IEC 60194:2006

INTERNATIONAL IEC
STANDARD 60194
Fifth edition
2006-02
Printed board design, manufacture
and assembly –
Terms and definitions
Reference number
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INTERNATIONAL IEC
STANDARD 60194
Fifth edition
2006-02
Printed board design, manufacture
and assembly –
Terms and definitions
 IEC 2006  Copyright - all rights reserved
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– 2 – 60194  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
FOREWORD
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International Standard IEC 60194 has been prepared by IEC technical committee 91: Electronics assembly
technology.
This fifth edition cancels and replaces the fourth edition (1999) and constitutes a technical revision.
The major change with regard to the previous edition concerns the addition of some four hundred new terms
necessary to industry, added as a result of considerable development in assembly technology in recent years.
The text of this standard is based on the following documents:
FDIS Report on voting
91/566/FDIS 91/578/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the
above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60194 should be read in conjunction with IEC 60050(541) which provides for basic technical terms for board
assembly technology not included in this standard.

60194  IEC:2006(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until the maintenance
result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific
publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this standard may be issued at a later date.

– 4 – 60194  IEC:2006(E)
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
1 Scope
This International Standard defines the terminology used in the field of printed circuit
boards and printed circuit board assembly products.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest
edition of the referenced document (including any amendments) applies.
IEC 60050(541), International Electrotechnical Vocabulary (IEV) – Chapter 541: Printed
circuits
3 General
The terms have been classified according to the decimal classification code (DCC) and this
DCC number appears to the right of the defined term. The DCC numbering is explained
fully in Annex A.
In order to avoid two ID numbers, the usual practice of numbering every paragraph (every
term and definition) in front of the paragraph has not been followed in this standard. The
official IEC number is the number which follows the DCC and the period (21.xxxx). Annex B
provides a list of acronyms listed numerically according to the DCC number.

60194  IEC:2006(E) – 5 –
4 Terms and definitions
Abrasion Resistance 54.1821 Acceptance Tests 92.0004
The ability of a material to withstand surface Those tests deemed necessary to determine
wear. the acceptability of a product and as agreed
to by both purchaser and vendor.
Abrasive Trimming 54.1318
Adjusting the value of a film component by Acceptance Inspection (Criteria) 92.0288
notching it with a finely- adjusted stream of An inspection that determines conformance
an abrasive material against the resistor
of a product to design specifications as the
surface.  basis for acceptance.

Absorption Coefficients 40.1727 Access Hole 60.1319
The degree to which various materials A series of holes in successive layers of a
absorb heat or radiant energy when multilayer board, each set having their
compared to each other.  centres on the same axis. These holes
provide access to the surface of the land on
Absorptivity, Infra-red 40.0087 one of the layers of the board. (See Figure
The ratio (or percentage) of the amount of A.1.)
energy absorbed by a substrate as
compared with the total amount of incident
energy.
Accelerated Aging 93.0001
A test in which the parameters such as
voltage and temperature are increased
above normal operating values to obtain
observable or measurable deterioration in a
relatively short period of time.
Figure A.1 – Access hole
Accelerated Life Test 93.0119
Access Protocol 21.0005
See “Accelerated Aging”.
An agreed principle for establishing how

nodes in a network communicate
Accelerated Test 93.0216
electronically.
A test to check the life expectancy of an

electronic component or electronic assembly
Accordion Contact 36.0006
in a short period of time by applying
A type of connector contact that consists of
physically severe condition(s) to the unit
a flat spring formed into a "Z" shape in order
under test.
to permit high deflection without overstress.

Accelerator 53.0002
Accuracy 90.0007
See “Catalyst”.
The deviation of the measured or observed

value from the true value.
Acceleration Factor (AF) 93.0260

The ratio of stress in reliability testing to the
Acid Flux 46.0009
normal operating condition.
A solution of an acid and an inorganic,

organic, or water soluble organic flux. (See
Acceptance Quality Level (AQL) 90.0003
also “Inorganic Flux,” “Organic Flux,” and
The maximum number of defectives likely to
“Water Soluble Organic Flux”.)
exist within a population (lot) that can be

considered to be contractually tolerable;
Acid Number 54.0010
normally associated with statistically derived
The amount of potassium hydroxide in
sampling plans.
milligrams that is required to neutralize one

gram of an acid medium.
– 6 – 60194  IEC:2006(E)
Acid Value 54.1217 Actual Size 90.0018
See “Acid Number”  The measured size.

Acid-Core Solder 46.0008 Additive Process 53.1322
Wire solder with a self-contained acid flux.  A Process for obtaining conductive patterns
by the selective deposition of conductive
Actinic Radiation 52.0011 material on clad or unclad base material.
Light energy that reacts with a (See also “Semi-Additive Process” and
photosensitive material in order to produce “Fully-Additive Process”.)
an image.
Add-On Component 30.0019
Active Desiccant 30.0397 Discrete or integrated packaged or chip
Desiccant that is either fresh (new) or has components that are attached to a film
been baked according to the manufacturer’s circuit in order to complete the circuit's
recommendations to renew desiccant to function.
original specifications.
Adhesion
Activated Rosin Flux 46.0012 (Pressure Sensitive Tape) 46.2038
A mixture of rosin and small amounts of The bond produced by contact between
organic-halide or organic-acid activators. pressure-sensitive adhesive and a surface.
(See also “Synthetic Activated Flux”.)
Adhesive 46.1728
Activating 53.0013 A substance such as glue or cement used to
A treatment that renders nonconductive fasten objects together. In surface mounting,
material receptive to electroless deposition.  an epoxy adhesive is used to adhere SMDs
to the substrate.
Activating Layer 53.0014
A layer of material that renders a Adhesion Failure 96.0020
nonconductive material receptive to The rupture of an adhesive bond such that
electroless deposition.  the separation appears to be at the
adhesive-adherent interface.
Activator 46.0015
A substance that improves the ability of a Adhesion Layer 74.0021
flux to remove surface oxides from the The metal layer that adheres a barrier metal
surfaces being joined. to a metal land on the surface of an
integrated circuit.
Active Device 30.0016
An electronic component whose basic Adhesion Promotion 53.0022
character changes while operating on an The chemical process of preparing a surface
applied signal. (This includes diodes, to enhance its ability to be bonded to
transistors, thyristors, and integrated circuits another surface or to accept an over-plate.
that are used for the rectification,
amplification, switching, etc., of analog or Adhesive Coated Substrate 41.0438
digital circuits in either monolithic or hybrid A base material upon which an adhesive
form.)  coating is applied, for the purpose of
retaining the conductive material (either
Active Metal 36.0017 additively applied or attached as foil for
A metal that has a very high electromotive subtractive processing), that becomes part
force.
of a metal-clad dielectric.
Active Trimming 54.1321 Adhesive-Coated Catalyzed Laminate
Adjusting the value of a film circuit element 41.1320
in order to obtain a specified functional A base material with a thin polymer coating,
output from the circuit while it is electrically that contains a plating catalyst, that i
...