ASTM B32-00

NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: B 32 – 00
Standard Specification for
Solder Metal
This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope E 28 Test Method for Softening Point by Ring-and-Ball
Apparatus
1.1 This specification covers solder metal alloys (commonly
E 29 Practice for Using Significant Digits in Test Data to
known as soft solders) used in non-electronic applications,
Determine Conformance with Specifications
including but not limited to, tin-lead, tin-antimony, tin-
E 46 Test Methods for Chemical Analysis of Lead- and
antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-
Tin-Base Solder
silver, tin-copper-silver, and lead-tin-silver, used for the pur-
E 51 Method for Spectrographic Analysis of Tin Alloys by
pose of joining together two or more metals at temperatures
the Powder Technique
below their melting points. Electronic grade solder alloys and
E 55 Practice for Sampling Wrought Nonferrous Metals and
fluxed and non-fluxed solid solders for electronic soldering
Alloys for Determination of Chemical Composition
applications are not covered by this specification as they are
E 87 Methods for Chemical Analysis of Lead, Tin, Anti-
under the auspices of IPC - Association Connecting Electronic
mony, and Their Alloys (Photometric Method)
Industries.
E 88 Practice for Sampling Nonferrous Metals and Alloys
1.1.1 These solders include those alloys having a liquidus
in Cast Form for Determination of Chemical Composition
temperature not exceeding 800°F (430°C).
2.2 Federal Standard:
1.1.2 This specification includes solders in the form of solid
Fed. Std. No. 123 Marking for Shipment (Civil Agencies)
bars, ingots, powder and special forms, and in the form of solid
2.3 Military Standard:
and flux-core ribbon, wire, and solder paste.
MIL-STD-129 Marking for Shipment and Storage
1.2 The values stated in inch-pound units are to be regarded
as the standard. The values given in parentheses are for
3. Terminology
information only.
3.1 Definition:
1.3 This standard does not purport to address all of the
3.1.1 producer,, n—the primary manufacturer of the mate-
safety concerns, if any, associated with its use. It is the
rial.
responsibility of the user of this standard to establish appro-
3.2 Definitions of Terms Specific to This Standard:
priate safety and health practices and determine the applica-
3.2.1 lot,, n—The term “lot” as used in this specification is
bility of regulatory limitations prior to use.
defined as follows:
2. Referenced Documents 3.2.1.1 Discussion—For solid solder metal, a lot consists of
all solder of the same type designation, produced from the
2.1 ASTM Standards:
same batch of raw materials under essentially the same
D 269 Test Method for Insoluble Matter in Rosin and Rosin
conditions, and offered for inspection at one time.
Derivatives
3.2.1.2 Discussion—For flux–core solder, a lot consists of
D 464 Test Methods for Saponification Number of Naval
all solder of the same core mixture, produced from the same
Store Products Including Tall Oil and Other Related
2 batch of raw materials under essentially the same conditions
Products
and offered for inspection at one time.
D 465 Test Methods for Acid Number of Naval Stores
2 3.2.2 lot number,, n—The term “lot number” as used in this
Products Including Tall Oil and Other Related Products
D 509 Test Methods of Sampling and Grading Rosin
Annual Book of ASTM Standards, Vol 14.02.
Discontinued—See 1994 Annual Book of ASTM Standards, Vol 03.05.
Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.06.
1 6
This specification is under the jurisdiction of ASTM Committee B02 on Annual Book of ASTM Standards, Vol 03.05.
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.05.
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys. Available from Global Engineering Documents, 15 Inverness Way East,
Current edition approved Oct. 10, 2000. Published November 2000. Originally Englewood, CO 80112.
published as B 32–19 T. Last previous edition B 32-96. Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Annual Book of ASTM Standards, Vol 06.03. Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
B32
specification refers to an alpha-numeric or numerical designa- toluene–insoluble matter content of not more than 0.05
tion for a lot which is traceable to a date of manufacture. weight % in accordance with Test Method D 269, a minimum
acid number of 160 mg KOH/1 g sample in accordance with
4. Classification
Test Methods D 465, a minimum softening point of 70°C in
accordance with Test Method E 28, and a minimum saponifi-
4.1 Type Designation— The type designation uses the
cation number of 166 in accordance with Test Methods D 464.
following symbols to properly identify the material:
When solvents or plasticizers are added, they must be nonchlo-
4.1.1 Alloy Composition—The composition is identified by
rinated.
a two-letter symbol and a number. The letters typically indicate
7.2.2 Type RMA—The flux is composed of rosin conform-
the chemical symbol for the critical element in the solder and
ing to 7.2.1. Incorporated additives provide a material meeting
the number indicates the nominal percentage, by weight, of the
the requirements of 8.1.2 for type RMA. When solvents or
critical element in the solder. The designation followed by the
plasticizers are added, they must be nonchlorinated.
letters A or B distinguishes between different alloy grades of
7.2.3 Type RA—The flux is composed of rosin conforming
similar composition (see Table 1).
to 7.2.1. Incorporated additives provide a material meeting the
4.1.2 Form—The form is indicated by a single letter in
requirements of 8.1.2 for Type RA. When solvents or plasti-
accordance with Table 2.
cizers are added, they must be nonchlorinated.
4.1.3 Flux Type—The flux type is indicated by a letter or
7.2.4 Type OA—The flux is composed of one or more
combination of letters in accordance with Table 3.
water-soluble organic materials.
4.1.4 Core Condition and Flux Percentage (applicable only
7.2.5 Type OS—The flux is composed of one or more
to flux-cored solder)—The core condition and flux percentage
water-insoluble organic materials, other than Types R, RMA,
is identified by a single letter and a number in accordance with
and RA, which are soluble in organic solvents.
Table 4.
7.2.6 Type IS—The flux is composed of one or more
4.1.5 Powder Mesh Size and Flux Percentage (applicable
inorganic salts or acids with or without an organic binder and
only to solder paste)—The powder mesh size and flux percent-
solvents.
age is identified by a single letter and a number in accordance
with Table 5.
8. Physical Properties and Performance Requirements
5. Ordering Information 8.1 Solder Paste—Solder paste must exhibit smoothness of
texture (no lumps) and the absence of caking and drying.
5.1 Orders for material under this specification indicate the
8.1.1 Powder Mesh Size— The solder powder mesh size
following information, as required, to adequately describe the
shall be as specified (see 5.1.1 and 4.1.5) when the extracted
desired material.
solder powder is tested as specified in 13.4.
5.1.1 Type designation (see 4.1),
8.1.2 Viscosity—The viscosity of solder paste and the
5.1.2 Detailed requirements for special forms,
method used to determine the viscosity must be agreed upon
5.1.3 Dimensions of ribbon and wire solder (see 9.2),
between the supplier and purchaser. The following variables
5.1.4 Unit weight,
must be taken into account when relating one viscosity
5.1.5 Packaging (see Section 18),
measurement to another type of viscometer used, spindle size
5.1.6 Marking (see Section 17),
and shape, speed (r/min), temperature of sample, and the use or
5.1.7 ASTM specification number and issue, marked on (a)
non-use of a helipath.
purchase order and (b) package or spool, and
8.2 Requirements for Flux—The flux must meet the physi-
5.1.8 Special requirements, as agreed upon between sup-
cal and performance requirements specified in Table 6 as
plier and purchaser.
applicable.
8.2.1 Solder Pool— When solder is tested as specified in
6. Materials and Manufacture
13.3.2, there must be no spattering, as indicated by the
6.1 The producer must have each lot of solder metal as
presence of flux particles outside the main pool of residue. The
uniform in quality as practicable and of satisfactory appearance
flux must promote spreading of the molten solder over the
in accordance with best industrial practices. Each bar, ingot, or
coupon to form integrally thereon a coat of solder that shall
other form in which the solder is sold must be uniform in
feather out to a thin edge. The complete edge of the solder pool
composition with the entire lot.
must be clearly visible through the flux residue.
8.2.2 Dryness—When solder is tested as specified in 13.3.2,
7. Chemical Composition
the surface of the residue must be free of tackiness, permitting
7.1 Solder Alloy— The solder alloy composition is as
easy and complete removal of applied powdered chalk.
specified in Table 1.
8.2.3 Chlorides and Bromides Test—When the extracted
NOTE 1—By mutual agreement between supplier and purchaser, analy-
flux is tested as specified in 13.3.6, the test paper will show no
sis may be required and limits established for elements or compounds not
chlorides or bromides by a color change of the paper to
specified in Table 1.
off-white or yellow white.
7.2 Flux (applicable to flux-core ribbon, wire, and solder 8.2.4 Copper Mirror Test—When tested as specified in
paste): 13.3.7, the extracted flux will have failed the test if, when
7.2.1 Type R—The flux is composed of Grade WW or WG examined against a white background, complete removal of the
gum rosin of Test Methods D 509. The rosin shall have a copper film is noted, as evidenced by the white background
NOTICE: This standard has either been superseded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
B32
TABLE 1 Solder Compositions - wt% (range or maximum)
A B
Composition, % Melting Range
Alloy Solidus Liquidus UNS
Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Se
Grade Number
1 2 3 4 5 6 7 8 9 10 11 12 13
°F °C °F °C
C
Section 1: Solder Alloys Containing Less than 0.2 % Lead
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . 430 221 430 221 L13965
max
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 . . 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 . . 450 233 464 240 L13950
D
E Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 . . 440 225 660 349 L13935
D
HA Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 . . 420 216 440 227 L13955
D
HB Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 . 460 238 660 349 L13952
D
HN Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 440 225 660 350 L13933
D
AC Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75– 0.05 0.02 0.005 0.001 . 403 206 453 234 L13964
3.75
D
OA Rem 0.2 0.05 0.09–0.10 2.8–3.2 0.005 0.005 0.9–1.1 0.05 0.02 0.005 . . 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 . . 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 0.04– 419 215 660 350 L13931
0.20
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 . . 440 225 660 350 L13939
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . 354 179 372 189 L13620
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 . 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 . 361 183 441 227 L54951
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 361 183 460 238 L54916
Sn40B 39.5–41.5 Rem 1.8–2.4 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 365 185 448 231 L54918
Sn35A 34.5–36.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 361 183 447 247 L54851
Sn35B 34.5–36.5 Rem 1.6–2.0 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 365 185 470 243 L54852
Sn30A 29.5–31.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 361 183 491 255 L54821
Sn30B 29.5–31.5 Rem 1.4–1.8 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 365 185 482 250 L54822
Sn25A 24.5–26.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 361 183 511 266 L54721
Sn25B 24.5–26.5 Rem 1.1–1.5 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 365 185 504 263 L54722
Sn20A 19.5–21.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 361 183 531 277 L54711
Sn20B 19.5–21.5 Rem 0.8–1.2 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 363 184 517 270 L54712
Sn15 14.5–16.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 437 225 554 290 L54560
Sn10A 9.0–11.0 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 514 268 576 302 L54520
Sn10B 9.0–11.0 Rem 0.20 1.7–2.4 0.08 0.001 0.005 0.03 0.02 0.02 0.005 . 514 268 570 299 L54525
Sn5 4.5–5.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 586 308 594 312 L54322
Sn2 1.5–2.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 . 601 316 611 322 L54210
Ag1.5 0.75–1.25 Rem 0.40 1.3–1.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . 588 309 588 309 L50132
Ag2.5 0.25 Rem 0.40 2.3–2.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . 580 304 580 304 L50151
Ag5.5 0.25 Rem 0.40 5.0–6.0 0.30 0.001 0.005 0.25 0.02 0.02 0.005 . 580 304 716 380 L50180
A
For purposes of determining conformance to these limits, an observed value or calcu
...