SIST EN 61709:2017

SLOVENSKI STANDARD
01-julij-2017
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SIST EN 61709:2011
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Electric components - Reliability - Reference conditions for failure rates and stress
models for conversion (IEC 61709:2017)
Elektrische Bauelemente - Zuverlässigkeit - Referenzbedingungen für Ausfallraten und
Beanspruchungsmodelle zur Umrechnung (IEC 61709:2017)
Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance
et modèles de contraintes pour la conversion (IEC 61709:2017)
Ta slovenski standard je istoveten z: EN 61709:2017
ICS:
21.020 =QDþLOQRVWLLQQDþUWRYDQMH Characteristics and design of
VWURMHYDSDUDWRYRSUHPH machines, apparatus,
equipment
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61709
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2017
ICS 31.020 Supersedes EN 61709:2011
English Version
Electric components - Reliability - Reference conditions for
failure rates and stress models for conversion
(IEC 61709:2017)
Composants électriques - Fiabilité - Conditions de référence Bauelemente der Elektronik - Zuverlässigkeit -
pour les taux de défaillance et modèles de contraintes pour Referenzbedingungen für Ausfallraten und
la conversion Beanspruchungsmodelle zur Umrechnung
(IEC 61709:2017) (IEC 61709:2017)
This European Standard was approved by CENELEC on 2017-03-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61709:2017 E
European foreword
The text of document 56/1714/FDIS, future edition 3 of IEC 61709, prepared by
IEC/TC 56 "Dependability" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61709:2017.
The following dates are fixed:
(dop) 2017-12-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-03-24
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61709:2011.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights
Endorsement notice
The text of the International Standard IEC 61709:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60300-3-2:2004 NOTE Harmonized as EN 60300-3-2:2005.
IEC 60300-3-3 NOTE Harmonized as EN 60300-3-3.
IEC 60721 (series) NOTE Harmonized as EN 60721 (series).
IEC 60721-3-3 NOTE Harmonized as EN 60721-3-3.
IEC 60721-3-4 NOTE Harmonized as EN 60721-3-4.
IEC 60721-3-5 NOTE Harmonized as EN 60721-3-5.
IEC 60721-3-7 NOTE Harmonized as EN 60721-3-7.
IEC 61014:2003 NOTE Harmonized as EN 61014:2003.
IEC 61360 (series) NOTE Harmonized as EN 61360 (series).
IEC 61360-1:2009 NOTE Harmonized as EN 61360-1:2010.
IEC 61360-4:2005 NOTE Harmonized as EN 61360-4:2005.
IEC 61508 (series) NOTE Harmonized as EN 61508 (series).
IEC 61649:2008 NOTE Harmonized as EN 61649:2008.
IEC 61703:2002 NOTE Harmonized as EN 61703:2002.
IEC 61710 NOTE Harmonized as EN 61710.
IEC 61810-2:2011 NOTE Harmonized as EN 61810-2:2011.
IEC 61810-2-1:2011 NOTE Harmonized as EN 61810-2-1:2011.
IEC 62007 (series) NOTE Harmonized as EN 62007 (series).
IEC 62741 NOTE Harmonized as EN 62741.
IEC 62308:2006 NOTE Harmonized as EN 62308:2006.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-192 2015 International electrotechnical vocabulary - - -
Part 192: Dependability
IEC 61709 ®
Edition 3.0 2017-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electric components – Reliability – Reference conditions for failure rates and

stress models for conversion
Composants électriques – Fiabilité – Conditions de référence pour les taux de

défaillance et modèles de contraintes pour la conversion

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-3902-5

– 2 – IEC 61709:2017 © IEC 2017
CONTENTS
FOREWORD . 9
INTRODUCTION . 11
1 Scope . 12
2 Normative references . 12
3 Terms, definitions and symbols . 12
3.1 Terms and definitions. 12
3.2 Symbols . 16
4 Context and conditions . 17
4.1 Failure modes and mechanisms . 17
4.2 Thermal modelling . 18
4.3 Mission profile consideration . 18
4.3.1 General . 18
4.3.2 Operating and non-operating conditions . 18
4.3.3 Dormancy . 19
4.3.4 Storage . 19
4.4 Environmental conditions . 19
4.5 Components choice . 21
4.6 Reliability growth during the deployment phase of new equipment . 22
4.7 How to use this document . 23
5 Generic reference conditions and stress models . 24
5.1 Recommended generic reference conditions . 24
5.2 Generic stress models . 25
5.2.1 General . 25
5.2.2 Stress factor for voltage dependence, π . 26
U
5.2.3 Stress factor for current dependence, π . 26
I
5.2.4 Stress factor for temperature dependence, π . 26
T
5.2.5 Environmental application factor, π . 28
E
5.2.6 Dependence on switching rate, π . 28
S
5.2.7 Dependence on electrical stress, . 29
π
ES
5.2.8 Other factors of influence . 29
6 Integrated semiconductor circuits . 29
6.1 Specific reference conditions . 29
6.2 Specific stress models . 31
6.2.1 General . 31
6.2.2 Voltage dependence, factor . 32
π
U
6.2.3 Temperature dependence, factor . 32
π
T
7 Discrete semiconductors . 35
7.1 Specific reference conditions . 35
7.2 Specific stress models . 36
7.2.1 General . 36
7.2.2 Voltage dependence for transistors, factor π . 37
U
7.2.3 Temperature dependence, factor π . 37
T
8 Optoelectronic components . 39

IEC 61709:2017 © IEC 2017 – 3 –
8.1 Specific reference conditions . 39
8.2 Specific stress models . 41
8.2.1 General . 41
8.2.2 Voltage dependence, factor π . 41
U
8.2.3 Current dependence, factor π . 41
I
8.2.4 Temperature dependence, factor π . 42
T
9 Capacitors . 44
9.1 Specific reference conditions . 44
9.2 Specific stress model . 44
9.2.1 General . 44
9.2.2 Voltage dependence, factor π . 44
U
9.2.3 Temperature dependence, factor π . 46
T
10 Resistors and resistor networks . 47
10.1 Specific reference conditions . 47
10.2 Specific stress models . 48
10.2.1 General . 48
10.2.2 Temperature dependence, factor π . 48
T
11 Inductors, transformers and coils . 49
11.1 Reference conditions . 49
11.2 Specific stress model . 49
11.2.1 General . 49
11.2.2 Temperature dependence, factor π . 49
T
12 Microwave devices . 50
12.1 Specific reference conditions . 50
12.2 Specific stress models . 51
13 Other passive components . 51
13.1 Specific reference conditions . 51
13.2 Specific stress models . 51
14 Electrical connections . 51
14.1 Specific reference conditions . 51
14.2 Specific stress models . 52
15 Connectors and sockets . 52
15.1 Reference conditions . 52
15.2 Specific stress models . 52
16 Relays . 52
16.1 Reference conditions . 52
16.2 Specific stress models . 53
16.2.1 General . 53
16.2.2 Dependence on switching rate, factor π . 53
S
16.2.3 Dependence on electrical stress, factor π . 54
ES
16.2.4 Temperature dependence, factor π . 55
T
17 Switches and push-buttons . 55
17.1 Specific reference conditions . 55
17.2 Specific stress model . 56
17.2.1 General . 56

– 4 – IEC 61709:2017 © IEC 2017
17.2.2 Dependence on electrical stress, factor π . 56
ES
18 Signal and pilot lamps . 57
18.1 Specific reference conditions . 57
18.2 Specific stress model . 57
18.2.1 General . 57
18.2.2 Voltage dependence, factor π . 58
U
19 Printed circuit boards (PCB) . 58
20 Hybrid circuits . 58
Annex A (normative) Failure modes of components . 59
Annex B (informative) Thermal model for semiconductors . 62
B.1 Thermal model . 62
B.2 Junction temperature calculation . 63
B.3 Thermal resistance evaluation . 64
B.4 Power dissipation of an integrated circuit P . 65
Annex C (informative) Failure rate prediction . 68
C.1 General . 68
C.2 Failure rate prediction for assemblies . 68
C.2.1 General . 68
C.2.2 Assumptions and limitations . 69
C.2.3 Process for failure rate prediction . 69
C.2.4 Prediction models . 70
C.2.5 Other methods of reliability prediction . 71
C.2.6 Validity considerations of reliability models and predictions . 72
C.3 Component considerations . 73
C.3.1 Component model . 73
C.3.2 Components classification . 73
C.4 General consideration about failure rate . 73
C.4.1 General . 73
C.4.2 General behaviour of the failure rate of components . 74
C.4.3 Expected values of failure rate. 75
C.4.4 Sources of variation in failure rates . 75
Annex D (informative) Considerations on mission profile . 77
D.1 General . 77
D.2 Dormancy . 77
D.3 Mission profile . 78
D.4 Example of mission profile . 79
Annex E (informative) Useful life models . 80
E.1 General . 80
E.2 Power transistors . 80
E.3 Optocouplers . 80
E.3.1 Useful life L . 80
E.3.2 Factor L . 81
E.3.3 Factor κ . 81
E.3.4 Factor κ . 82
E.3.5 Factor κ . 82
E.3.6 Factor κ . 82
E.4 LED and LED modules . 83

IEC 61709:2017 © IEC 2017 – 5 –
E.4.1 Useful life L . 83
E.4.2 Factor L . 83
E.4.3 Factor κ . 84
E.4.4 Factor κ . 84
E.4.5 Factor κ . 85
E.4.6 Factor κ . 85
E.5 Aluminium, non-solid electrolyte capacitors . 85
E.6 Relays . 86
E.7 Switches and keyboards . 86
E.8 Connectors . 86
Annex F (informative) Physics of failure . 87
F.1 General . 87
F.2 Failure mechanisms of integrated circuits . 88
Annex G (informative) Considerations for the design of a data base on failure rates . 89
G.1 General . 89
G.2 Data collection acquisition – collection process . 89
G.3 Which data to collect and how to collect it . 89
G.4 Calculation and decision making . 90
G.5 Data descriptions . 90
G.6 Identification of components . 90
G.6.1 General . 90
G.6.2 Component identification . 91
G.6.3 Component technology . 91
G.7 Specification of components . 91
G.7.1 General . 91
G.7.2 Electrical specification of components . 91
G.7.3 Environmental specification of components . 92
G.8 Field related issues data . 92
G.8.1 General . 92
G.8.2 Actual field conditions . 92
G.8.3 Data on field failures . 92
G.9 Test related issues data . 93
G.9.1 General . 93
G.9.2 Actual test conditions . 93
G.9.3 Data on test failures . 93
G.10 Failure rate database attributes . 94
Annex H (informative) Potential sources of failure rate data and methods of selection . 96
H.1 General . 96
H.2 Data source selection . 96
H.3 User data . 97
H.4 Manufacturer’s data . 97
H.5 Handbook reliability data . 98
H.5.1 General . 98
H.5.2 Using handbook data with this document . 98
H.5.3 List of available handbooks . 99
Annex I (informative) Overview of component classification . 102
I.1 General . 102
I.2 The IEC 61360 system . 102

– 6 – IEC 61709:2017 © IEC 2017
I.3 Other systems. 110
I.3.1 General . 110
I.3.2 NATO stock numbers . 110
I.3.3 UNSPSC codes . 110
I.3.4 STEP/EXPRESS . 110
I.3.5 IECQ . 110
I.3.6 ECALS . 111
I.3.7 ISO 13584 . 111
I.3.8 MIL specifications . 111
Annex J (informative) Presentation of component reliability data . 112
J.1 General . 112
J.2 Identification of components . 112
J.2.1 General . 112
J.2.2 Component identification . 113
J.2.3 Component technology . 113
J.3 Specification of components . 113
J.3.1 General . 113
J.3.2 Electrical specification of components . 113
J.3.3 Environmental specification of components . 113
J.4 Test related issues data . 113
J.4.1 General . 113
J.4.2 Actual test conditions . 114
J.5 Data on test failures . 114
Annex K (informative) Examples . 116
K.1 Integrated circuit . 116
K.2 Transistor . 116
K.3 Capacitor . 116
K.4 Relay . 117
Bibliography . 118

Figure 1 – Comparison of the temperature dependence of π for CMOS IC. 24
T
Figure 2 – Selection of stress regions in accordance with current and voltage-operating
conditions . 54
Figure 3 – Selection of stress regions in accordance with current and voltage-operating
conditions . 56
Figure B.1 – Temperatures inside equipment . 63
Figure B.2 – Thermal resistance model . 64
Figure D.1 – Mission profile . 79

Table 1 – Basic environments . 20
Table 2 – Values of environmental parameters for basic environments . 21
Table 3 – Recommended reference conditions for environmental and mechanical
stresses . 25
Table 4 – Environmental application factor, π . 28
E
Table 5 – Memory . 30
Table 6 – Microprocessors and peripherals, microcontrollers and signal processors . 30
Table 7 – Digital logic families and bus interfaces, bus driver and receiver circuits . 30

IEC 61709:2017 © IEC 2017 – 7 –
Table 8 – Analog ICs . 31
Table 9 – Application-specific ICs (ASICs) . 31
Table 10 – Constants for voltage dependence . 32
Table 11 – Factor for digital CMOS-family ICs . 32
π
U
Table 12 – Factor π for bipolar analog ICs . 32
U
Table 13 – Constants for temperature dependence . 32
Table 14 – Factor π for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM;
T
EAROM) . 34
Table 15 – Factor π for EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM. 34
T
Table 16 – Transistors common, low frequency. 35
Table 17 – Transistors, microwave, (e.g. RF > 800 MHz) . 35
Table 18 – Diodes . 36
Table 19 – Power semiconductors . 36
Table 20 – Constants for voltage dependence of transistors . 37
Table 21 – Factor π for transistors . 37
U
Table 22 – Constants for temperature dependence of discrete semiconductors . 37
Table 23 – Factor π for transistors, reference and microwave diodes . 38
T
Table 24 – Factor π for diodes (without reference and microwave diodes) and power
T
semiconductors . 38
Table 25 – Optoelectronic semiconductor signal receivers . 39
Table 26 – LEDs, IREDs, laser diodes and transmitter components . 39
Table 27 – Optocouplers and light barriers. 40
Table 28 – Passive optical components . 40
Table 29 – Transceiver, transponder and optical sub-equipment . 40
Table 30 – Constants for voltage dependence of phototransistors . 41
Table 31 – Factor π for phototransistors . 41
U
Table 32 – Constants for current dependence of LEDs and IREDs . 42
π
Table 33 – Factor for LEDs and IREDs . 42
I
Table 34 – Constants for temperature dependence of optoelectronic components . 42
Table 35 – Factor π for optical components . 43
T
Table 36 – Capacitors . 44
Table 37 – Constants for voltage dependence of capacitors . 45
Table 38 – Factor π for capacitors . 45
U
Table 39 – Constants for temperature dependence of capacitors . 46
Table 40 – Factor π for capacitors . 47
T
Table 41 – Resistors and resistor networks . 48
Table 42 – Constants for temperature dependence of resistors . 48
Table 43 – Factor π for resistors . 49
T
Table 44 – Inductors, transformers and coils . 49
Table 45 – Constants for temperature dependence of inductors, transformers and coils . 49
Table 46 – Factor π for inductors, transformers and coils . 50
T
– 8 – IEC 61709:2017 © IEC 2017
Table 47 – Microwave devices . 50
Table 48 – Other passive components . 51
Table 49 – Electrical connections. 52
Table 50 – Connectors and sockets . 52
Table 51 – Relays . 53
Table 52 – Factor for low current relays . 54
π
ES
Table 53 – Factor π for general purpose relays . 54
ES
Table 54 – Factor π for automotive relays . 55
ES
Table 55 – Constants for temperature dependence of relays . 55
Table 56 – Factor π for relays . 55
T
Table 57 – Switches and push-buttons . 56
Table 58 – Factor for switches and push-buttons for low electrical stress . 57
π
ES
Table 59 – Factor π for switches and push-buttons for higher electrical stress . 57
ES
Table 60 – Signal and pilot lamps . 57
π
Table 61 – Factor for signal and pilot lamps . 58
U
Table A.1 – Failure modes: ICs (digital) . 59
Table A.2 – Failure modes: transistors, diodes, optocouplers . 60
Table A.3 – Failure modes: LEDs . 60
Table A.4 – Failure modes: laser diodes and modules . 60
Table A.5 – Failure modes: photodiodes and receiver modules . 60
Table A.6 – Failure modes: capacitors . 61
Table A.7 – Failure modes: resistors, inductive devices, relays . 61
Table B.1 – Thermal resistance as a function of package type, pin number and airflow
factor . 65
Table B.2 – Typical values of v are K . 65
Table B.3 – Values of P and P . 66
DC f
Table E.1 – Useful life limitations for switches and keyboards . 86
Table F.1 – Failure mechanism for Integrated circuits . 88
Table G.1 – Reliability prediction database attributes . 95
Table H.1 – Result of calculation for transistors common, low frequency. 99
Table H.2 – Sources of reliability data (in alphabetical order) . 99
Table I.1 – Classification tree (IEC 61360-4) . 103

IEC 61709:2017 © IEC 2017 – 9 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_______________
ELECTRIC COMPONENTS –
RELIABILITY –
REFERENCE CONDITIONS FOR FAILURE RATES
AND STRESS MODELS FOR CONVERSION

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Spec
...