WG 4 - TC 119/WG 4

IEC TR 62899-402-4:2021(E), which is a Technical Report, is a preparatory work for the documents dealing with the measurement method of the vertical direction (surface forms) of printed patterns made by printed electronics technology.
The printed pattern of interest in this document is limited to straight lines on substrates with a flat surface. This document focuses on the classification and measurement methods for surface forms from the nanometer scale to the micrometer scale, and suggests the strategy for the subsequent documents.

IEC 62899-402-3:2021(E) specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable voids using this document are limited to those that are distinguishable by the optical image measurement.
NOTE In this document, void means an imperfection of pattern observed from a two-dimensional (2D) top-view.

IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics.
This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge and distribution edge of edge waviness, which are quite different from those that appear in the printing of graphic arts or from etching processes.

IEC 62899-403-1:2018(E) specifies commonly-utilized basic design patterns to evaluate printing machines with pattern reproducibility from the view point of printability in the field of printed electronics. These basic patterns consist of several evaluation patterns and register marks. Printability is derived from the evaluation of the reproducibility of these printed patterns produced by the printed machine.

IEC 62899-401:2017(E) provides an introduction to the rest of the IEC 62899-4XX series and explains its modular structure. The IEC 62899-4XX series establishes requirements for the printability of printed electronics. These requirements are stated as measurement of quality, reproducibility, analysis and compliance test methods, as well as measuring methods for environmental conditions.
The IEC 62899-4XX series specifies the measurements and the requirements of both the quality and the reproducibility of printed patterns as the result of the interaction of printing media, inks, substrate, and environmental conditions.

IEC 62899-402-1:2017(E) specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.