EN 16602-30-11:2021
(Main)Space product assurance - Derating - EEE components
Space product assurance - Derating - EEE components
This Standard applies to all parties involved at all levels in the realization of space segment hardware and its interfaces.
The objective of this Standard is to provide customers with a guaranteed performance and reliability up to the equipment end-of-life. To this end, the following are specified:
- Load ratios or limits to reduce stress applied to components;
- Application rules and recommendations.
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten
Assurance produit des projets spatiaux - Détarage des composants EEE
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila komponent EEE
Ta standard se uporablja za vse, ki so na vseh ravneh vključeni v realizacijo vesoljske strojne opreme in njenih vmesnikov.
Cilj tega standarda je strankam zagotoviti zajamčeno zmogljivost in zanesljivost do konca življenjskega cikla opreme. V ta namen so določeni naslednji elementi:
– razmerja ali omejitve obremenitve za zmanjšanje stresa za komponente;
– pravila in priporočila glede uporabe.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2022
Nadomešča:
SIST EN 16602-30-11:2015
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila
komponent EEE
Space product assurance - Derating - EEE components
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten
Assurance produit des projets spatiaux - Détarage des composants EEE
Ta slovenski standard je istoveten z: EN 16602-30-11:2021
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 16602-30-11
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2021
ICS 49.140
Supersedes EN 16602-30-11:2014
English version
Space product assurance - Derating - EEE components
Assurance produit des projets spatiaux - Détarage des Raumfahrtproduktsicherung -
composants EEE Herabsetzen/Unterlastung von EEE-Komponenten
This European Standard was approved by CEN on 5 December 2021.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means
Ref. No. EN 16602-30-11:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 6
Introduction . 7
1 Scope. 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms from other standards . 10
3.2 Terms specific to the present standard . 10
3.3 Abbreviated terms . 11
3.4 Nomenclature . 12
4 User responsibility . 14
5 Derating . 15
5.1 Overview . 15
5.2 Principles of derating . 15
5.3 Applicability and component selection . 16
5.4 Derating parameters . 18
5.5 Additional rules and recommendations . 19
6 Tables for load ratios or limits . 20
6.1 Overview . 20
6.2 Capacitors: ceramic - family-group code: 01-01 and 01-02 . 21
6.3 Capacitors: solid tantalum - family-group code: 01-03 . 22
6.4 Capacitors: non-solid tantalum - family-group code: 01-04 . 24
6.5 Capacitors: Plastic metallized - family-group code: 01-05 . 25
6.6 Capacitors: glass and porcelain - family-group code: 01-06 . 27
6.7 Capacitors: mica and reconstituted mica - family-group code: 01-07 . 28
6.8 Capacitors: feedthrough - family-group code: 01-10 . 29
6.9 Capacitors: semiconductor technology (MOS type) - family-group code: 01-
11 . 30
6.10 Capacitors: miscellaneous (variable capacitors) - family-group code: 01-99 . 31
6.11 Connectors - family-group code: 02-01, 02-02, 02-03, 02-07 and 02-09 . 32
6.12 Connectors RF - family-group code: 02-05 . 34
6.13 Piezo-electric devices: crystal resonator - family-group code: 03-01 . 35
6.14 Diodes - family-group code: 04-01, 04-02, 04-03, 04-04, 04-06, 04-08, 04-
10 and 04-14 . 36
6.15 Diodes: RF/microwave - family-group code: 04-05, 04-11 to 04-13, 04-15,
04-16 and 04-17 . 38
6.16 Feedthrough filters - family-group code: 05-01 . 39
6.17 Fuses: Cermet (metal film on ceramic) - family-group code: 06-01 . 40
6.18 Inductors and transformers - family-group code: 07-01 to 07-03 and 14-01 . 41
6.19 Integrated circuits: logic - family-group code: 08-10, 08-20, 08-21, 08-29 to
08-42, and 08-80 . 42
6.20 Integrated circuits: non-volatile memories - family-group code: 08-22, 08-23
and 08-24 . 44
6.21 Integrated circuits: linear - family-group code: 08-50 to 08-60 and 08-69 . 46
6.22 Integrated circuits: linear converters - family-group code: 08-61 and 08-62 . 48
6.23 Integrated circuits: MMICs - family-group code: 08-95 . 49
6.24 Integrated circuits: miscellaneous - family-group code: 08-99 . 51
6.25 Relays and switches - family-group code: 09-01, 09-02 and 16-01 . 52
6.26 Resistors - family-group code: 10-01 to 10-11 . 55
6.27 Thermistors - family-group code: 11-01 to 11-03 . 59
6.28 Transistors: bipolar - family-group code: 12-01 to 12-04 and 12-09 . 60
6.29 Transistors: FET - family-group code: 12-05 and 12-06 . 62
6.30 Transistors: RF: bipolar - family-group code: 12-10 and 12-13 . 64
6.31 Transistors: RF: FET - family-group code: 12-12, 12-14, 12-15(FET) and 12-
16(FET) . 67
6.32 Wires and cables - family-group code: 13-01 to 13-03 . 70
6.33 Opto-electronics - family-group code: 18-01 to 18-05 . 74
6.34 RF passive components: family-group code: 30-01, 30-07, 30-09, 30-10 and
30-99 . 75
6.35 Fibre optic components: fibre and cable: family-group-code: 27-01 . 77
6.36 Hybrids . 78
Bibliography . 89
Figures
Figure 5-1: Parameter stress versus strength relationship . 16
Tables
Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-02 . 21
Table 6-2: Derating of parameters for capacitors family-group code 01-03 . 22
Table 6-3: Derating of parameters for capacitors family-group code . 24
Table 6-4: Derating of parameters for capacitors family-group code 01-05 . 26
Table 6-5: Derating of parameters for capacitors family-group code 01-06 . 27
Table 6-6: Derating of parameters for capacitors family-group code 01-07 . 28
Table 6-7: Derating of parameters for capacitors family-group code 01-10 . 29
Table 6-8: Derating of parameters for capacitors family-group code 01-11 . 30
Table 6-9: Derating of parameters for capacitors family-group code 01-99 . 31
Table 6-10: Derating of parameters for connectors family-group code 02-01, 02-02,
02-03, 02-07 and 02-09 . 32
Table 6-11: Derating of parameters for connectors RF family-group code 02-05 . 34
Table 6-12: Derating of parameters for piezo-electric devices family-group code 03-
01 . 35
Table 6-13: Derating of parameters for Diode (signal/switching, rectifier including
Schottky, pin) . 36
Table 6-14: Derating of parameters for Diode (Zener, reference, transient
suppression) . 37
Table 6-15: Derating of parameters for Diodes family-group code 04-05, 04-11 to 04-
13, 04-15, 04-16 and 04-17 . 38
Table 6-16: Derating of parameters for Feedthrough filters family-group code 05-01 . 39
Table 6-17: Derating of parameters for Fuses family-group code 06-01 . 40
Table 6-18: Derating of parameters for Inductors and transformers family-group code
07-01 to 07-03 and 14-01 . 41
Table 6-19: Derating of parameters for Integrated circuits family-group code: 08-10,
08-20, 08-21, 08-29 to 08-42, and 08-80 . 42
Table 6-20: Derating of parameters for Integrated circuits family-group code: 08-22,
08-23 and 08-24 . 44
Table 6-21: Derating of parameters for Integrated circuits family-group code 08-50 to
08-60 and 08-69 . 47
Table 6-22: Derating of parameters for Integrated circuits family-group code 08-61
and 08-62 . 48
Table 6-23:Derating of parameters for non-custom MMICs . 50
Table 6-24: Derating of parameters for Relays and switches family-group code 09-
01, 09-02 and 16-01 . 53
Table 6-25: Derating of parameters for Metal film precision resistor (type RNC,
except RNC 90) . 55
Table 6-26: Derating of parameters for Metal film semi-precision resistor (type RLR) . 55
Table 6-27: Derating of parameters for Foil resistor (type RNC 90) . 56
Table 6-28: Derating of parameters Wire-wound high precision resistor (type RBR
56) . 56
Table 6-29: Derating of parameters for Wire-wound power resistor (type RWR, RER) . 57
Table 6-30: Derating of parameters for Chip resistor (RM), network resistor . 57
Table 6-31: Derating of parameters for Carbon composition resistor . 57
Table 6-32: Derating of parameters for Heaters . 58
Table 6-33: Derating of parameters for Thick Film Power . 58
Table 6-34: Derating of parameters for Thermistors family-group code 11-01 to 11-03 . 59
Table 6-35: Derating of parameters for Transistors family-group code 12-01 to 12-04
and 12-09 . 60
Table
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