FprEN IEC 62024-1:2024

SLOVENSKI STANDARD
oSIST prEN IEC 62024-1:2023
01-september-2023
Visokofrekvenčne induktivne komponente - Električne karakteristike in merilne
metode - 1. del: Čipni induktor v območju nanohenrijev
High frequency inductive components - Electrical characteristics and measuring methods
- Part 1: Nanohenry range chip inductor
Induktive Hochfrequenz-Bauelemente - Elektrische Eigenschaften und Messmethoden -
Teil 1: Chipinduktivitäten im Nanohenry-Bereich
Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de
mesure - Partie 1: Inductance à puce de l'ordre du nanohenry
Ta slovenski standard je istoveten z: prEN IEC 62024-1:2023
ICS:
29.100.10 Magnetne komponente Magnetic components
oSIST prEN IEC 62024-1:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 62024-1:2023
oSIST prEN IEC 62024-1:2023
51/1441/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62024-1 ED4
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-07-07 2023-09-29
SUPERSEDES DOCUMENTS:
51/1415/CD, 51/1424/CC
IEC TC 51 : MAGNETIC COMPONENTS, FERRITE AND MAGNETIC POWDER MATERIALS
SECRETARIAT: SECRETARY:
Japan Mr Takeshi Abe
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
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submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
High frequency inductive components - Electrical characteristics and measuring methods - Part 1:
Nanohenry range chip inductor
PROPOSED STABILITY DATE: 2028
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
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oSIST prEN IEC 62024-1:2023
IEC CDV 62024-1 © IEC 2023 2 51/1441/CDV

NOTE FROM TC/SC OFFICERS:
oSIST prEN IEC 62024-1:2023
51/1441/CDV 3 IEC CDV 62024-1 © IEC 2023

1 CONTENTS
3 FOREWORD . 5
4 1 Scope . 7
5 2 Normative references . 7
6 3 Terms and definitions . 7
7 4 Inductance, Q-factor and impedance . 7
8 4.1 Inductance . 7
9 4.1.1 Measuring method . 7
10 4.1.2 Measuring circuit . 8
11 4.1.3 Mounting the inductor for the test . 9
12 4.1.4 Measuring method and calculation formula . 11
13 4.1.5 Notes on measurement . 12
14 4.2 Quality factor . 13
15 4.2.1 Measuring method . 13
16 4.2.2 Measuring circuit . 13
17 4.2.3 Mounting the inductor for test . 14
18 4.2.4 Measuring methods and calculation formula . 14
19 4.2.5 Notes on measurement . 14
20 4.3 Impedance . 14
21 4.3.1 Measuring method . 14
22 4.3.2 Measuring circuit . 14
23 4.3.3 Mounting the inductor for test . 14
24 4.3.4 Measuring method and calculation . 14
25 4.3.5 Notes on measurement . 14
26 5 Resonance frequency . 14
27 5.1 Self-resonance frequency . 14
28 5.2 Minimum output method . 15
29 5.2.1 General . 15
30 5.2.2 Measuring circuit . 15
31 5.2.3 Mounting the inductor for test . 15
32 5.2.4 Measuring method and calculation formula . 16
33 5.2.5 Note on measurement . 16
34 5.3 Measurement by analyzer . 16
35 5.3.1 Measurement by impedance analyzer and one-port network analyzer . 16
36 5.3.2 Measurement by two-port network analyzer . 16
37 6 DC resistance . 17
38 6.1 Voltage-drop method. 17
39 6.1.1 Measuring circuit . 17
40 6.1.2 Measuring method and calculation formula . 17
41 6.2 Bridge method . 17
42 6.2.1 Measuring circuit . 17
43 6.2.2 Measuring method and calculation formula . 18
44 6.3 Notes on measurement . 18
45 6.4 Measuring temperature . 18
46 7 S parameter. 18
47 7.1 Measurement set-up and procedure . 18

oSIST prEN IEC 62024-1:2023
IEC CDV 62024-1 © IEC 2023 4 51/1441/CDV

48 7.1.1 General . 18
49 7.1.2 2-port S parameter . 19
50 7.1.3 Test fixture . 19
51 7.2 Calibrations and Verification of test setup . 21
52 7.2.1 General . 21
53 7.2.2 Calibration . 21
54 7.2.3 De-embedding . 24
55 7.3 Indirect Method of impedance . 24
56 7.3.1 Measurement set-up and procedure . 24
57 7.4 Evaluation from the 2-port S-parameter . 24
58 Annex A (normative) Mounting method for a surface mounting inductor . 27
59 A.1 Overview. 27
60 A.2 Mounting printed-circuit board and mounting land . 27
61 A.3 Solder . 27
62 A.4 Test condition . 27
63 A.5 Cleaning . 27
65 Figure 1 – Example of circuit for vector voltage/current method . 8
66 Figure 2 – Example of circuit for reflection coefficient method . 9
67 Figure 3 – Fixture A . 10
68 Figure 4 – Fixture B . 10
69 Figure 5 – Fixture C . 11
70 Figure 6 – Short device shape . 13
71 Figure 7 – Example of test circuit for the minimum output method . 15
72 Figure 8 – Self-resonance frequency test board (minimum output method) . 16
73 Figure 9 – Example of test circuit for voltage-drop method . 17
74 Figure 10 – Example of test circuit for bridge method . 18
75 Figure 11 – Schematic diagrams of the 2-port S-parameter measurement setup and the
76 network analyzer . 19
77 Figure 12 – S-parameter test fixture for two-terminal devices . 19
78 Figure 13 – Test fixture for a two-terminal device (Shunt connection) . 20
79 Figure 14 – Test fixture for a two-terminal device (Series connection) . 20
80 Figure 15 – Example of the standards for TRL calibration . 22
81 Figure 16 – Example of the standards for TRL calibration with microprobes . 23
82 Figure 17 – Example of full 2-port de-embedding with microprobes . 24
83 Figure 18 – 2-port measurement of a two-terminal device in shunt connection . 25
84 Figure 19 – 2-port measurement of a two-terminal device in series connection . 25
86 Table 1 – Dimensions of l and d . 10
87 Table 2 – Short device dimensions and inductances . 13
oSIST prEN IEC 62024-1:2023
51/1441/CDV 5 IEC CDV 62024-1 © IEC 2023

92 INTERNATIONAL ELECTROTECHNICAL COMMISSION
93 ____________
95 HIGH FREQUENCY INDUCTIVE COMPONENTS –
96 ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
98 Part 1: Nanohenry range chip inductor
100 FOREWORD
101 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
102 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
103 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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109 Standardization (ISO) in accordance with conditions determined by agreemen
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