1 – Parameters for solder dipping
Condition A Condition B
Parameter
(for wave solder) (for soldering iron)
Temperature of molten solder °C 260 ± 5 350 ± 5
Number of immersions ≤2 ≤2
–1
Immersion rate mm s
25 ± 5 25 ± 5
Dwell time s 10 ± 5 10 ± 5
–1
Emersion rate mm s
25 ± 5 25 ± 5
Distance between solder bath and device body mm
1,5 ± 0,5 1,5 ± 0,5
4 Materials
4.1 Solder
The solder specification shall be as follows.
Chemical composition
– for SnPb solder the composition in percentage by weight shall be as follows:
Tin: 59 % to 65 %;
Lead: the remainder.
Chemical composition
– for Pb-free solder the composition in percentage by weight shall be as follows:
Silver: 3 % to 4 %;
Copper: 0.5 % to 1 %;
Tin: the remainder.
The solder shall not contain impurities which will adversely affect its properties.
Other solders and their applicable bath temperatures may be used as specified in the relevant
specification.
4.2 Flux
If flux is applied prior to solder dipping, the flux shall consist of 25 % by weight of colophony
in 75 % by weight of isopropyl alcohol, unless otherwise detailed in the relevant specification.
5 Procedure
5.1 Pre-conditioning of specimens
Any special pre-conditioning of the specimens prior to testing shall be as specified in
the relevant specification. This preparation may include operations such as bending or other
relocation of leads, and the attachment of heat sinks or protective shielding prior to
solder dipping.
5.2 Preparation of the solder bath
The molten solder shall be stirred to assure that the temperature is uniform. The dross shall
be skimmed from the surface of the molten solder just prior to dipping the part.

– 6 – 60749-15 © IEC:2010
5.3 Use of flux
Where detailed in the relevant specification, all leads of the specimen shall be dipped in flux
prior to solder dip; excess flux shall be removed by draining for a suitable time.
5.4 Solder dip
The part shall be attached to the dipping device (see 3.2) and the leads immersed in the
molten solder until the body of the device under test reaches the dimensions specified in
Table 1. The parameters for solder temperature, dwell time, number of immersions and
...