SIST CECC 23 800-801:2002

Overview

CECC 23 800-801:1998 - Capability Detail Specification for flexible multilayer printed boards with through connections (issued by CLC) defines the capability criteria and technical scope for manufacturing and qualifying flexible multilayer printed circuit boards (PCBs) that incorporate through-type interconnections. The standard is intended as a supplier capability and acceptance specification covering materials, surface finishes and the specific features of flexible multilayer constructions.

Key topics and requirements

The standard focuses on capability recognition and technical control of flexible multilayer PCBs with through connections. Key topics typically covered include:

• Scope and definitions relevant to flexible multilayer printed boards and through connections
• Materials: selection and qualification of base films, adhesives, prepregs and conductive layers used in flexible multilayer constructions
• Surface finishes: acceptable types and requirements for plated or coated terminations to ensure reliable through connections
• Through connections: requirements and process controls for establishing reliable interlayer electrical connections in flexible, multilayer assemblies
• Manufacturing capability: criteria for demonstrating process stability and repeatability for fabricators (plating, lamination, drilling/punching, registration)
• Inspection and testing: visual, electrical and mechanical checks necessary to verify through connections, layer alignment and board integrity
• Documentation and traceability: records of materials, process parameters and test results required for supplier qualification and ongoing conformity

(CECC capability specifications are used to standardize supplier qualification rather than to prescribe detailed design rules; the emphasis is on demonstrating capability to produce to required characteristics.)

Applications

This capability detail specification is relevant for organizations that design, procure or produce flexible multilayer printed boards with through connections. Typical users include:

• PCB fabricators and contract manufacturers seeking CECC capability recognition
• OEMs and electronics designers specifying flexible multilayer PCBs for products
• Procurement, quality and compliance teams evaluating supplier capability and acceptance criteria
• Industries that rely on flexible multilayer PCBs with through connections-such as telecommunications, industrial electronics, automotive and medical devices-where reliable interlayer connections are critical

Related standards

CECC 23 800-801 complements broader PCB and flexible-circuit guidance from international and industry bodies. Related documents may include general PCB manufacturing and testing standards from IEC, IPC and national standardization organizations for materials, testing methods and surface finishes.

Keywords: CECC 23 800-801, capability detail specification, flexible multilayer printed boards, through connections, flexible multilayer PCBs, surface finishes, materials, CLC.