IEC 60194:2006

INTERNATIONAL IEC
STANDARD 60194
Fifth edition
2006-02
Printed board design, manufacture
and assembly –
Terms and definitions
Reference number
Publication numbering
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INTERNATIONAL IEC
STANDARD 60194
Fifth edition
2006-02
Printed board design, manufacture
and assembly –
Terms and definitions
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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For price, see current catalogue

– 2 – 60194  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical
committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization
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responsible for identifying any or all such patent rights.

International Standard IEC 60194 has been prepared by IEC technical committee 91: Electronics assembly
technology.
This fifth edition cancels and replaces the fourth edition (1999) and constitutes a technical revision.
The major change with regard to the previous edition concerns the addition of some four hundred new terms
necessary to industry, added as a result of considerable development in assembly technology in recent years.
The text of this standard is based on the following documents:
FDIS Report on voting
91/566/FDIS 91/578/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the
above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60194 should be read in conjunction with IEC 60050(541) which provides for basic technical terms for board
assembly technology not included in this standard.

60194  IEC:2006(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until the maintenance
result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific
publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this standard may be issued at a later date.

– 4 – 60194  IEC:2006(E)
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –
TERMS AND DEFINITIONS
1 Scope
This International Standard defines the terminology used in the field of printed circuit
boards and printed circuit board assembly products.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest
edition of the referenced document (including any amendments) applies.
IEC 60050(541), International Electrotechnical Vocabulary (IEV) – Chapter 541: Printed
circuits
3 General
The terms have been classified according to the decimal classification code (DCC) and this
DCC number appears to the right of the defined term. The DCC numbering is explained
fully in Annex A.
In order to avoid two ID numbers, the usual practice of numbering every paragraph (every
term and definition) in front of the paragraph has not been followed in this standard. The
official IEC number is the number which follows the DCC and the period (21.xxxx). Annex B
provides a list of acronyms listed numerically according to the DCC number.

60194  IEC:2006(E) – 5 –
4 Terms and definitions
Abrasion Resistance 54.1821 Acceptance Tests 92.0004
The ability of a material to withstand surface Those tests deemed necessary to determine
wear. the acceptability of a product and as agreed
to by both purchaser and vendor.
Abrasive Trimming 54.1318
Adjusting the value of a film component by Acceptance Inspection (Criteria) 92.0288
notching it with a finely- adjusted stream of An inspection that determines conformance
an abrasive material against the resistor
of a product to design specifications as the
surface.  basis for acceptance.

Absorption Coefficients 40.1727 Access Hole 60.1319
The degree to which various materials A series of holes in successive layers of a
absorb heat or radiant energy when multilayer board, each set having their
compared to each other.  centres on the same axis. These holes
provide access to the surface of the land on
Absorptivity, Infra-red 40.0087 one of the layers of the board. (See Figure
The ratio (or percentage) of the amount of A.1.)
energy absorbed by a substrate as
compared with the total amount of incident
energy.
Accelerated Aging 93.0001
A test in which the parameters such as
voltage and temperature are increased
above normal operating values to obtain
observable or measurable deterioration in a
relatively short period of time.
Figure A.1 – Access hole
Accelerated Life Test 93.0119
Access Protocol 21.0005
See “Accelerated Aging”.
An agreed principle for establishing how

nodes in a network communicate
Accelerated Test 93.0216
electronically.
A test to check the life expectancy of an

electronic component or electronic assembly
Accordion Contact 36.0006
in a short period of time by applying
A type of connector contact that consists of
physically severe condition(s) to the unit
a flat spring formed into a "Z" shape in order
under test.
to permit high deflection without overstress.

Accelerator 53.0002
Accuracy 90.0007
See “Catalyst”.
The deviation of the measured or observed

value from the true value.
Acceleration Factor (AF) 93.0260

The ratio of stress in reliability testing to the
Acid Flux 46.0009
normal operating condition.
A solution of an acid and an inorganic,

organic, or water soluble organic flux. (See
Acceptance Quality Level (AQL) 90.0003
also “Inorganic Flux,” “Organic Flux,” and
The maximum number of defectives likely to
“Water Soluble Organic Flux”.)
exist within a population (lot) that can be

considered to be contractually tolerable;
Acid Number 54.0010
normally associated with statistically derived
The amount of potassium hydroxide in
sampling plans.
milligrams that is required to neutralize one

gram of an acid medium.
– 6 – 60194  IEC:2006(E)
Acid Value 54.1217 Actual Size 90.0018
See “Acid Number”  The measured size.

Acid-Core Solder 46.0008 Additive Process 53.1322
Wire solder with a self-contained acid flux.  A Process for obtaining conductive patterns
by the selective deposition of conductive
Actinic Radiation 52.0011 material on clad or unclad base material.
Light energy that reacts with a (See also “Semi-Additive Process” and
photosensitive material in order to produce “Fully-Additive Process”.)
an image.
Add-On Component 30.0019
Active Desiccant 30.0397 Discrete or integrated packaged or chip
Desiccant that is either fresh (new) or has components that are attached to a film
been baked according to the manufacturer’s circuit in order to complete the circuit's
recommendations to renew desiccant to function.
original specifications.
Adhesion
Activated Rosin Flux 46.0012 (Pressure Sensitive Tape) 46.2038
A mixture of rosin and small amounts of The bond produced by contact between
organic-halide or organic-acid activators. pressure-sensitive adhesive and a surface.
(See also “Synthetic Activated Flux”.)
Adhesive 46.1728
Activating 53.0013 A substance such as glue or cement used to
A treatment that renders nonconductive fasten objects together. In surface mounting,
material receptive to electroless deposition.  an epoxy adhesive is used to adhere SMDs
to the substrate.
Activating Layer 53.0014
A layer of material that renders a Adhesion Failure 96.0020
nonconductive material receptive to The rupture of an adhesive bond such that
electroless deposition.  the separation appears to be at the
adhesive-adherent interface.
Activator 46.0015
A substance that improves the ability of a Adhesion Layer 74.0021
flux to remove surface oxides from the The metal layer that adheres a barrier metal
surfaces being joined. to a metal land on the surface of an
integrated circuit.
Active Device 30.0016
An electronic component whose basic Adhesion Promotion 53.0022
character changes while operating on an The chemical process of preparing a surface
applied signal. (This includes diodes, to enhance its ability to be bonded to
transistors, thyristors, and integrated circuits another surface or to accept an over-plate.
that are used for the rectification,
amplification, switching, etc., of analog or Adhesive Coated Substrate 41.0438
digital circuits in either monolithic or hybrid A base material upon which an adhesive
form.)  coating is applied, for the purpose of
retaining the conductive material (either
Active Metal 36.0017 additively applied or attached as foil for
A metal that has a very high electromotive subtractive processing), that becomes part
force.
of a metal-clad dielectric.
Active Trimming 54.1321 Adhesive-Coated Catalyzed Laminate
Adjusting the value of a film circuit element 41.1320
in order to obtain a specified functional A base material with a thin polymer coating,
output from the circuit while it is electrically that contains a plating catalyst, that is
activated.  subsequently treated in order to obtain a
microporous surface.
60194  IEC:2006(E) – 7 –
Adhesive-Coated Uncatalyzed Alkaline Cleaner 76.0032
Laminate 41.1323 A material blended from alkali hydroxides
A base material with a thin polymer coating, and alkaline salts.
that does not contain a plating catalyst, that
is subsequently treated in order to obtain a All Metal Package 33.0579
microporous surface. A hybrid circuit package made solely of
metal, without glass or ceramic.
Adhesive Transfer
(Pressure Sensitive Tape) 75.0558 Allowable Temperature 75.0609
The transfer of adhesive from its normal The temperature range that an electronic
position on the pressure sensitive tape to the circuit or component can perform its
surface to which the tape was attached, intended functions.
either during unwind or removal.
Alloy, Tin Bismuth (Sn-Bi) 45.1947
Adsorbed Contaminant 96.0023 An alloy that is used as a lead free solder
A contaminant attracted to the surface of a and consisting of tin and bismuth as the
material that is held captive in the form of a main constituents. Sn-Bi58 has a low melting
gas, vapour or condensate.  point of 138 °C, but is not widely used
because of its brittle properties.
Advanced Statistical Method 91.0024
A statistical process analysis and control Alloy, Tin Copper (Sn-Cu) 45.1948
technique that is more- sophisticated and An alloy that is used as a lead free solder
less widely-applicable than basic statistical consisting of tin and copper considered to be
methods.  applicable for wave or reflow soldering.

Aging 90.0025 Alloy, Tin Silver (Sn-Ag) 45.1949
The change of a property, e.g. solderability, An alloy that is used as a lead free solder
with time. (See also “Accelerated Aging”.)  and consisting of tin and silver as the main
constituents used as a high temperature
Air Contamination 14.0026 solder.
See “Air Pollution”
Alloy, Tin Silver Bismuth
Air Pollution 14.0027 (Sn-Ag-Bi) 45.1950
Contamination of the atmosphere with An alloy that is used as a lead free solder
substances that are toxic or otherwise and consisting of tin, silver and bismuth as
harmful.  the main constituents. The Bi in Sn-Ag-Bi
alloy reduces the melting temperature. The
Algorithm 11.0849 higher the Bi content is, higher the
A set of procedures for the solution of a mechanical strength, but with poorer
problem in a series of steps.  elongation capability. There is a limit to Bi
content.
Alignment Mark 22.0030
A stylized pattern that is selectively Alloy, Tin Silver Copper
positioned on a substrate material to assist (Sn-Ag-Cu) 45.1951
in alignment. (See Figure A.2). An alloy that is used as a lead free solder
consisting of tin, silver and copper as the
main constituents.
Alloy, Tin Zinc (Sn-Zn) 45.1952
Figure A.2 – Alignment mark
An alloy that is used as a lead free solder
and consisting of tin and zinc as the main
Aliphatic Solvents 76.0031 constituents. Zn09 alloy has the melting
"Straight chain" solvents, derived from point of 199 °C, closest to the melting point
petroleum, of low solvent power.
of Sn-Pb alloy among lead free solders,

which allows soldering work at present
soldering temperatures, but tends to form a

– 8 – 60194  IEC:2006(E)
stable oxide film, causing difficulty in Analysis of Variance (ANOVA) 91.0038
securing a good solder wetting. The systematic method of statistically
Alpha Error 91.0033 evaluating experimental results in order to
The size of a Type I error or the probability separate the sources of variation.
of rejecting a hypothesis that is true.
Anchoring Spur 22.1325
Alphanumerical 25.1729 An extension of a land on a flexible printed
Pertaining to data that contain the letters of board that extends beneath the coverlayer to
an alphabet, the decimal digits, and may assist in holding the land to the base
contain control characters, special material. (See Figure A.3.)
characters and the space character.

Alpha Particle 35.0612
A He nucleus generated from a nuclear
decay that is capable of generating hole-

electron pairs in microelectronic devices and
Figure A.3 – Lands with anchoring spurs
switching cells causing soft errors in some

devices.
Angled Bond 74.0039
The impression of the first and second
Alternating Current (ac) 21.1793
bonds that are not in a straight line.
A current that varies with time, commonly

applied to a power source that switches
Anisotropic Conductive Contact 75.0675
polarity many times per second, in the shape
An electrical connection using an anisotropic
of a sinusoidal, square, or triangular wave.
conductive film or paste wherein conductive

particles of gold, silver, nickel, solder, etc.
Alternative Hypothesis 93.1324
are dispersed. When it is compressed, an
The supposition that a significant difference
electrical connection is attained only in the
exists between the desired results of two
direction of compression.
comparable populations. (See also “Null

Hypothesis” and “Statistical Hypothesis”.)
Anisotropy 40.0685
The condition for a substance having
Alumina Substrate 43.1730
differing values for properties, such as
Aluminum oxide used as a ceramic substrate
permittivity, depending on the direction
material.
within the material.
Ambient 29.0034
Annotation 22.0040
The surrounding environment coming into
Text, notes, or other identification,
contact with the system or component in
constructed by a computer-aided system,
question.
intended to be inserted on a drawing, map or

diagram.
Amorphous Polymer 40.0035
A polymer with a random and unstructured
Annular Ring
molecular configuration.
(Annular Width) 60.0041
That portion of conductive material
Amplitude, Voltage 21.0036
completely surrounding a hole. (See Figure
The magnitude of a voltage as measured
A.4).
with respect to a reference, such as a

ground plane.
Analog Circuit 21.0037
An electrical circuit that provides a
continuous relationship between its input
and output.
Figure A.4 – Annular ring (annular width)

60194  IEC:2006(E) – 9 –
Anode (BGA) 33.0689 Area Array Tape Automated
The electrode from which the forward current Bonding 74.0048
flows within the device. Tape automated Bonding where some carrier
tape terminations are made to lands within
Anodic Cleaning 57.0042 the perimeter of the die.
Electrolytic cleaning in which the work is the
anode.  Area Ratio 73.0758
The ratio of the area of aperture opening to
Aperture (stencil) 73.0690 the area of aperture walls.
An opening in the stencil-foil.
Array 22.0049
Apparent Field-of-View Angle 92.0043 A group of elements or circuits arranged in
The angular subtense of the field-of-view in rows and columns on a base material.
the image space of an optical system.
Artificial Intelligence 11.0050
Application Specific Integrated Circuit  The capacity of a machine to perform
(ASIC) 33.0692 functions that are normally associated with
A semiconductor device intended to satisfy a human intelligence, such as reasoning and
unique complete circuit function. learning.

Aqueous Flux 46.0044 Artwork 22.0051
See “Water Soluble Organic Flux” An accurately-scaled configuration that is
used to produce the "Artwork Master" or
Aramid 44.0045 "Production Master”. (See Figure A.6.)
See “Para-aramid”
Artwork Master 24.0052
Arc Resistance 92.0047 An accurately-scaled, usually 1:1, pattern
The resistance of a material to the effects of that is used to produce the "Production
a high voltage, low current arc (under Master”. (See Figure A.6.)
prescribed conditions) passing across the
surface of the material. (The resistance is As-Fired  45.0054
stated as a measure of total elapsed time at The condition (values) of thick-film
that voltage required to form a conductive components or the smoothness of ceramic
path on the surface - material carbonized by base materials, after they have been
the arc). processed in a firing furnace and prior to
trimming or polishing.
Architecture 11.0046
The structure of a computer's functional Aspect Ratio (Film)  74.0055
elements that makes it possess specific The ratio of the length of a film component to
maximum and minimum capabilities.  its width.

Area Array 34.0751 Aspect Ratio (Hole) 53.0056
A bonding pattern in which edge and The ratio of the length or depth of a hole to
additional pads on the inner surface area of its preplated diameter. (See Figure A.7.)
the chip are addressed in the bonding
scheme. (See Figure A.5).
Figure A.7 – Aspect ratio (hole)

Figure A.5 – Area array
– 10 – 60194  IEC:2006(E)
Aspect Ratio (stencil) 73.0808 Assignable Cause 91.0059
The ratio of the width of the aperture to the See “Special Cause”.
thickness of the stencil-foil.
Asymmetric Stripline  21.0060
Assembled Board 80.0057 A stripline signal conductor that is
See “Assembly”. embedded, but not centreed, between two
ground planes. (See Figure A.8).
Assembly 80.1327
A number of parts, subassemblies or
combinations thereof joined together. (Note:
This term can be used in conjunction with

other terms listed herein, e.g. "Printed Board

Assembly”.)
Figure A.8 – Asymmetric stripline

Assembly Drawing 26.1328
Attachment Density 22.1823
A document that depicts the physical rela-
The average number of surface mount or
tionship of two or more parts, a combination
through hole solder joints, based on pitch
of parts and subordinate assemblies, or a
and land size, that may be accommodated in
group of assemblies required to form an
a prescribed unit area e.g. cm , considering
assembly of a higher order.
land size within the unit area to

accommodate solder joint attachment.
Assembly Language 11.0058
A computer language made up of brief
Attenuation 21.0061
expressions that an assembler program can
The reduction in the amplitude of a signal
translate into a machine language.
due to losses in the media through which it

is transmitted. The unit of measure is
Assembly Manufacturer 70.1911
decibels (dB).
The individual, organization, or company

responsible for the assembly process and

verification operations necessary to ensure
full compliance of assemblies.

60194  IEC:2006(E) – 11 –
NOTE The term “original” may be used to preface any of the drafting and photographic-tooling terms used in this figure.
The “original” is not usually used in manufacturing processes. In the event that a “copy” is made, the copy must be of
sufficient accuracy to meet its intended purpose if it is to take on the name of any one of the terms used in this figure.
Other adjectives may also be used to help describe the kind of copy, i.e. “nonstable”, “first generation,” “record,” etc.
Figure A.6 – Simplified flow chart of printed board design/fabrication sequence

– 12 – 60194  IEC:2006(E)
Attributes Data 94.0062 B-Stage 41.1343
Qualitative data that can be counted for recording An intermediate stage in the reaction of a
and analysis purposes.  thermosetting resin in which the material softens

when heated and swells, but does not entirely fuse
Automated Component Insertion 72.0063 or dissolve when it is in contact with certain liquids.
The act or operation of assembling discrete (See also “C- Staged Resin”.)
components to printed boards by means of
electronically-controlled equipment.  B-Staged Material 41.0069
See “Prepreg”.
Automatic Component Placement 22.0029
Software that automatically optimizes the layout of B-Staged Resin 41.0070
components on a printed board.  A thermosetting resin that is in an intermediate state
of cure. (See also “C-Staged Resin”.)
Automatic Conductor Routing 22.0124
Software that automatically determines the Back Annotation 21.0072
placement of interconnections on a printed board.  The process of extracting appropriate information
from a completed printed board design and inserting
Automatic Dimensioning 25.1329 it on the boards schematic diagram.
A computer-aided drafting function that automatically
generates dimensions, leaders, arrowheads, etc., Back Bonding 74.0073
that make up a complete set of documented Attaching a die to a base material with its circuitry
dimensions.  facing away from the base material. (See
Figure B.1).
Automatic Test Equipment 92.0064
Equipment that automatically analyses functional or
static parameters in order to evaluate performance.

Automatic Test Generation 92.0065
Computer generation of a test program based solely
on circuit topology with little or no manual

programming effort.
Figure B.1 – Back Bonding
Axial Lead 31.0067
Lead wire extending from a component or module Back Mounting 74.0079
body along its longitudinal axis. (See Figure A.9). See “Back Bonding”.

Back Taper(s) 51.0081
The constant decrease in diameter along the length

of the body of a drill.
Figure A.9 – Axial Lead Back-Bared Land 22.0071
A land in flexible printed wiring that has a portion of
Azeotrope 49.0068 the side normally bonded to the base dielectric
See “Azeotropic Mixture”  material exposed by a clearance hole. (See
Figure B.2).
Azeotropic Mixture (Azeotrope) 49.1330
A liquid mixture of two or more substances that
behaves like a single substance. The vapour
produced by partial evaporization of the liquid has
the same composition as the liquid.

B Figure B.2 – Back-bared land

60194  IEC:2006(E) – 13 –
Backdriving 92.0074 Ball 34.0976
An in-circuit testing technique that drives digital A raised metal, (or other conductive material) feature
circuitry outputs to a given logic level, by supplying on a package substrate used to facilitate bonding to
pulses of sufficient electrical current magnitude in
the next level of interconnect.
parallel with the outputs, in order to overdrive the
logic state conditions of the next digital device inputs. Ball Array 34.1086
A group of balls arranged in rows and columns.
Backfill 36.0075
Filling a hybrid circuit package with a dry inert gas Ball Bond 74.0083
prior to hermetic sealing.  The welded connection of a bond wire to the bond
pad of an integrated circuit die. The bond wire is
Background (Artwork) 22.0076 melted to form a ball and the ball is bonded by use
The nonfunctional area of a phototool.  of thermocompression or thermosonic techniques.

Background Variable 94.0077 Ball Grid Array (BGA) 34.1096
A parameter of no experimental interest that is not A surface mount package wherein the bumps for
held at a constant value.  terminations are formed in a grid on the bottom of a
package. (See Figure B.3).
Backlighting 24.0078
Viewing or photographing by placing an object
between a light source and the eye or recording
medium.
Backpanel 85.0080
See “Backplane”.
Backplane 85.1331
An interconnection device used to provide point-to-
point electrical interconnections. (It is usually a
printed board that has discrete wiring Figure B.3 – Ball grid array (BGA)
terminals on one side and connector receptacles on
the other side.) (See also “Mother Board”.)  Ball Lift 74.2127
A category of ball bond failure in which the ball lifts
Backup Pin 70.0972 from the surface of the integrated circuit die bond
A supporting pin that is located under a printed pad metallization or lifts the metallization from the
board to prevent deflection of the board during surface of the underlying oxide or silicon.
component mounting.
Bar 70.1238
Backward Crosstalk 21.1332 The dark element of a bar code.
Noise induced into a quiet line, as seen at the end of
the quiet line that is closest to the signal source, Bar Code 70.1292
because the quiet line has been placed next to an A linear arrangement of bars and spaces in a
active line. (See also “Forward Crosstalk”.)  predetermined pattern.

Bake Out 56.0082 Bar Code Marking 70.1731
Subjecting a product to an elevated temperature in An identification code consisting of a pattern of
order to remove moisture and unwanted gasses vertical bars whose width and spacing identifies the
prior to certain steps in the printed board item marked.
manufacturing process or prior to final coating.
Bar Code Printer 70.1353
Balanced Transmission Line 21.1333  A printer with the ability to print bar coded labels and
A transmission line that has distributed inductance, forms.
capacitance, resistance, and conductance elements
that are equally distributed between its conductors.  Bar Code Scanner/Reader 70.1354
A device used for machine reading of a bar code.
Readers may be hand held-wands, fixed optical
beams, or moving optical beams.

– 14 – 60194  IEC:2006(E)
Bar Code Symbol 70.1370
A printed of photographically reproduced bar code Base Plane 30.2011
composed of parallel bars and spaces of various The plane that includes the lowest point of the
widths. A bar code symbol contains a leading quiet
mounting surface of the package, except for
zone, a start character, data characters, a stop packages using stand-offs.
character, and a trailing quiet zone. In some cases,
a check character is included. Base Solderability 92.0089
The ease with which a metal or metal alloy surface
Bare Board 60.0084 can be wetted by molten solder under minimum
An unassembled (unpopulated) printed board.  realistic conditions.

Barrel Crack 96.1444 Baseline Dimensioning 26.0086
A crack of the plated metal on the internal wall of a The maximum variation between two features that is
through-hole. (See also “Circumferential Crack”.) equal to the sum of the tolerances on the two feature
(See Figure B.4). location dimensions taken from the same origin.
(See Figure B.5.)
Figure B.4 – Barrel crack
Barrier Metal 74.0085
A metal used to seal the semiconductor-die lands.

Base Film ( relating to Flexible Circuits) 40.1471
The film that is the base material for the flexible

printed wiring board and on the surface of which the
conductive pattern can be formed. When the heat
Figure B.5 – Example of feature location
resistance is required, polyimide film is mostly used,
and polyester film is usually used when the heat using baseline dimensions
resistance is not required.
Basic Dimension 26.1335
Base Material 40.1334 A numerical value used to describe the theoretical
The insulating material upon which a conductive exact location of a feature or hole. (It is the basis
pattern may be formed. (The base material may be from which permissible variations are established by
rigid or flexible, or both. It may be a dielectric or tolerance on other dimensions in notes or by feature
insulated metal sheet.) control symbols.)

Base Material Thickness 22.1604 Basic Specification (BS) 26.1778
The thickness of the base material excluding A document that describes the common elements
conductive foil or material deposited on the surfaces. for a set, family or group of products, materials, or
services.
Base Metal 45.0088
Basic Statistical Method 91.1336
See “Basis Metal”.
The application of a theory of variation through the
Base Metal (Solder) 46.1491 use of basic problem-solving techniques and
The underlying metal surface to be wetted by solder, statistical process control. (This includes control and
also referred to as basis metal. capability analysis for both variables and attributes
data.)
60194  IEC:2006(E) – 15 –
Basic Wettability 70.0090 Beam-Lead Device 33.0098
The ease with which a metal or metal alloy can be An active or passive chip component with beam
wetted by molten solder. leads for interconnecting it to lands on a base

material. (See Figure B.7).
Basis Material 40.0091
Material upon which coatings are deposited.

Basis Metal 45.0092
A metal upon which coatings are deposited.

Batch Oven 56.0093 Figure B.7 – Beam-lead device
A large temperature-controlled oven that is used to
heat clean rolls of fabric.  Bed-of-Nails Fixture 92.0101
A test fixture consisting of a frame and a holder
Batch Processing 11.0094 containing a field of spring-loaded pins that make
Executing a computer-aided program without electrical contact with a planar test object.
human input.
Bellows Contact        36.1337
A type connector contact that consists of a flat spring
Batch Size 17.0095
See “Lot Size” that has been folded to provide a very uniform spring
rate over the full tolerance range of the mating part.
Bathtub Curve 93.0096
A plot of failures versus time. (See Figure B.6). Benchmark, Computer 11.0102
A standard measure of the performance of
computers relative to each other, including set-up
time, program generation, and data processing
capability.
Benchmark, Testing 92.0103
A standard measure of the performance of testers
relative to each other, including set-up time, test
program generation, and fixturing.

Figure B.6 – Bathtub curve Bending Resistance 92.1565
The ability of a material to withstand repeated
Baume 92.0097 bending to specified parameters without producing
An arbitrary scale of specific gravities used in the cracks and breaks in excess of the specification
gradation of hydrometers.  allowance.

Bead (Discrete Wiring) 64.1555 Beta Error 91.0104
The external (surface) annular ring of copper plating The size of a Type II error or the probability of
around a plated-through hole on a fully additive accepting a hypothesis that is false.
circuit board which functions to conduct heat and
promote solder wicking during the soldering of Bias (Fabric) 44.0105
components. Filling yarn that is off-square with the warp ends of a
fabric.
Beam Lead 33.0100
A component terminal in the form of a long metallic Bifurcated Contact 36.1810
structural member that is not supported along its A type of connector contact that usually consists of a
length.  flat spring that has been slotted length-wise in order
to provide independent contact points with the
Beaming 44.0099 mating part.
The operation in which yarn from several section
beams is combined on the final warp beam.

– 16 – 60194  IEC:2006(E)
Blank 41.1339
An unprocessed or partially processed piece of base
material or metal- clad base material, that has been
cut from a sheet or panel, that has the rough
dimensions of a printed board. (See also “Panel”.)

Blanking 51.1574
Figure B.8 – Bifurcated solder terminal Cutting a sheet of material into pieces to the
specified blank design.
Bifurcated Solder Terminal 37.0106
A solder terminal with a slot or slit opening through Bleeding 52.0113
which one or more wires are placed prior to A condition in which a plated hole discharges
soldering. (See Figure B.8.) process material or solution from crevices or voids or
a condition in which a resist migrates beyond the
Bilateral Tolerance 26.1572 image area.
A tolerance in which variation is permitted in both
directions from the specified dimension. Blends 41.0114
Mixtures of resins.
Binder 47.0107
Material added to thick-film compositions and unfired Blind Via 22.0115
base materials to give them additional strength for A via extending only to one surface of a printed
pre-fire handling. (See also “Glass Binder”.)  board. (See Figure B.9.)

Binomial Distribution 94.0108
A discrete probability distribution that, with certain
assumptions, describes the variation of an attribute
(proportion).
Biochemical Oxygen Demand 92.0109

A standardized measure used for estimating the
degree of contamination of water. Figure B.9 – Blind and buried via

Biocide 76.0110 Blister 96.1340
Delamination in the form of a localized swelling and
A general name for any substance that kills or
inhibits the growth of micro-organisms.  separation between any of the layers of a lamination
base material, or between base material and
Bipolar Device 33.1573 conductive foil or protective coating.
A device in which both majority and minority carriers
are present. Bi-polar and Metal-Oxide Semi- Blocking Variables 94.0116
conductor (MOS) are the two most common device A relatively-homogeneous set of conditions within
types. which different conditions of primary variables are
compared.
Birdcage 37.1338
Stranded wire whereby the strands in the stripped Blow Hole 53.0117
portion between the covering of an insulated wire A void caused by outgassing.
and a soldered connection, or an end-tinned lead,
have separated from the normal lay of the strands.  Board 60.0118
See “Printed Board,” and “Multilayer Printed Board”.
Bismaleimide 41.0111
A resin that has the generic chemical structure of an Board Fabricator 50.1912
aromatic chemical group that is attached to two The individual, organization, or company
(or "Bis") maleimide groups.  responsible for the fabrication of the bare printed
board, including all process and verification
Bismaleimide Triazine 41.0112 operations necessary to ensure full compliance with
A resin that contains a mixture of bismaleimide and customer requirements.
triazine resins.
60194  IEC:2006(E) – 17 –
Board Thickness 41.1583 Bond-to-Bond Distance 74.0121
The thickness of the metal-clad base material or The distance from the bonding site on a die to the
printed wiring board including the conductive layer. corresponding bonding site on a lead frame,

interconnecting base material, etc.
Body Land Clearance 51.1341
That portion of the land diameter of a drill that is Bond-to-Die Distance 74.0122
decreased in order to provide clearance behind the The distance from the heel of a beam lead to the
margin. die.
Bond 74.0120 Bondability 74.1342
An interconnection that performs a permanent Those surface characteristics and conditions of
electrical and/or mechanical function.  cleanliness of a bonding area that must exist in
order to provide for the capability to achieve a
Bond Deformation 74.0123 successful termination.
The plastic-flow change in the form of a lead caused
by a bonding tool during a termination process.  Bonding Area 74.0128
The area defined by the extent of a land or portion of
Bond Enhancement Treatment 74.0125 a terminal to which a lead is to be bonded.
The improvement of the adhesion of a metal foil
surface to an adjacent layer of material to which it is Bonding, Die 74.0127
being attached. See “Die Bonding”.

Bond Envelope 74.0126 Bonding Island 74.0129
The range of termination parameters within which See “Bonding Area”.
acceptable bonds may be formed.
Bonding Layer 55.0130
Bond Interface 74.0133 An adhesive layer used in bonding together other
The common area between a lead and a land to discrete layers of a multilayer printed board during
which it has been terminated.  lamination.

Bond Land 74.0134 Bonding Pad (IC) 33.1585
See “Bonding Area”.  An area of metallization on an integrated circuit die
that permit connection of fine wires or circuit element
Bond Lift-Off 74.0135 to the die.
The failure mode whereby a bonded lead separates
from the surface to which it has been joined.  Bonding Time 70.1586
The time duration from the commencement of
Bond Schedule 74.0136 thermo heat-up until the reflow profile is completed.
The values of termination machine parameters.
Bonding Tool 74.0131
Bond Separation 74.0137 The instrument used to position leads or discrete
The distance between the termination points of the wires over a land and to impart sufficient energy to
first bond and the second bond.  complete the termination.

Bond Site 74.0138 Bonding Wire 74.0132
That portion of the bonding area where the actual Fine gold or aluminum wire used for making
termination takes place. electrical connections between lands, lead frames,
and terminals.
Bond Strength 60.0139
The force perpendicular to a board's surface Border Area 22.0142
required to separate two adjacent layers of the The region on a base material that is external to that
board, expressed as force per unit area.  of the end-product being fabricated within it.

Bond Surface 74.0141 Border Data 22.0143
See “Bonding Area”.  Patterns that appear in the border area, such as
tooling features, test patterns, and registration
marks.
– 18 – 60194  IEC:2006(E)
Boss 22.0144 Breakout 60.0148
See “Land”.  See “Hole Breakout”.

Boss (Connector) 37.0145
Bridging, Electrical 70.0149
A raised section on a connector that fits into a The unintentional formation of a conductive path
specific slot in the positive polarization or keying between conductors. (See also “Solder Bridging”.)
feature of a mating connector.
Brightness 24.0150
Bounce Pad (Discrete Wiring) 64.1588 See “Luminance”.
An isolated area in a copper plane which acts solely
as a stop for the laser drilling operation. Broken Pick 35.0151
A filling yarn that is missing from a portion of the
Bow (Fabric) 44.0146 width of a fabric.
Filling yarn
...