IEC TS 61994-4-4:2010

IEC/TS 61994-4-4


®

Edition 2.0 2010-06



TECHNICAL



SPECIFICATION




Piezoelectric and dielectric devices for frequency control and selection –
Glossary –
Part 4-4: Materials – Materials for surface acoustic wave (SAW) devices



IEC/TS 61994-4-4:2010(E)

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IEC/TS 61994-4-4


®

Edition 2.0 2010-06



TECHNICAL



SPECIFICATION




Piezoelectric and dielectric devices for frequency control and selection –
Glossary –
Part 4-4: Materials – Materials for surface acoustic wave (SAW) devices



INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
M
ICS 01.040.31; 31.140 ISBN 978-2-88912-022-2
® Registered trademark of the International Electrotechnical Commission

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– 2 – TS 61994-4-4 © IEC:2010(E)


INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



PIEZOELECTRIC AND DIELECTRIC DEVICES

FOR FREQUENCY CONTROL AND SELECTION –

GLOSSARY –



Part 4-4: Materials –

Materials for surface acoustic wave (SAW) devices




FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
– the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
– the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 61994-4-4, which is a technical specification, has been prepared by IEC technical
committee 49: Piezoelectric and dielectric devices for frequency control and selection.

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TS 61994-4-4 © IEC:2010(E) – 3 –


This second edition of IEC 61994-4-4 cancels and replaces the first edition published in 2005.


This edition constitutes a technical revision.


The main changes with respect to the previous edition are listed below:


– Terms and definitions are rearranged in accordance with the order of the alphabet.

– ”reduced LN” is appended to terms and definitions.


– ”reduced LT” is appended to terms and definitions.

– reduction process is appended to terms and definitions.

The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
49/890/DTS 49/901/RVC

Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 61994 series, published under the general title Piezoelectric and
dielectric devices for frequency control and selection – Glossary can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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– 4 – TS 61994-4-4 © IEC:2010(E)


PIEZOELECTRIC AND DIELECTRIC DEVICES

FOR FREQUENCY CONTROL AND SELECTION –

GLOSSARY –



Part 4-4: Materials –

Materials for surface acoustic wave (SAW) devices








1 Scope
This part of IEC 61994 specifies the terms and definitions for single crystal wafers applied for
surface acoustic wave (SAW) devices representing the state of the art, which are intended for
use in the standards and documents of IEC technical committee 49.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
ISO 4287, Geometrical Product Specifications (GPS) – Surface texture: Profile method –
Terms, definitions and surface texture parameters
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
acceptable quality level
AQL
AQL is the maximum percent defective (or the maximum number of defects per hundred units)
that, for purposes of sampling inspections, can be considered satisfactory as a process
average
[IEC 60410:1973, 4.2]
3.2

as-grown synthetic quartz crystal
single-crystal quartz grown hydrothermally. “As-grown” refers to the state of processing and
indicates a state prior to mechanical fabrication
[IEC 61994-4-1:2007, 3.4]
3.3
back surface roughness
definitions of R are given in ISO 4287
a
[IEC 62276:2005, 3.8]
3.4
bevel
slope or rounding of the wafer perimeter. This is also referred to as “edge profile”. The
process of creating a bevel is called “bevelling” or “edge rounding”. The profile and its
tolerances should be specified by the supplier

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