EN 61760-1:2006

SLOVENSKI STANDARD
01-december-2006
1DGRPHãþD
SIST EN 61760-1:2001
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs) (IEC 61760-1:2006)
Surface mounting technology -- Part 1: Standard method for the specification of surface
mounting components (SMDs)
Oberflächenmontagetechnik -- Teil 1: Genormtes Verfahren zur Spezifizierung
oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface -- Partie 1: Méthode de normalisation pour la
spécification des composants montés en surface (CMS)
Ta slovenski standard je istoveten z: EN 61760-1:2006
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61760-1
NORME EUROPÉENNE
July 2006
EUROPÄISCHE NORM
ICS 31.240 Supersedes EN 61760-1:1998

English version
Surface mounting technology
Part 1: Standard method for the specification of
surface mounting components (SMDs)
(IEC 61760-1:2006)
Technique du montage en surface  Oberflächenmontagetechnik
Partie 1: Méthode de normalisation pour Teil 1: Genormtes Verfahren zur
la spécification des composants montés Spezifizierung oberflächenmontierbarer
en surface (CMS) Bauelemente (SMDs)
(CEI 61760-1:2006) (IEC 61760-1:2006)

This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-1:2006 E
Foreword
The text of document 91/577/FDIS, future edition 2 of IEC 61760-1, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61760-1 on 2006-06-01.
This European Standard supersedes EN 61760-1:1998.
The main changes with regard to EN 61760-1:1998 concern:
- requirements related to leadfree soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to EN 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering
heat has been deleted.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-03-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-06-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61760-1:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-1 NOTE  Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-69 NOTE  Harmonized as EN 60068-2-69:1996 (not modified).
__________
- 3 - EN 61760-1:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 60062 (mod) - Marking codes for resistors and capacitors EN 60062 2005

IEC 60068 Series Environmental testing EN 60068 Series

1) 2)
IEC 60068-2-21 - Environmental testing EN 60068-2-21 1999
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-45 1980 Environmental testing EN 60068-2-45 1992
+ A1 1993 Part 2: Tests - Test Xa and guidance: + A1 1993
Immersion in cleaning solvents

1) 2)
IEC 60068-2-58 - Environmental testing EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
1) 2)
IEC 60068-2-77 - Environmental testing EN 60068-2-77 1999
Part 2-77: Tests - Test 77: Body strength and
impact shock
IEC 60191-6 2004 Mechanical standardization of semiconductor EN 60191-6 2004
devices
Part 6: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages
1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions

1) 2)
IEC 60286-3 - Packaging of components for automatic EN 60286-3 1998
handling
Part 3: Packaging of surface mount
components on continuous tapes

1) 2)
IEC 60286-4 - Packaging of components for automatic EN 60286-4 1998
handling
Part 4: Stick magazines for electronic
components encapsulated in packages of
form E and G
1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
1) 2)
IEC 60286-5 - Packaging of components for automatic EN 60286-5 2004
handling
Part 5: Matrix trays
1) 2)
IEC 60286-6 - Packaging of components for automatic EN 60286-6 2004
handling
Part 6: Bulk case packaging for surface
mounting components
IEC 60749 Series Semiconductor devices - Mechanical and EN 60749 Series
climatic test methods
1) 2)
IEC 61340-5-1 - Electrostatics EN 61340-5-1 2001
Part 5-1: Protection of electronic devices from
electrostatic phenomena - General
requirements
1) 2)
IEC 61760-2 - Surface mounting technology EN 61760-2 1998
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide
1) 2)
IEC 62090 - Product package labels for electronic EN 62090 2003
components using bar code and two-
dimensional symbologies
1)
ISO 8601 - Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
INTERNATIONAL IEC
STANDARD 61760-1
Second edition
2006-04
Surface mounting technology –
Part 1:
Standard method for the specification
of surface mounting components (SMDs)

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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– 2 – 61760-1  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object .7
1.1 Scope.7
1.2 Object .7
2 Normative references.7
3 Terms and definitions .8
4 Requirements for component design and component specifications.10
4.1 General requirement.10
4.2 Packaging .10
4.3 Labelling of product packaging.10
4.4 Component marking .11
4.5 Storage and transportation.12
4.6 Component outline and design.12
4.7 Mechanical stress.16
4.8 Component reliability assurance .16
4.9 Additional requirements for compatibility with lead-free soldering .16
5 Specification of assembly process conditions .16
5.1 General .16
5.2 Securing the component on the substrate prior to soldering.18
5.3 Mounting methods .19
5.4 Cleaning (where applicable).20
5.5 Removal and/or replacement of SMDs .21
6 Typical process conditions .22
6.1 Soldering processes, temperature/time profiles .22
6.2 Typical cleaning conditions for assemblies .26
7 Requirements for components and component specifications related to suitability
with various mounting processes.27
7.1 General .27
7.2 Wettability .27
7.3 Resistance to dissolution of metallization .27
7.4 Resistance to soldering heat.27
7.5 Resistance to cleaning solvent.28
7.6 Soldering profiles.28
7.7 Bonding strength test for the component glue interface test.28

Bibliography .30

Figure 1 – Example of a component with marked specific orientation put in tape and tray.11
Figure 2 – Vacuum pipette, pick-up area and component compartment:
Example for a component with a flat surface.13
Figure 3 – Coplanarity of terminals .13
Figure 4 – Stable seating of component.14
Figure 5 – Unstable seating of component.14
Figure 6 – Terminals arranged peripherally in two rows.14

61760-1  IEC:2006(E) – 3 –
Figure 7 – Good contrast to component body and surroundings .14
Figure 8 – Component weight/pipette suction strength .15
Figure 9 – Process steps for soldering.17
Figure 10 – Process steps for gluing.18
Figure 11 – SnPb Vapour phase soldering – Temperature/time profile
(terminal temperature).22
Figure 12 – Lead-free SnAgCu Vapour phase soldering – Temperatu
...