EN 62026-3:2015

SLOVENSKI STANDARD
01-februar-2016
1DGRPHãþD
SIST EN 62026-3:2009
Nizkonapetostne stikalne in krmilne naprave - Vmesniki krmilne naprave (CDIs) - 3.
del: DeviceNet
Low-voltage switchgear and controlgear - Controller-device interfaces (CDIs) - Part 3:
DeviceNet
Appareillage à basse tension - Interfaces appareil de commande-appareil (CDI) - Partie
3: DeviceNet
Ta slovenski standard je istoveten z: EN 62026-3:2015
ICS:
29.130.20 Nizkonapetostne stikalne in Low voltage switchgear and
krmilne naprave controlgear
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62026-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2015
ICS 29.130.20 Supersedes EN 62026-3:2009
English Version
Low-voltage switchgear and controlgear - Controller-device
interfaces (CDIs) - Part 3: DeviceNet
(IEC 62026-3:2014 + COR1:2015)
Appareillage à basse tension - Interfaces appareil de Niederspannungsschaltgeräte - Steuerung-Geräte-
commande-appareil (CDI) - Partie 3: DeviceNet Netzwerke (CDIs) - Teil 3: DeviceNet
(IEC 62026-3:2014 + COR1:2015) (IEC 62026-3:2014 + COR1:2015)
This European Standard was approved by CENELEC on 2014-10-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62026-3:2015 E
Foreword
The text of document 17B/1814/CDV, future edition 3 of IEC 62026-3 + Corrigendum March 2015,
prepared by SC 121A "Low-voltage switchgear and controlgear" of IEC/TC 121 " Switchgear and
controlgear and their assemblies for low voltage" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN 62026-3:2015.

The following dates are fixed:
• latest date by which the document has to be (dop) 2015-10-03
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2017-09-26
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
This document has been prepared under a mandate given to CENELEC by the European Commission
and the European Free Trade Association, and supports essential requirements of EU Directive.

For the relationship with EU Directive see informative Annex ZZ, which is an integral part of this
document.
This standard covers the Principle Elements of the Safety Objectives for Electrical Equipment
Designed for Use within Certain Voltage Limits (LVD - 2006/95/EC).

Endorsement notice
The text of the International Standard IEC 62026-3:2014 + Corrigendum March 2015 was approved by
CENELEC as a European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 61131-3:2013 NOTE Harmonized as EN 61131-3:2013.
IEC 61158 (Series) NOTE Harmonized as EN 61158 (Series).
IEC 61508 (Series) NOTE Harmonized as EN 61508 (Series).
IEC 61784-1 NOTE Harmonized as EN 61784-1.
IEC 61784-5-2 NOTE Harmonized as EN 61784-5-2.
ISO/IEC 7498-1:1994 NOTE Harmonized as EN ISO/IEC 7498-1:1995.

- 3 - EN 62026-3:2015
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 60529 1989 Degrees of protection provided by EN 60529 1991
enclosures (IP Code)
+EN 1993
60529:1991/corrige
ndum May 1993
IEC 60529:1989/A1 1999  EN 60529:1991/A1 2000
IEC 60529:1989/A2 2013  EN 60529:1991/A2 2013
IEC 60947-5-2 2007 Low-voltage switchgear and controlgear -- EN 60947-5-2 2007
Part 5-2: Control circuit devices and
switching elements - Proximity switches
+A1 2012  +A1 2012
IEC 61000-4-2 2008 Electromagnetic compatibility (EMC) -- Part EN 61000-4-2 2009
4-2: Testing and measurement techniques
- Electrostatic discharge immunity test
IEC 61000-4-3 2006 Electromagnetic compatibility (EMC) -- Part EN 61000-4-3 2006
4-3: Testing and measurement techniques
- Radiated, radio-frequency,
electromagnetic field immunity test
+A1 2007  +A1 2008
+A2 2010  +A2 2010
IEC 61000-4-4 2012 Electromagnetic compatibility (EMC) -- Part EN 61000-4-4 2012
4-4: Testing and measurement techniques
- Electrical fast transient/burst immunity
test
IEC 61000-4-5 2005 Electromagnetic compatibility (EMC) -- Part EN 61000-4-5 2006
4-5: Testing and measurement techniques
- Surge immunity test
IEC 61000-4-6 2013 Electromagnetic compatibility (EMC) -- Part EN 61000-4-6 2014
4-6: Testing and measurement techniques
- Immunity to conducted disturbances,
induced by radio-frequency fields
IEC 61158-4-2 2014 Industrial communication networks - EN 61158-4-2 2014
Fieldbus specifications - Part 4-2: Data-link
layer protocol specification - Type 2
elements
IEC 61158-5-2 2014 Industrial communication networks - EN 61158-5-2 2014
Fieldbus specifications -- Part 5-2:
Application layer service definition - Type 2
elements
IEC 61158-6-2 2014 Industrial communication networks - EN 61158-6-2 2014
Fieldbus specifications - Part 6-2:
Application layer protocol specification -
Type 2 elements
IEC 61784-3-2 -  Industrial communication networks - EN 61784-3-2 -
Profiles -- Part 3-2: Functional safety
fieldbuses - Additional specifications for
CPF 2
IEC 62026-1 2007 Low-voltage switchgear and controlgear - EN 62026-1 2007
Controller-device interfaces (CDIs) -- Part
1: General rules
ISO 11898-1 2003 Road vehicles_- Controller area network - -
(CAN)_- Part_1: Data link layer and
physical signalling
ISO 11898-2 2003 Road vehicles_- Controller area network - -
(CAN)_- Part_2: High-speed medium
access unit
ANSI B93.55M- Hydraulic Fluid Power Solenoid-piloted - -
1981 Industrial Valves - Interface Dimensions
for Electrical Connectors
ASTM D 4566-94 -  Standard Test Methods for Electrical - -
Performance Properties of Insulations and
Jackets for Telecommunications Wire and
Cable
CISPR 11 (mod) 2009 Industrial, scientific and medical equipment EN 55011 2009
- Radio-frequency disturbance
characteristics - Limits and methods of
measurement
+prA
+AA
CISPR 11:2009/A1 2010  EN 55011:2009/A1 2010

- 5 - EN 62026-3:2015
Annex ZZ
(informative)
Coverage of Essential Requirements of EU Directives
This European Standard has been prepared under a mandate given to CENELEC by the European
Commission and the European Free Trade Association and within its scope the standard covers
protection requirements of Annex I Article 1 of the EU Directive 2004/108/EC.
Compliance with this standard provides presumption of conformity with the specified essential
requirements of the Directives concerned.
NOTE: Other requirements and other EU Directives may be applicable to the products falling within the scope of
this standard.
IEC 62026-3 ®
Edition 3.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Low-voltage switchgear and controlgear – Controller-device interfaces (CDIs) –

Part 3: DeviceNet
Appareillage à basse tension – Interfaces appareil de commande-appareil (CDI) –

Partie 3: DeviceNet
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
XF
CODE PRIX
ICS 29.130.20 ISBN 978-2-8322-1792-4

– 2 – IEC 62026-3:2014  IEC 2014
CONTENTS
FOREWORD . 8
INTRODUCTION . 10
1 Scope . 11
2 Normative references. 11
3 Terms, definitions, symbols and abbreviated terms . 12
3.1 Terms and definitions . 12
3.2 Symbols and abbreviated terms . 18
4 Classification . 18
4.1 General . 18
4.2 DeviceNet communication model . 19
4.3 DeviceNet, CAN and CIP™ . 20
5 Characteristics . 21
5.1 DeviceNet connections . 21
5.1.1 General . 21
5.1.2 DeviceNet’s use of the CAN identifier field . 21
5.1.3 Connection establishment . 22
5.2 DeviceNet messaging protocol . 23
5.2.1 Explicit messaging . 23
5.2.2 Input/output messaging . 34
5.2.3 Fragmentation/reassembly . 35
5.2.4 Offline connection set . 39
5.2.5 Device heartbeat . 49
5.2.6 Device shutdown message . 50
5.2.7 Duplicate MAC ID detection protocol . 52
5.2.8 Quick connect . 53
5.3 DeviceNet communication object classes . 53
5.3.1 General . 53
5.3.2 Identity object class definition (class ID code: 0x01) . 53
5.3.3 Message router object class definition (class ID code: 0x02) . 54
5.3.4 DeviceNet object class definition (class ID code: 0x03) . 54
5.3.5 Connection object class definition (class ID code: 0x05) . 54
5.3.6 Acknowledge handler object class definition (class ID code: 0x2B) . 55
5.4 Link access state machine . 55
5.4.1 General . 55
5.4.2 State transition diagram and event matrix . 55
5.4.3 Duplicate MAC ID detection . 58
5.5 Predefined master/slave connection set . 58
5.5.1 General . 58
5.5.2 Predefined master/slave connection set messages . 59
5.5.3 DeviceNet object class specific services for the master/slave connection
set . 61
5.5.4 Slave connection object characteristics . 68
5.5.5 Master connection object characteristics . 73
5.5.6 Bit-strobe command/response messages . 73
5.5.7 Poll command/response messages . 74
5.5.8 Multicast poll command/response messages . 75
5.5.9 Change of state/cyclic connections . 75

IEC 62026-3:2014  IEC 2014 – 3 –
5.5.10 Group 2 only devices . 77
5.6 CIP Safety™ on DeviceNet . 78
5.6.1 General . 78
5.6.2 Use of CAN identifiers for CIP Safety on DeviceNet . 78
5.7 Physical layer . 78
5.7.1 General . 78
5.7.2 Transceiver . 80
5.7.3 Grounding . 81
5.7.4 Isolation . 81
5.7.5 Transmission medium . 83
5.7.6 Topology . 83
5.7.7 Link power . 84
6 Product information . 85
7 Normal service, mounting and transport conditions . 85
7.1 Normal service conditions . 85
7.1.1 General . 85
7.1.2 Ambient air temperature . 85
7.1.3 Altitude . 86
7.1.4 Climatic conditions . 86
7.2 Conditions during transport and storage . 86
7.3 Mounting . 86
8 Constructional and performance requirements . 86
8.1 Indicators and configuration switches . 86
8.2 DeviceNet cable . 87
8.2.1 Overview . 87
8.2.2 Cable profile template . 87
8.2.3 Thick cable profile . 88
8.2.4 Thin cable profile . 92
8.2.5 Flat cable profile . 95
8.3 Terminating resistors . 98
8.4 Connectors . 98
8.4.1 General specifications . 98
8.4.2 Connector profile template . 98
8.4.3 Open connector profile . 99
8.4.4 Sealed mini connector profile . 102
8.4.5 Sealed micro connector profile . 103
8.4.6 Flat trunk connector profile . 104
8.5 Device taps and power taps . 107
8.5.1 Device taps . 107
8.5.2 Power taps. 108
8.6 Link powered devices . 109
8.7 Miswiring protection . 109
8.8 Power supplies . 109
8.9 Electromagnetic compatibility (EMC) . 110
8.9.1 General . 110
8.9.2 Immunity . 110
8.9.3 Emissions . 111
8.10 Additional functional safety requirements related to EMC . 112
9 Tests . 112

– 4 – IEC 62026-3:2014  IEC 2014
9.1 General . 112
9.2 Electrical and EMC testing . 112
9.2.1 Test of the DeviceNet power supply . 112
9.2.2 Device peak current consumption . 113
9.2.3 Power ON behaviour . 113
9.2.4 Reverse connection of V+ and V− . 114
9.2.5 Disconnection of V− . 115
9.2.6 Differential input impedance test . 115
9.2.7 Transmit levels . 115
9.2.8 Acknowledge delay . 116
9.2.9 CDI tests . 117
9.2.10 Electromagnetic compatibility testing . 118
9.3 Logical testing . 120
9.3.1 General . 120
9.3.2 Duplicate MAC ID check test . 120
9.3.3 UCMM . 121
9.3.4 Allocation of predefined master/slave connection set – Explicit
messaging connection . 122
9.3.5 Allocation of predefined master/slave connection set – I/O messaging
connection . 122
9.3.6 Logical testing of safety products . 123
Bibliography . 124

Figure 1 – Typical DeviceNet controller-device interfaces . 19
Figure 2 – DeviceNet protocol architecture compared with the OSI reference model . 20
Figure 3 – DeviceNet’s use of the CAN identifier field . 21
Figure 4 – Explicit message CAN data field use . 23
Figure 5 – Explicit message data field format. 23
Figure 6 – Explicit message header format . 24
Figure 7 – Service field format . 24
Figure 8 – Open explicit messaging connection request format . 26
Figure 9 – Open explicit messaging connection response format . 28
Figure 10 – Close connection request format . 30
Figure 11 – Close connection response format . 30
Figure 12 – Non-fragmented explicit request message format, values 0 – 3 . 32
Figure 13 – Non-fragmented explicit request message format, value 4 . 33
Figure 14 – Non-fragmented success response message format . 33
Figure 15 – Error response message . 34
Figure 16 – Data field of an I/O message . 34
Figure 17 – Format of DeviceNet fragmentation protocol . 35
Figure 18 – I/O message fragment format . 36
Figure 19 – Explicit message fragment format . 36
Figure 20 – Acknowledgement message format . 38
Figure 21 – Establishing the offline ownership . 40
Figure 22 – Multicast nature of the offline ownership . 41
Figure 23 – Offline ownership request message. 42

IEC 62026-3:2014  IEC 2014 – 5 –
Figure 24 – Offline ownership response message protocol . 42
Figure 25 – Communication faulted request message – Multicast protocol. 43
Figure 26 – Communication faulted request message – Point-to-point protocol . 44
Figure 27 – Identify communication faulted request message – Multicast protocol . 45
Figure 28 – Communication faulted identify response message . 46
Figure 29 – Identify communication faulted request message – Point-to-point protocol . 46
Figure 30 – Who communication faulted request message . 47
Figure 31 – Who response message . 48
Figure 32 – Change MAC ID communication faulted request message . 48
Figure 33 – Device heartbeat message. 49
Figure 34 – Device shutdown message . 51
Figure 35 – Duplicate MAC ID check CAN identifier field . 52
Figure 36 – Duplicate MAC ID check message data field format . 52
Figure 37 – Link access state transition diagram . 56
Figure 38 – Allocation choice byte contents . 61
Figure 39 – Allocate_master/slave_connection_set request message . 62
Figure 40 – Success response to allocate_master/slave_connection_set request . 63
Figure 41 – Parent explicit messaging connection logic . 65
Figure 42 – Release choice byte contents . 66
Figure 43 – Release_master/slave_connection set request message . 66
Figure 44 – Success response to release_master/slave_connection_set request . 67
Figure 45 – Predefined master/slave I/O connection state transition diagram . 69
Figure 46 – Predefined master/slave explicit messaging connection state transition
diagram . 71
Figure 47 – Physical layer block diagram . 79
Figure 48 – Device containing a non-isolated physical layer . 82
Figure 49 – Device containing an isolated physical layer . 83
Figure 50 – DeviceNet medium topology . 84
Figure 51 – Thick cable: physical configuration . 91
Figure 52 – Thick cable: current available on the DeviceNet power bus . 91
Figure 53 – Thin cable: physical configuration . 94
Figure 54 – Thin cable: current available on the DeviceNet power bus . 94
Figure 55 – Flat cable: physical configuration . 97
Figure 56 – Flat cable: current available on the DeviceNet power bus . 97
Figure 57 – Open connector pinout . 101
Figure 58 – Open connector geometry . 101
Figure 59 – Mini connector pinout . 103
Figure 60 – Micro connector pinout . 104
Figure 61 – Flat trunk connector layout – Part 1 . 106
Figure 62 – Flat trunk connector layout – Part 2 . 107
Figure 63 – Power supply rise time test circuit . 112
Figure 64 – Current consumption test circuit . 113
Figure 65 – Power ON test circuit . 114

– 6 – IEC 62026-3:2014  IEC 2014
Figure 66 – Test circuit for reversal of V+ and V− and also V− interruption . 114
Figure 67 – Differential impedance test circuit . 115
Figure 68 – Transmit level test setup . 116
Figure 69 – Transmit levels . 116
Figure 70 – Timing test setup . 117
Figure 71 – Timing . 117
Figure 72 – CDI test configuration . 118
Figure 73 – Test circuit for logical tests . 120

Table 1 – Message body format values . 27
Table 2 – Group select values . 27
Table 3 – Source message ID in open explicit messaging connection request . 28
Table 4 – Destination message ID in open explicit messaging connection response . 29
Table 5 – UCMM error conditions/codes . 31
Table 6 – Fragment type bit values . 35
Table 7 – Ack status bit values . 38
Table 8 – Offline connection set . 40
Table 9 – Addresses reporting based upon mask . 44
Table 10 – Device shutdown message shutdown code ranges . 51
Table 11 – Device shutdown message “Open” shutdown codes . 52
Table 12 – Link access state event matrix (1 of 2) . 56
Table 13 – Predefined master/slave connection set identifier fields . 60
Table 14 – Allocate_master/slave_connection_set request service data field
parameters . 61
Table 15 – Allocate_master/slave_connection set response parameters . 62
Table 16 – Release_master/slave_connection_set request service data field
parameters . 66
Table 17 – DeviceNet object specific additional error codes . 68
Table 18 – Connection instance IDs for predefined master/slave connections . 69
Table 19 – Predefined master/slave I/O connection state event matrix (1 of 2) . 70
Table 20 – Predefined master/slave explicit messaging connection state event matrix . 72
Table 21 – Predefined master/slave I/O connection object attribute access . 73
Table 22 – General physical layer characteristics . 79
Table 23 – Transmitter characteristics . 80
Table 24 – Receiver characteristics . 81
Table 25 – Load limits . 85
Table 26 – Cable profile: data pair specifications . 87
Table 27 – Cable profile: DC power pair specifications . 87
Table 28 – Cable profile: general specifications . 88
Table 29 – Cable profile: topology . 88
Table 30 – Thick cable: data pair specifications . 89
Table 31 – Thick cable: DC power pair specifications . 89
Table 32 – Thick cable: general specifications . 90
Table 33 – Thick cable: topology . 90

IEC 62026-3:2014  IEC 2014 – 7 –
Table 34 – Thick cable: maximum current available (A) based on network length . 91
Table 35 – Thin cable: data pair specifications . 92
Table 36 – Thin cable: DC power pair specifications . 93
Table 37 – Thin cable: general specifications . 93
Table 38 – Thin cable: topology . 93
Table 39 – Thin cable: maximum current available (A) based on network length . 94
Table 40 – Flat cable: data pair specifications . 95
Table 41 – Flat cable: DC power pair specifications . 96
Table 42 – Flat cable: general specifications . 96
Table 43 – Flat cable: topology . 96
Table 44 – Flat cable: maximum current available (A) based on network length . 97
Table 45 – Connector profile template . 99
Table 46 – Open connector . 100
Table 47 – Sealed mini connector . 102
Table 48 – Sealed micro connector (1 of 2) . 103
Table 49 – Flat trunk connector . 105
Table 50 – Internal pass-through conductor specifications . 108
Table 51 – Internal drop conductor specifications . 108
Table 52 – Internal pass-through conductor specifications . 108
Table 53 – Internal power drop conductor specifications . 109
Table 54 – Voltage regulator specifications . 109
Table 55 – DeviceNet power supply specifications . 110
Table 56 – Immunity performance criteria . 111

– 8 – IEC 62026-3:2014  IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR –
CONTROLLER-DEVICE INTERFACES (CDIs) –

Part 3: DeviceNet
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62026-3 has been prepared by subcommittee 121A: Low-voltage
switchgear and controlgear, of IEC technical committee 121: Switchgear and controlgear and
their assemblies for low voltage.
This third edition of IEC 62026-3 cancels and replaces the second edition published in 2008.
This third edition constitutes a technical revision.
The main changes with respect to the previous edition are the followings:
– specification of group 4 messages (5.1.2);
– clarifications on messaging protocol (5.2);
– addition of I/O multicast poll messages (5.5.2 and 5.5.8);
– clarifications on slave behaviour (5.5.4 and 5.5.9);
– clarifications on physical layer (transceiver) in 5.7;

IEC 62026-3:2014  IEC 2014 – 9 –
– miscellaneous corrections/clarifications on cable (8.2);
– clarifications on EMC testing (9.2.10) and logical testing (9.3).
The text of this standard is based on the following documents:
FDIS Report on voting
17B/1814/FDIS 121A/18/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with
...