SIST CECC 23 600-801:2002

Overview

CECC 23 600-801:1998 - Capability Detail Specification for flex‑rigid multilayer printed boards with through connections - defines requirements for the manufacture and acceptance of flex‑rigid multilayer PCBs where through connections (plated or otherwise) and specific materials and surface finishes are used. The document, adopted as SIST CECC 23 600-801:2002, falls under ICS 31.180 (printed circuits and boards) and is intended to describe supplier capability and product requirements for reliable flex‑rigid assemblies.

Key topics and requirements

• Materials selection
  • Requirements for substrate and flex materials compatible with multilayer flex‑rigid construction, emphasizing material compatibility with through connections and finishes.
• Surface finishes
  • Specification of acceptable surface treatments and finishes that affect solderability, corrosion resistance and long‑term reliability.
• Through connections
  • Criteria for through‑hole/plated through connections that pass between rigid and flexible areas, including process capability and acceptance.
• Manufacturing capability
  • Statements and limits that define a supplier’s capability to produce flex‑rigid multilayers consistently to the specification.
• Inspection and acceptance
  • Requirements for visual inspection, dimensional control and acceptance criteria related to through connections and finishes.
• Documentation and traceability
  • Expectations for process documentation, material traceability and supplier declarations to demonstrate compliance.

(Note: the summary above reflects the standard’s scope as a capability detail specification; for specific clauses, acceptance limits and test methods consult the published CECC text.)

Applications

This specification is directly applicable to production and procurement of flex‑rigid multilayer PCBs used where rigid and flexible circuitry must be integrated reliably. Typical application areas include:

• Consumer electronics with compact assemblies
• Automotive and transportation electronics
• Aerospace and defense systems requiring high reliability
• Medical and industrial devices with constrained space or moving parts
• Contract electronics manufacturers and PCB assemblers producing flex‑rigid boards

Who uses this standard

• PCB manufacturers and process engineers validating production capability
• Design engineers specifying materials, finishes and through‑connection methods
• Quality managers and procurement teams assessing supplier compliance
• Certification/qualification teams requiring documented capability for flex‑rigid products

Related references

• CECC 23 600-801:1998 (original capability detail specification)
• SIST CECC 23 600-801:2002 (national adoption noted in source)
• ICS classification: 31.180 (Printed circuits and boards)

Keywords: flex‑rigid multilayer printed boards, through connections, flex‑rigid PCBs, surface finishes, CECC 23 600-801, capability detail specification, multilayer printed boards, materials selection.