IEC 60749-19:2003

IEC 60749-19 ®
Edition 1.1 2010-11
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 19: Die shear strength
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –
Partie 19: Résistance de la pastille au cisaillement

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IEC 60749-19 ®
Edition 1.1 2010-11
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 19: Die shear strength
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –

Partie 19: Résistance de la pastille au cisaillement

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8891-2245-5

– 2 – 60749-19 Ó IEC:2003+A1:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 19: Die shear strength
FOREWORD
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This consolidated version of the official IEC Standard and its amendment has been
prepared for user convenience.
IEC 60749-19 edition 1.1 contains the first edition (2003) [documents 47/1664/FDIS and
47/1684/RVD] and its amendment 1 (2010) [documents 47/2016/CDV and 47/2060/RVC].
A vertical line in the margin shows where the base publication has been modified by
amendment 1. Additions and deletions are displayed in red, with deletions being struck
through.
60749-19 Ó IEC:2003+A1:2010 – 3 –
International Standard IEC 60749-19 has been prepared by IEC technical committee 47:
Semiconductor devices.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This mechanical and climatic test method, as it relates to die shear strength, is a rewrite of
the test method contained in Clause 7, Chapter 2 of IEC 60749.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

– 4 – 60749-19 Ó IEC:2003+A1:2010
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 19: Die shear strength
1 Scope
This part of IEC 60749 determines (see note) the integrity of materials and procedures used
to attach semiconductor die to package headers or other substrates (for the purpose of this
test method, the term “semiconductor die” should be taken to include passive elements).
This test method is generally only applicable to cavity packages or as a process monitor. It is
not applicable for die areas greater than 10 mm . It is also not applicable to flip chip
technology or to flexible substrates.
NOTE 1 This determination is based on a measure of the force applied to the die or to the element, and, if a
failure occurs, the type of failure resulting from the application of force and the visual appearance of the residual
die attach medium and the header/substrate metallization.
NOTE 2 In cavity packages, die shear strength is measured in order to assure the strength of the die attachment
within the cavity.
In non-cavity packages, such as plastic encapsulated packages, die bonding is used to prevent die movement until
the resin mould is completely cured. Normally, specification of the die shear strength and the minimum adhesion
area of die bond after moulding are unnecessary, except in the following circumstances:
– when the die needs to be electrically connected to die pad;
– when heat from the die needs to be diffused through the die bond.
2 Description of the test apparatus
The apparatus for this test shall consist of a load applying instrument in the form of a linear
motion force-applying instrument or a circular dynamometer with a lever arm. In addition it
shall have the following:
a) a contact tool which applies a uniform load to the edge of the die, perpendicular to the die
mounting plane of the package or substrate (see Figure 3). A compliant material on the
contact tool may be used to ensure that the load is applied uniformly (see Figure 1);
b) an accuracy of 5 % of full scale or ±0,5 N, whichever is the greater tolerance;
c) a means of indicating the load applied;
d) a facility, fitted with suitable light source, to allow visual observation (e.g. at 10´
magnification) of the die and contact tool during testing;
e) a fixture with rotational capability relative to the die contact tool and package/substrate
holding fixture to allow line contact of the tool along the whole edge of the die from end to
end (see Figure 2).
NOTE Many measuring equipments are graduated in kilogram-force (kgf) (1 kgf = 9,8 N).

60749-19 Ó IEC:2003+A1:2010 – 5 –
3 Test method
A force sufficient to shear the die from its mounting, or equal to twice the minimum specified
shear strength (see Clause 4), whichever is the smaller, shall be applied to the die using the
apparatus of Clause 2, with the following provisions.
a) When a linear motion force-applying instrument is used, the direction of the applied force
shall be parallel with the plane of the header or substrate and perpendicular to the die
being tested.
b) When a circular dynamometer with a lever arm is employed to apply the force required for
testing, it shall be pivoted about the lever arm axis and the motion shall be parallel with
the plane of the header or substrate and perpendicular to the edge of the die being tested.
The contact tooling attached to the lever arm shall be at a proper distance to ensure an
accurate value of applied force.
c) The die contact tool shall load against an edge of the die which most closely approximates
a 90° angle with the base of the header or substrate to which it is bonded (see Figure 3).
d) After initial contact with the die edge and during the application of force, the contact tool
shall not move vertically with respect to the die such that contact is made with the
header/substrate or die attach medium. If the tool rides over the die, a new die may be
substituted or the die may be repositioned, provided that the requirements of item c) of
Clause 3 are met.
4 Failure criteria
The strength of attachment of a die shall be considered to have failed the test if any of the
following criteria exists:
a) Unless otherwise specified in the relevant specification, die separation at a force not
greater than the following:
2 2
1) 4,1 mm £ die area £ 10 mm : 25 N,
2 2
2)
...