IEC PAS 62189:2000

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2000-11
Bias Life
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62189
C O MMI S S I O N
Copyright © 1991, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
BIAS LIFE
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the

public and established in an organization operating under given procedures.

IEC-PAS 62189 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1474/PAS 47/1510/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the

IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.

Copyright © 1991, JEDEC; 2000, IEC

J ESD22-A 108-A
Page 1
TEST METHOD A108-A
BIAS LIFE
JCB-90-31 ,
(From Council
JEDEC Ballo t formulate d under
th e
cognizance of JC-14.1 Committee on Reliability Test Methods fo r

Packaged Devices. )
1. PURPOSE
This test is performed to determine the effects of bias conditions
and temperature on solid state devices over an extended period of
time. It is intended primaril y
for devic e
Qualification an d
reliability monitoring .
2. APPARATUS
The performance of this test requires equipment that is capable of
providing the particular test conditions to which the test samples
will be subjected .
2.1 Circuitr y
The circuitry through which the samples will be biased must* b e
designed with several considerations:
2.1.1 Device Schematic
The biasing and operating schemes shall** consider the limitations
of the device and shall not overstress the devices nor contribute
runaway.
to therma l Device thermal characterization shall b e
considered (or may be made) to ensure that the temperature of “Hot
th e
Spots” o n di e does no t exceed maximum rate d junctio n
temperature.
2.1.2 Power
The test circuit should*** be designed to limit power dissipatio n
if a device failure occurs ,
such that,
excessive power will not be
applied to other devices in the sample.
*
The word must is cautionar y
in the sense that the state d
action is essential to successful achievement of a purpose .
* *
The word shall is to be understood as mandatory.
** *
The word should is to be understood as advisory.

Copyright © 1991, JEDEC; 2000, IEC

JESD22-A108-A
Page 2
2.2 Device Mounting
Equipment design if required, shall provide for mounting of devices
to minimiz e adverse effects durin g test , (e.g. , improper hea t

dissipation) .
2.3 Power Supplies and Signal Sources
Instruments (such as DVMs, oscilloscopes,
etc. ) used to set up and
monitor power supplies and signal sources shall be maintained in
a calibrated system and shall be of the type that provides goo d
long-term stability .
The environmental chamber shall be capable of maintaining th e
specifie d ambient tempe
...