Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits

SCOPE
1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).  
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.  
1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.9).  
1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.  
1.5 Procedures for lot qualification and sampling are not included in this test method.  
1.6 Because of the variability of the response of different device types, the initial dose rate for any specific test is not given in this test method but must be agreed upon by the parties to the test.  
1.7 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For more specific hazard statements, see 7.7.2.

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Publication Date
31-Dec-1996
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ASTM F744M-97 - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits
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NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F 744M – 97
METRIC
Standard Test Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits [Metric]
This standard is issued under the fixed designation F 744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope E 666 Practice for Calculating Absorbed Dose from Gamma
2
or X Radiation
1.1 This test method covers the measurement of the thresh-
E 668 Practice for Application of Thermoluminescence-
old level of radiation dose rate that causes upset in digital
Dosimetry (TLD) Systems for Determining Absorbed Dose
integrated circuits under static operating conditions. The radia-
2
in Radiation-Hardness Testing of Electronic Devices
tion source is either a flash X-ray machine (FXR) or an electron
F 526 Test Method for Measuring Dose for Use in Linear
linear accelerator (LINAC).
3
Accelerator Pulsed Radiation Effects Tests
1.2 The precision of the measurement depends on the
homogeneity of the radiation field and on the precision of the
3. Terminology
radiation dosimetry and the recording instrumentation.
3.1 Definitions of Terms Specific to This Standard:
1.3 The test may be destructive either for further tests or for
3.1.1 determined integrated circuit—integrated circuit
purposes other than this test if the integrated circuit being
whose output is a unique function of the inputs; the output
tested absorbs a total radiation dose exceeding some predeter-
changes if and only if the input changes (for example, AND-
mined level. Because this level depends both on the kind of
and OR-gates).
integrated circuit and on the application, a specific value must
3.1.2 dose rate—energy absorbed per unit time and per unit
be agreed upon by the parties to the test (6.8).
mass by a given material from the radiation to which it is
1.4 Setup, calibration, and test circuit evaluation procedures
exposed.
are included in this test method.
3.1.3 dose rate threshold for upset—minimum dose rate that
1.5 Procedures for lot qualification and sampling are not
causes either: (1) the instantaneous output voltage of an
included in this test method.
operating digital integrated circuit to be greater than the
1.6 Because of the variability of the response of different
specified maximum LOW value (for a LOW output level) or
device types, the initial dose rate for any specific test is not
less than the specified minimum HIGH value (for a HIGH
given in this test method but must be agreed upon by the parties
output level), or (2) a change of state of any stored data.
to the test.
3.1.4 nondetermined integrated circuit—integrated circuit
1.7 This standard does not purport to address all of the
whose output or internal operating conditions are not unique
safety concerns, if any, associated with its use. It is the
functions of the inputs (for example, flip-flops, shift registers,
responsibility of the user of this standard to establish appro-
and RAMs).
priate safety and health practices and determine the applica-
bility of regulatory limitations prior to use.
4. Summary of Test Method
4.1 The test device and suitable dosimeters are irradiated by
2. Referenced Documents
either an FXR or a LINAC. The test device is operating but
2.1 ASTM Standards:
under static conditions. The output(s) of the test device and of
E 665 Practice for Determining Absorbed Dose Versus
the dosimeters are recorded.
Depth in Materials Exposed to the X-Ray Output of Flash
2 4.2 The dose rate is varied to determine the rate which
X-Ray Machines
results in upset of the test device.
4.3 For the purposes of this test method, upset is considered
to be either of the following:
1
This test method is under the jurisdiction of ASTM Committee F-1 on
4.3.1 An output voltage transient exceeding a predeter-
Electronics and is the direct responsibility of Subcommittee F01.11 on Quality and
Hardness Assurance. mined value, or
Current edition approved Feb. 10, 1997. Published April 1997. Originally
published as F 744 – 81. Last previous edition F 744 – 92.
2 3
Annual Book of ASTM Standards, Vol 12.02. Annual Book of ASTM Standards, Vol 10.04.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
1

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NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
F 744M – 97
4.3.2 For devices having output logic levels which are not effects can be made based on the area of metallic target
unique functions of the input logic levels,
...

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