IEC/SC 47D - IEC_SC_47D

IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term "stand-off" has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B "Standardization philosophy" has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code 'S' is added to indicate a silicon based package. b) Description of 'WL' is added to be used for general use.

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: 'Rectangular type' has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition: a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; b) editorial modifications on several pages; and c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.

Gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. Intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

Gives guidance on the preparation of drawings of integrated circuits outlines.

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ('FBGA' hereafter) and Fine-pitch Land Grid Array ('FLGA' hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

Gives guidelines on the preparation of outline drawings of discrete devices. For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well. The main changes from the previous edition are as follows: - requirement added for SI-dimensions for new drawings to be published; - former rules concerning inch-dimensions are given in an informative annex; - former rules for coding are given in an informative annex; - incorporation of the supplements; - updating of references; - restructuring and renumbering.

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements EN 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.

EN following parallel vote

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

EN following parallel vote

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.