SIST EN 61249-2-12:2001
(Main)Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
Materialien für Leiterplatten und andere Verbindungsstrukturen -- Teil 2-12: Rahmenspezifikation für verstärkte, kaschierte und unkaschierte Basismaterialien - Aramidwirrfaser-verstärktes Epoxidharz-Laminat mit definierter Brennbarkeit, kupferkaschiert
Matériaux pour circuits imprimés et autres structures d'interconnexion -- Partie 2-12: Collection de spécifications intermédiaires pour les matériaux de base renforcés, recouverts ou non de feuille conductrice - Stratifié à base d'aramide non tissé collé avec de la résine epoxyde, recouvert de cuivre, d'inflammabilité définie
Définit les caractéristiques des stratifiés à base d'aramide non tissé, collé avec de la résine époxyde, recouvert de cuivre, d'inflammabilité définie et dont l'épaisseur est comprise entre 0,05 mm et 6,4 mm.
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
General Information
- Status
- Published
- Publication Date
- 28-Feb-2001
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 01-Mar-2001
- Due Date
- 01-Mar-2001
- Completion Date
- 01-Mar-2001
Overview
EN 61249-2-12:1999 (Sectional specification set for reinforced base materials - Epoxide non-woven aramid laminate, copper-clad) defines requirements for copper-clad epoxide resin laminates reinforced with non‑woven aramid. The standard applies to clad material intended for printed boards and other interconnecting structures and covers products with thicknesses from 0.05 mm to 6.4 mm and with a defined flammability rating. This document is used to specify material properties, ensure consistent quality of PCB base materials, and support regulatory and procurement requirements for copper-clad aramid laminates.
Key Topics
- Material scope: Epoxide (epoxy) resin matrix reinforced with non‑woven aramid fibers, supplied as copper‑clad laminate for printed circuit boards (PCBs) and interconnecting structures.
- Thickness range: Covers laminates and prepregs in 0.05 mm–6.4 mm thicknesses.
- Flammability definition: Specifies that the laminate has a defined flammability classification appropriate for electronic assemblies and interconnecting structures.
- Property requirements: Sets out required categories of physical, electrical and thermal properties and performance characteristics for these reinforced base materials (mechanical integrity, electrical insulation behavior, thermal performance and resistance to degradation under normal processing and service conditions).
- Quality and conformity: Addresses the need for consistent manufacturing and testing to demonstrate that supplied copper-clad aramid laminates meet the standard’s requirements.
Applications
EN 61249-2-12 is relevant where PCB materials must combine the benefits of epoxy resin systems with aramid reinforcement and a copper cladding, including:
- Rigid and semi‑rigid printed circuit boards requiring defined flammability performance
- Interconnection substrates in telecommunications, industrial electronics and consumer products
- Materials selection and specification by PCB designers, materials engineers and OEM procurement teams
- Quality assurance, compliance and test labs that verify laminate properties before board fabrication
Who uses it: PCB manufacturers, laminate suppliers, materials engineers, compliance officers, procurement specialists and test laboratories working with copper‑clad epoxide aramid laminates.
Related Standards
- Other parts of the EN 61249 series covering reinforced base materials, clad and unclad laminates
- National and international PCB material standards and industry test methods for flammability, electrical and mechanical properties
Keywords: EN 61249-2-12, epoxide aramid laminate, copper-clad laminate, PCB materials, printed boards, flammability, reinforced base materials, epoxy non-woven aramid, laminate thickness.
Frequently Asked Questions
SIST EN 61249-2-12:2001 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad". This standard covers: Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
SIST EN 61249-2-12:2001 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 61249-2-12:2001 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2001
Materials for printed boards and other interconnecting structures - Part 2-12:
Sectional specification set for reinforced base materials, clad and unclad -
Epoxide non-woven aramid laminate of defined flammability, copper-clad
Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional
specification set for reinforced base materials, clad and unclad - Epoxide non-woven
aramid laminate of defined flammability, copper-clad
Materialien für Leiterplatten und andere Verbindungsstrukturen -- Teil 2-12:
Rahmenspezifikation für verstärkte, kaschierte und unkaschierte Basismaterialien -
Aramidwirrfaser-verstärktes Epoxidharz-Laminat mit definierter Brennbarkeit,
kupferkaschiert
Matériaux pour circuits imprimés et autres structures d'interconnexion -- Partie 2-12:
Collection de spécifications intermédiaires pour les matériaux de base renforcés,
recouverts ou non de feuille conductrice - Stratifié à base d'aramide non tissé collé avec
de la résine epoxyde, recouvert de cuivre, d'inflammabilité définie
Ta slovenski standard je istoveten z: EN 61249-2-12:1999
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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