IEC TS 61994-4-4:2005
(Main)Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-4: Materials - Materials for Surface Acoustic Wave (SAW) devices
Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-4: Materials - Materials for Surface Acoustic Wave (SAW) devices
Specifies the terms and definitions for single crystal wafers applied for surface acoustic wave (SAW) devices representing the state of the art, which are intended for use in the standards and documents of IEC technical committee 49.
General Information
Relations
Overview
IEC TS 61994-4-4:2005 is an important technical specification published by the International Electrotechnical Commission (IEC) that defines the terms and definitions related to materials used for Surface Acoustic Wave (SAW) devices. This document forms part of the IEC 61994 series titled “Piezoelectric and dielectric devices for frequency control and selection – Glossary” and specifically addresses single crystal wafers applied in SAW devices. The scope of this standard includes state-of-the-art materials such as synthetic quartz, lithium niobate, lithium tantalate, lithium tetraborate, and lanthanum gallium silicate.
This specification supports the work of IEC Technical Committee 49, which focuses on piezoelectric and dielectric devices used in frequency control and selection applications. By providing a clear and unified glossary of terminology, IEC TS 61994-4-4 helps ensure consistency and clarity in international standards and technical documentation concerning SAW materials.
Key Topics
Material Definitions for SAW Crystals:
- As-grown synthetic quartz crystal – Hydrothermally grown single-crystal quartz prior to mechanical fabrication.
- Lithium niobate (LN) – Single crystals characterized by the chemical formula LiNbO, grown by Czochralski or similar methods.
- Lithium tantalate (LT) – Crystals described by LiTaO formula, also produced by Czochralski or equivalent processes.
- Lithium tetraborate (LBO) – Crystals with formula Li2B4O7, grown by Czochralski or Bridgman techniques.
- Lanthanum gallium silicate (LGS) – Crystals with La3Ga5SiO14 composition, grown by Czochralski method.
Key Terminologies in SAW Wafer Production:
- Manufacturing lot – Agreed batch of wafers between supplier and customer.
- Curie temperature – Temperature marking the transition between ferroelectric and paraelectric phases, essential in LN and LT crystal behavior.
- Single domain crystal – Crystal with uniform electrical polarization, often achieved by a polarization or poling process.
- Lattice constant – Unit cell length measured by X-ray techniques, crucial for crystal quality inspection.
- Orientation flats (Primary and Secondary Flats) – Flat edges on wafers indicating crystallographic orientation and polarity, which correlate with SAW propagation directions.
Wafer Quality and Surface Characteristics:
- Flatness metrics such as Total Thickness Variation (TTV), Thickness Variation for five points (TV5), Warp, Sori, and Local Thickness Variation (LTV) define wafer surface uniformity and deformation.
- Back surface roughness and surface orientation are measured following ISO 4287 standards.
- Bevel (edge profile) specifications indicate wafer perimeter shaping important for handling and device fabrication.
- Appearance defects definitions include contamination and particulate classifications, guiding quality control.
Applications
IEC TS 61994-4-4 is essential for manufacturers, designers, and researchers involved in the development and production of SAW devices. These devices find widespread use in:
- Frequency control components such as filters, oscillators, and resonators within telecommunications.
- High-precision timing devices in mobile phones, GPS, and RF systems.
- Sensors and signal processing units leveraging SAW technology for detection and measurement.
- Establishing quality control benchmarks for single crystal wafers to ensure consistent device performance and reliability.
- Facilitating international standard harmonization in terminology and measurement, aiding global supply chains and technology exchange.
The glossary standard enables clear communication on material properties and their implications on device functionality, helping engineers optimize SAW device performance based on crystal characteristics and wafer quality parameters.
Related Standards
IEC TS 61994-4-4 complements and references multiple international standards that collectively govern frequency control materials and devices:
- IEC 60050-561 – International Electrotechnical Vocabulary for piezoelectric devices.
- IEC 60758 – Specifications and usage guide for synthetic quartz crystals.
- IEC 61994-4-1 – Glossary for piezoelectric materials focusing on synthetic quartz.
- IEC 62276 – Specifications and measurement methods for single crystal wafers used in SAW devices.
- ISO 4287 – Standard for surface texture and roughness assessment using profile methods.
Together, this network of standards forms a comprehensive framework that supports the design, manufacturing, and quality assurance of SAW materials and devices worldwide.
Keywords: IEC TS 61994-4-4, SAW device materials, single crystal wafers, lithium niobate, lithium tantalate, synthetic quartz, wafer flatness, thickness variation, piezoelectric materials, frequency control devices, international standards, surface acoustic wave devices glossary.
Standards Content (Sample)
TECHNICAL IEC
SPECIFICATION TS 61994-4-4
First edition
2005-05
Piezoelectric and dielectric devices
for frequency control and selection –
Glossary –
Part 4-4:
Materials – Materials for Surface
Acoustic Wave (SAW) devices
Reference number
IEC/TS 61994-4-4:2005(E)
Publication numbering
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60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
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TECHNICAL IEC
SPECIFICATION TS 61994-4-4
First edition
2005-05
Piezoelectric and dielectric devices
for frequency control and selection –
Glossary –
Part 4-4:
Materials – Materials for Surface
Acoustic Wave (SAW) devices
IEC 2005 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale L
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – TS 61994-4-4 IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PIEZOELECTRIC AND DIELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
GLOSSARY –
Part 4-4： Materials –
Materials for Surface Acoustic Wave (SAW) devices
FOREWORD
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The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 61994-4-4, which is a technical specification, has been prepared by IEC technical
committee 49: Piezoelectric and dielectric devices for frequency control and selection.
TS 61994-4-4 IEC:2005(E) – 3 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
49/691/DTS 49/700/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61994 consists of the following parts under the general title Piezoelectric and dielectric
devices for frequency control and selection – Glossary:
Part 1: Piezoelectric and dielectric resonators
Part 2: Piezoelectric and dielectric filters
Part 3: Piezoelectric and dielectric oscillators
Part 4-1: Piezoelectric materials – Synthetic quartz crystal
Part 4-2: Piezoelectric and dielectric materials – Piezoelectric ceramics
Part 4-4: Materials – Materials for Surface Acoustic Wave (SAW) devices
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
– 4 – TS 61994-4-4 IEC:2005(E)
PIEZOELECTRIC AND DIELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
GLOSSARY –
Part 4-4： Materials –
Materials for Surface Acoustic Wave (SAW) devices
1 Scope
This part of IEC 61994 specifies the terms and definitions for single crystal wafers applied for
surface acoustic wave (SAW) devices representing the state of the art, which are intended for
use in the standards and documents of IEC TC 49.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050-561:1991, International Electrotechnical Vocabulary (IEV) – Chapter 561: Piezo-
electric devices for frequency control and selection
Amendment 1 (1995)
Amendment 2 (1997)
IEC 60758:2004, Synthetic quartz crystal – Specifications and guide to the use
IEC 61994-4-1:2001, Piezoelectric and dielectric devices for frequency control and selection –
Glossary – Part 4-1: Piezoelectric materials – Synthetic quartz crystal
IEC 62276:2005, Single crystal wafers for surface acoustic wave (SAW) device applications –
Specifications and measuring methods
ISO 4287, Geometrical Product Specifications (GPS) – Surface texture: Profile method –
Terms, definitions and surface texture parameters
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1 Single crystals for SAW wafer
3.1.1
as-grown synthetic quartz crystal
single-crystal quartz grown hydrothermally. “As-grown” refers to the state of processing and
indicates a state prior to mechanica
...
Frequently Asked Questions
IEC TS 61994-4-4:2005 is a technical specification published by the International Electrotechnical Commission (IEC). Its full title is "Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-4: Materials - Materials for Surface Acoustic Wave (SAW) devices". This standard covers: Specifies the terms and definitions for single crystal wafers applied for surface acoustic wave (SAW) devices representing the state of the art, which are intended for use in the standards and documents of IEC technical committee 49.
Specifies the terms and definitions for single crystal wafers applied for surface acoustic wave (SAW) devices representing the state of the art, which are intended for use in the standards and documents of IEC technical committee 49.
IEC TS 61994-4-4:2005 is classified under the following ICS (International Classification for Standards) categories: 01.040.31 - Electronics (Vocabularies); 31.140 - Piezoelectric devices. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC TS 61994-4-4:2005 has the following relationships with other standards: It is inter standard links to IEC TS 61994-4-4:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
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