SIST CECC 23 300-801:2002

Overview

CECC 23 300-801:1998 - Capability Detail Specification: Multi-layer printed boards is a CLC (European) capability detail specification that defines the expected capabilities and acceptance criteria for the production of multi-layer printed boards (PCBs). The document was later adopted as SIST CECC 23 300-801:2002 in Slovenia and supersedes EN 123300-800:1992. The standard is indexed under ICS 31.180 (Printed circuits and boards) and reflects a consolidated CECC approach after the disbanding of CECC/SC 52.

Key topics

While the full text contains the formal scope and technical clauses, this capability specification typically addresses (in scope and structure) the following high-level topics:

• Manufacturer capability requirements - criteria for demonstrating production competence for multi-layer board fabrication.
• Materials and stack-up considerations - classification of base materials and lamination structures relevant to multi-layer construction.
• Dimensional and process tolerances - expected control of layer alignment, hole registration and board dimensions.
• Electrical performance considerations - items such as continuity, insulation and controlled-impedance capability where applicable.
• Plating, vias and interconnects - categories of hole treatments and metallization practices required to meet capability claims.
• Quality assurance and inspection - recommended inspection points and acceptance/rejection principles for production lots.
• Documentation and traceability - requirements for process documentation, manufacturing records and capability declarations.

(Descriptions above are presented as typical content areas covered by a capability detail specification for multi-layer printed boards; consult the full CECC document for exact clauses and requirements.)

Applications

CECC 23 300-801 is designed to be used by stakeholders involved in the specification, procurement and manufacture of multi-layer PCBs:

• PCB manufacturers - to document and demonstrate their production capabilities and compliance with European capability criteria.
• Contract manufacturers and OEMs - to set procurement requirements and evaluate supplier capability for multi-layer PCB production.
• Quality and reliability engineers - to align inspection and acceptance procedures with a recognized capability specification.
• Procurement and compliance teams - to reference in supplier qualification, tendering and technical purchase specifications.

Related standards

• EN 123300-800:1992 (superseded by CECC 23 300-801:1998)
• SIST CECC 23 300-801:2002 (Slovenian adoption)
• Classified under ICS 31.180 (Printed circuits and boards)
• For broader PCB implementation and detailed fabrication/test methods, users commonly cross-reference industry documents such as IPC and IEC family standards (consult the CECC text for recommended cross-references).

Keywords: CECC 23 300-801, Capability Detail Specification, multi-layer printed boards, PCB manufacturing standard, printed circuit board standards, SIST CECC 23 300-801.