EN 16602-30-11:2014

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila komponent EEERaumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-KomponentenAssurance produit des projets spatiaux - Derating des composants EEESpace product assurance - Derating - EEE components49.140Vesoljski sistemi in operacijeSpace systems and operationsICS:Ta slovenski standard je istoveten z:EN 16602-30-11:2014SIST EN 16602-30-11:2015en,fr,de01-januar-2015SIST EN 16602-30-11:2015SLOVENSKI
STANDARD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 16602-30-11
September 2014 ICS 49.140
English version
Space product assurance - Derating - EEE components
Assurance produit des projets spatiaux - Derating des composants EEE
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten This European Standard was approved by CEN on 13 March 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels © 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-30-11:2014 E SIST EN 16602-30-11:2015

Figures Figure 5-1: Parameter stress versus strength relationship . 15
Tabless Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-02 . 20 Table 6-2: Derating of parameters for capacitors family-group code 01-03 . 21 Table 6-3: Derating of parameters for capacitors family-group code . 22 SIST EN 16602-30-11:2015

Derating is a long standing practice applied to components used on spacecrafts. Benefits of this practice are now proven, but for competitiveness reasons, it becomes necessary to find an optimized reliability. Too high a derating can lead to over-design, over-cost and over-sizing of components, the direct consequence being excess volume and weight. The aim is to obtain reliable and high performance equipment without over-sizing of the components. For this reason and if possible, this Standard provides derating requirements depending on mission duration and mean temperature, taking into account demonstrated limits of component capabilities. SIST EN 16602-30-11:2015

The objective of this Standard is to provide customers with a guaranteed performance and reliability up to the equipment end-of-life. To this end, the following are specified:
• Load ratios or limits to reduce stress applied to components; • Application rules and recommendations. This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00. SIST EN 16602-30-11:2015

EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic and electromechanical (EEE) components
ESCC 2269010 Evaluation test programme for monolithic microwave integrated circuits (MMICS)
ESCC 2265010 Evaluation Test Programme for Discrete Microwave Semiconductors
temperature on the component package surface 3.2.3 derating
process of designing a product such that its components operate at a significantly reduced level of stress to increase reliability and to insure useful life
and design margins. 3.2.4 hot spot temperature highest measured or predicted temperature within any component 3.2.5 junction temperature
highest measured or predicted temperature at the junction within a semiconductor or micro-electronic device NOTE
Predicted temperature can be taken as Tcase + thermal resistance between junction and case times actual power (Watt) of the device. 3.2.6 load ratio
permissible operating level after derating has been applied; given as a percentage of a parameter rating 3.2.7 operating conditions
parameter stress and environment (temperature, vibration, shock and radiation) in which components are expected to operate SIST EN 16602-30-11:2015

maximum parameter value specified and guaranteed by the component manufacturer and component procurement specification NOTE
Rating is considered as a limit not to be exceeded during operation and constitutes in most cases the reference for derating. 3.2.11 surge strong rush or sweep [Collins dictionary and thesaurus] 3.2.12 transient brief change in the state of a system [Collins dictionary and thesaurus] 3.3 Abbreviated terms For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01 and the following apply: Abbreviation Meaning A/D analog to digital ASIC application specific integrated circuit C capacitance DRAM dynamic random access memory EEPROM electrical erasable programmable read only memory EPROM erasable programmable read only memory ESCC European Space Component Coordination ESR equivalent series resistance f frequency FET field effect transistor GaAs gallium arsenide ISO International Organization for Standardization InP indium posphide LED light emitting diode MOS metal on silicon SIST EN 16602-30-11:2015

National Aeronautics and Space Administration P power PROM programmable read only memory RadHard radiation hardened Ri insulation resistance RF radio-frequency SEBO single event burn-out SEGR single event gate rupture Si, SiGe silicon, silicon germanium SOA safe operating area SRAM static random access memory Tj junction temperature Tjmax absolute maximum rated junction temperature Top operating temperature VCE collector-emitter voltage
Derating participates in the protection of components from unexpected application anomalies and board design variations. The load ratios or limits given in clause 6 were derived from information available at the time of writing this Standard and do not preclude further derating for specific applications. This Standard also defines how to handle transients. 5.2 Principles of derating The component parameter strength defines the limits and the performance component technology in the particular application and varies from manufacturer to manufacturer, from type to type, and from lot to lot and can be represented by a statistical distribution. Likewise, component stress can be represented by a statistical distribution. Figure 5-1 illustrates the strength of a component and the stress applied at a given time, where each characteristic is represented by a probability density function.
A component operates in a reliable way if its parameter strength exceeds the parameter stress. The designer should ensure that the stress applied does not exceed the component parameter strength. This is represented by the intersection (shaded area) in Figure 5-1. The larger the shaded area, the higher the possibility of failure becomes.
There are two ways, which may be used simultaneously, in which the shaded area can be decreased: • Decrease the stress applied (which moves the stress distribution to the left).
• Increase the component parameter strength (by selecting over-sized components) thereby moving the strength distribution to the right.
The goal is to minimize the stress-to-strength ratio of the component. Derating moves the parameter stress distribution to the left while the selection processes applied to the components for space applications contribute to moving the SIST EN 16602-30-11:2015

stress distributionprobability densityregion of stress and strength interference where failures can occurstrength distributionparameter
Figure 5-1: Parameter stress versus strength relationship 5.3 Applicability and component selection 5.3.1 Overview This Standard applies to all components, selected for space applications, that are used for a significant duration. The meaning of “significant duration” is a period that contributes to the component life, for instance, one month is considered to be a significant duration. These requirements apply to screened components procured in accordance with approved space specifications.
This Standard only applies to approved components for which quality was proven after rigorous testing in accordance with ECSS-Q-ST-60. Derating applies on
normal operational conditions,
where
“normal” is
opposed to “fault” and “Operational” indicates
all functional
modes of the unit. Derating analysis is performed at the equipment maximum hot acceptance temperature, unless otherwise specified.
5.3.2 Requirements a. Derating shall be applied in consideration of temperature limits recommended by the manufacturer. b. The derating requirements of this Standard shall not be used as a justification to upgrade the quality level of components. SIST EN 16602-30-11:2015

f. The derating requirements are not applicable to test conditions (e.g. circuit or equipment level qualification and EMC) for which the maximum ratings shall not be exceeded. g. Derating requirements are not applicable to fault conditions, for which the maximum rating shall not be exceeded, with the exception defined in 5.3.2h. h. Where components are required to operate in protection mode or in fail-safe mode in order to prevent failure propagation (e.g. short-circuit protection), the components concerned shall meet the derating requirements and application rules when performing the protection or fail-safe function under the worst failure case (i.e. highest stress applied to the components that can last throughout the mission). 5.3.3 Requirements ESCC exceptions a. For a particular type or manufacturer, when a specific derating rule is defined in the appendix of the approved ESCC detail specification issued by the ESCC Executive, it shall take precedence over the generic requirement of this standard.
b. Users shall check for application the actual status of the ESCC Derating exceptions on the following ESCC web site page: ESCC Derating deviations
NOTE
A list of the ESCC detail specifications applicable at the time of publication and containing deviations to general derating requirements of this standard is available in informative Annex B.
c. Users shall clearly identify in the Parts Stress Analysis document the list of the ESCC Derating exceptions taken into consideration in their analysis.
For each category, the parameters to be derated are identified. The main parameters to be derated are:
• junction or case temperature;
• power (rating, dissipation); • voltage; • current. The parameters to be derated depend on component type. A stress balancing concept offers flexibility between one stress versus another (voltage and temperature). In some cases, e.g. resistors, derating has a direct impact on component performance. 5.4.2 Requirements for transient and surge conditions a. For transient or surge conditions, if ratings are provided, the same derating figures as for steady-state equivalent parameters shall be used. b. For transient or surge conditions, if ratings are not provided, then it shall be assured that the transient or surge values are below the steady-state specified maximum ratings. c. For all periodic signals or transient
conditions which are repeated or made incessant, the steady-state derating figures shall apply. d. <> e. As an exception in case clause 5.4.2c is not compatible for specific repeated and incessant transient use conditions, for the parts types and parameters listed, load ratio shall not exceed the steady state derated values +10 % or 80 % of the steady state rated values, which ever is lower: 1. Connectors: voltage, current 2. Ceramic Capacitors: voltage 3. Resistors: current
4. Diodes: current 5. Transistors_ bipolar , MOSFETs, power FETs: current. SIST EN 16602-30-11:2015

c. <>
d. Internal heating due to ESR can increase ageing and should be taken into account by applying a margin in temperature. Where ESR is not known at the frequency of a ripple current, an extrapolation of the ESR value and resonance (from manufacturer’s or test data) should be made where possible. 6.2.2 Derating a. Parameters of capacitors from family-group code 01-01 and 01-02 shall be derated as per Table 6-1. Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-02
6.2.3 Additional requirements not related to derating a. The dV/dt rating capability of the capacitors shall be respected. SIST EN 16602-30-11:2015

6.3.1 General a. The capacitor stress sum value of steady-state voltage and AC voltage shall not exceed the load ratio specified hereunder. For transients refer to clause 5.4. b. <>
c. Surge current shall be derated to 75 % of the Isurge max. Isurge max is defined as Vrated/(ESR+Rs). Vrated is the maximum rated voltage, ESR is the maximum specified value and Rs is the value of series resistance specified in the circuit for surge current testing as defined in the applicable procurement specification. d. Reverse voltage shall not exceed 75 % of the manufacturer’s specified maximum value for the reverse voltage. e. Ripple power shall never exceed 50 % of the manufacturer’s specified maximum value. f. Internal heating due to ESR can increase ageing and should be taken into account by applying a margin in temperature. Where ESR is not known at the frequency of a ripple current, an extrapolation of the ESR value and resonance (from manufacturer’s or test data) should be made where possible. 6.3.2 Derating a. Parameters of capacitors from family-group code 01-03 shall be derated as per Table 6-2. Table 6-2: Derating of parameters for capacitors family-group code 01-03
6.3.3 Additional requirements not related to derating a. 100 % surge current screening shall be applied for all surface mounted capacitors types. b. The dV/dt rating capability of the capacitors shall be respected. SIST EN 16602-30-11:2015

6.4.1 General a. Reverse voltage shall not exceed 75 % of the manufacturer’s specified maximum value for the reverse voltage. b. Manufacturer’s ratings for ripple power or current shall never be exceeded.
c. Internal heating due to ESR can increase ageing and should be taken into account by applying a margin in temperature. Where ESR is not known at the frequency of a ripple current, an extrapolation of the ESR value and resonance (from manufacturer’s or test data) should be made where possible. 6.4.2 Derating a. Parameters of capacitors from family-group code 01-04 shall be derated as per Table 6-3. Table 6-3: Derating of parameters for capacitors family-group code
6.4.3 Additional requirements not related to derating a. The dV/dt rating capability of the capacitors shall be respected. SIST EN 16602-30-11:2015

6.5.3 Additional requirements not related to derating a. Self healing requirements (if applicable): clearing recommendations from manufacturers shall be followed. b. The dV/dt rating capability of the capacitors shall be respected. SIST EN 16602-30-11:2015

6.6.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

6.7.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

6.8.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

6.9.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

6.10.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

Parameters Load ratio or limit Working voltage 50 % of specified voltage at any altitude (pin-to-pin and pin-to-shell). Current
50 %
Hot spot temperature
30 °C below maximum rated temperature.
6.11.3 Additional requirements not related to derating a. For power connectors, power and return lines shall be separated by at least one unassigned contact to reduce the short-circuit risk. b. Connector savers shall be used during testing of equipment to minimize number of mating and de-mating cycles. c. When multi-pin connectors are close to one another, they shall be configured such that mating with a wrong connector is not possible or the contact assignments shall be chosen such that mating with a wrong connector does not cause damage to the unit itself nor to any other element of the system. d. The connector and its constituent parts shall be from the same manufacturer. e. Maximum mating and de-mating cycles shall be limited to 50 cycles. SIST EN 16602-30-11:2015

Parameters Load ratio or limit RF power 75 %
Working voltage 50 % of specified voltage at any altitude (pin-to-pin and pin-to-shell). Hot spot temperature
30 °C below maximum rated temperature.
6.12.3 Additional requirements not related to derating a. Connector savers shall be used during testing of equipment to minimize number of mating and demating cycles. b. RF power shall be limited such that a 6 dB margin exists before the onset of multipactor. c. Maximum mating and de-mating cycles shall be limited to 50 cycles. SIST EN 16602-30-11:2015

Parameters
Load ratio or limit
Drive level 25 % power rated drive level (superseded by manufacturer required minimum drive level if not compatible).
6.13.3 Additional requirements not related to derating No additional requirement. SIST EN 16602-30-11:2015

75%
Reverse voltage (VR) 75 % Dissipated power (PD) 50 % (only if dissipated power is defined by the manufacturer) Junction temperature (Tj )
110 °C or Tj max - 40 °C (whichever is lower).
6.14.2.2 Diode (Zener, reference, transient suppression) derating table a. Parameters of Diode (Zener, reference, transient suppression) shall be derated as per Table 6-14. Table 6-14: Derating of parameters for Diode (Zener, reference, transient suppression) Parameters Load ratio or limit Dissipated power (PD) or Current (IZM) 65 % Junction temperature (Tj )
110 °C or Tj max - 40 °C (whichever is lower)
b. Where power cycling is critical this should be considered. c. The dV/dt rating capability of the diodes shall be respected.
6.15.1 General No general clause. 6.15.2 Derating a. Parameters of Diodes from family-group code 04-05, 04-11 to 04-13, 04-15, 04-16 and 04-17 shall be derated as per Table 6-15. Table 6-15: Derating of parameters for Diodes family-group code 04-05, 04-11 to 04-13, 04-15, 04-16 and 04-17 Parameters Load ratio or limit Forward current
50 %
Reverse voltage (VR) 75 %
Dissipated power (PD) 65 % Junction temperature (Tj ) 110 °C or Tj max - 40 °C (whichever is lower) NOTE 1: Forward current is not applicable to varactors. NOTE 2: Reverse voltage is not applicable to Gunn diodes.
6.15.3 Additional requirements not related to derating a. Some diodes can be radiation sensitive: the issue shall be recorde
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