ASTM F72-21

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
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Designation: F72 − 17 F72 − 21
Standard Specification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1
ε NOTE—In 9.3.1, the reference to Test Methods E16 was corrected to Test Methods F16 editorially in March 2020.
1. Scope
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four
classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4)
special purpose wire.
NOTE 1—Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary
in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known
variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two
particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the
identity of modifying additives is not restricted.
1.2 The values stated in SI units shall are to be regarded as the standard. The values given in parentheses after SI units are provided
for information only and are not considered standard.
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire.
SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.
1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does
not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard
to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior
to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization
established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued
by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2. Referenced Documents
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2.1 ASTM Standards:
F16 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F205 Test Method for Measuring Diameter of Fine Wire by Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
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This specification is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic Materials, Wire
Bonding, and Flip Chip.
Current edition approved Dec. 1, 2017Jan. 1, 2021. Published January 2018January 2021. Originally approved in 1966. Last previous edition approved in 20062017 as
ɛ1
F72 – 06F72 – 17 which was withdrawn January 2015 and reinstated in December 2017. DOI: 10.1520/F0072-17E01. DOI: 10.1520/F0072-21.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F72 − 21
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F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
3. Ordering Information
3.1 Orders for material under this specification shall include the following information:
3.1.1 Classification: copper-modified, beryllium-modified, high strength, or special purpose,
3.1.2 Quantity,
3.1.3 Purity (Section 4),
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
3.1.5 Breaking load and percentage elongation range (Section 5),
3.1.6 Wire diameter (Section 6),
3.1.7 Spool type, length of wire per spool, and type of wind (Section 11),
3.1.8 Despooling, left-handed unwind or right-handed un-
wind (Section 11), and,
3.1.9 Packaging and marking (Sect
...

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F72 − 21
Standard Specification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope F16 Test Methods for Measuring Diameter or Thickness of
Wire and Ribbon for Electronic Devices and Lamps
1.1 This specification covers round drawn/extruded gold
3
(Withdrawn 2023)
wire for internal semiconductor device electrical connections.
F205 Test Method for Measuring Diameter of Fine Wire by
Four classifications of wire are distinguished, (1) copper-
3
Weighing (Withdrawn 2023)
modified wire, (2) beryllium-modified wire, (3) high-strength
F219 Test Methods of Testing Fine Round and Flat Wire for
wire, and (4) special purpose wire.
3
Electron Devices and Lamps (Withdrawn 2023)
NOTE 1—Trace metallic elements have a significant effect upon the
F584 Practice for Visual Inspection of Semiconductor Lead-
mechanical properties and thermal stability of high-purity gold wire. It is
3
Bonding Wire (Withdrawn 2015)
customary in manufacturing to add controlled amounts of selected
impurities to gold to modify or stabilize bonding wire properties, or both.
This practice is known variously as “modifying,” “stabilizing,” or
3. Ordering Information
“doping.” The first two wire classifications denoted in this specification
refer to wire made with either of two particular modifiers, copper or
3.1 Orders for material under this specification shall include
beryllium, in general use. In the third and fourth wire classifications,
the following information:
“high-strength” and “special purpose” wire, the identity of modifying
additives is not restricted.
3.1.1 Classification: copper-modified, beryllium-modified,
high strength, or special purpose,
1.2 The values stated in SI units are to be regarded as
standard. The values given in parentheses after SI units are
3.1.2 Quantity,
provided for information only and are not considered standard.
3.1.3 Purity (Section 4),
1.3 The following hazard caveat pertains only to the test
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
method portion, Section 9, of this specification. This standard
3.1.5 Breaking load and percentage elongation range (Sec-
does not purport to address all of the safety concerns, if any,
tion 5),
associated with its use. It is the responsibility of the user of this
3.1.6 Wire diameter (Section 6),
standard to establish appropriate safety, health, and environ-
3.1.7 Spool type, length of wire per spool, and type of wind
mental practices and determine the applicability of regulatory
(Section 11),
limitations prior to use.
1.4 This international standard was developed in accor-
3.1.8 Despooling, left-handed unwind or right-handed un-
dance with internationally recognized principles on standard-
wind (Section 11), and,
ization established in the Decision on Principles for the
3.1.9 Packaging and marking (Section 12).
Development of International Standards, Guides and Recom-
mendations issued by the World Trade Organization Technical
4. Chemical Composition
Barriers to Trade (TBT) Committee.
4.1 Beryllium-modified material shall conform to the
2. Referenced Documents
chemical requirements specified in Table 1.
2
2.1 ASTM Standards:
4.2 High-strength material shall conform to the chemical
requirements specified in Table 2.
1
This specification is under the jurisdiction of ASTM Committee B02 on
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee
4.3 Special purpose material shall be in accordance with
B02.05 on Precious Metals and Electrical Contact Materials and Test Methods.
Table 3.
Current edition approved Jan. 1, 2021. Published January 2021. Originally
ɛ1
approved in 1966. Last previous edition approved in 2017 as F72 – 17 . DOI:
10.1520/F0072-21.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
3
Standards volume information, refer to the standard’s Document Summary page on The last approved version of this historical standard is referenced on
the ASTM website. www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F72 − 21
TABLE 1 Chemical Requirements, Beryllium-Modified Gold TABLE 5 Breaking Load and Elongation of Stress Relieved/
A
Bonding Wire Annealed Wire—Beryllium-Modified Gold
Nominal Breaking Load, Elongation in
Element Composition, Weight, %
Diameter, min, 254 mm (10.0 in
...