Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

SCOPE
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.
1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.
1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

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Publication Date
31-Dec-2005
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ASTM F584-06 - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F 584–06
Standard Practice for
1
Visual Inspection of Semiconductor Lead-Bonding Wire
This standard is issued under the fixed designation F 584; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope Fed.Std.No.209B CleanRoomandWorkStationRequire-
3
ments, Controlled Environment
1.1 Thispracticecoversconditionsfornondestructivevisual
inspection of the surface finish of spooled aluminum and gold
3. Terminology
wire used for making internal semiconductor device connec-
3.1 Definitions of Terms Specific to This Standard:
tions and hybrid microelectronic connections.
3.1.1 chatter marks—for the purposes of this practice—
1.2 This practice specifies the recommended lighting, mag-
repetitive closely spaced wire surface blemishes.
nification, and specimen positioning for inspecting spooled
3.1.2 dark area—for the purposes of this practice—wire
wire under an optical microscope.
surface shadowed from direct light-source illumination.
1.3 Photographs (Figs. X1.1-X1.5 ) are included inAppen-
3.1.3 fingerprint—for the purposes of this practice—
dix X1 as guides to aid the inspector in identifying particular
residual surface contamination deposited during handling.
surface conditions. These photographs are not intended as
standards for specifying wire surface quality.
4. Summary of Practice
1.4 The values stated in SI units are to be regarded as the
4.1 The wire spool to be inspected is first mounted on a
standard. The values given in parentheses are for information
holding fixture that permits rotation of the spool about its axis.
only.
The spool fixture is then placed on the stage of a binocular
1.5 This standard does not purport to address all of the
microscope.Thewiresurfaceisilluminatedwithlightincident
safety concerns, if any, associated with its use. It is the
atagrazingangle;themicroscopeandfixturearepositionedso
responsibility of the user of this standard to establish appro-
that the microscope field shows the partially shadowed wire
priate safety and health practices and determine the aplicabil-
wrap just adjacent to the brilliantly lit surface at the top of the
ity of regulatory limitations prior to use.
spool.
2. Referenced Documents 4.2 Inspection is accomplished by slowly rotating the spool
2 aboutitsaxisandmovingthefixtureoverthemicroscopestage
2.1 ASTM Standards:
until the operator has viewed the entire exposed wire surface
F72 Specification for Gold Wire for Semiconductor Lead
area under partially shadowed illumination.
Bonding
4.3 The defects to be identified, the manner in which their
F487 Specification for Fine Aluminum−1 % Silicon Wire
presence is reported, and the manner in which the wire surface
for Semiconductor Lead-Bonding
quality is to be characterized should be agreed upon by the
2.2 Federal Standard:
parties to the inspection.
NOTE 1—Viewing a wire spool in the partial shadow of glancing
1
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
illumination is particularly revealing of surface flaws and soil. The
and is the direct responsibility of Subcommittee F01.07 on Interconnection
viewing arrangement amounts to dark-field illumination with imperfec-
Bonding/Carrier Bonding.
tions appearing as bright glints on the wire surface.
Current edition approved Jan. 1, 2006. Published February 2006. Originally
approved in 1978. Last previous edition approved in 2005 as F584 – 87(2005).
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
3
Standards volume information, refer to the standard’s Document Summary page on AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
the ASTM website. Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
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F584–06
5. Significance and Use 6. Apparatus
5.1 Spooled wire viewed under bright direct lighting or in
6.1 Binocular Microscope—A microscope equipped with
deep shadow generally exhibits a flawless appearance. Proper
zoom objective lens with basic magnification ranges up to 30
arrangement of the viewing angle and illumination, however,
or 403.
permits accurate observation of wire-surface condition. This
6.2 Eyepieces, wide-field, with 103 magnification for a
practice specifies the conditions under which reliable and
binocular microscope.
reproducible surface finish inspection may be achieved. Such
6.3 Light Source—Use a fluorescent light similar to that in
inspec
...

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