SIST EN 61190-1-3:2007

SLOVENSKI STANDARD
SIST EN 61190-1-3:2007
01-oktober-2007
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SIST EN 61190-1-3:2003
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Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-3: Anforderungen an
Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von
Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques -- Partie 1-3: Exigences
relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et
non-fluxées pour les applications de brasage électronique
Ta slovenski standard je istoveten z: EN 61190-1-3:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-3:2007 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61190-1-3:2007

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SIST EN 61190-1-3:2007


EUROPEAN STANDARD
EN 61190-1-3

NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM

ICS 31.190 Supersedes EN 61190-1-3:2002


English version


Attachment materials for electronic assembly -
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2007)


Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-3: Exigences relatives Teil 1-3: Anforderungen
aux alliages à braser de catégorie an Elektroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel
fluxées et non-fluxées pour les für das Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2007)
(CEI 61190-1-3:2007)




This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2007 E

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SIST EN 61190-1-3:2007
EN 61190-1-3:2007 - 2 -
Foreword
The text of document 91/647/FDIS, future edition 2 of IEC 61190-1-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-3 on 2007-05-01.
This European Standard supersedes EN 61190-1-3:2002.
The main changes with regard to EN 61190-1-3:2002 concern a definition of lead-free solder alloy and an
amendment to Table B.1 concerning lead-free solder alloys.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 61190-1-3:2007
- 3 - EN 61190-1-3:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions


1) 2)
IEC 61189-5 - Test methods for electrical materials, EN 61189-5 2006
interconnection structures and assemblies -
Part 5: Test methods for printed board
assemblies


1) 2)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies


IEC 61190-1-1 2002 Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly


1) 2)
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly


1) 2)
ISO 9001 - Quality systems - Model for quality assurance EN ISO 9001 2000
in design/ development, production,
installation and servicing


1) 2)
ISO 9453 - Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms


ISO 9454-1 1990 Soft soldering fluxes - Classification and EN 29454-1 1993
requirements -
Part 1: Classification, labelling and packaging


ISO 9454-2 1998 Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements





1)
Undated reference.
2)
Valid edition at date of issue.

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SIST EN 61190-1-3:2007

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SIST EN 61190-1-3:2007


INTERNATIONAL IEC


STANDARD 61190-1-3





Second edition
2007-04


Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications

PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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SIST EN 61190-1-3:2007
– 2 – 61190-1-3 © IEC:2007(E)
CONTENTS

FOREWORD.4

1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 Classification .8
4.1 Alloy composition.8
4.2 Solder form .8
4.3 Flux type .9
4.4 Flux percentage and metal content .10
4.5 Other characteristics.11
5 Requirements .11
5.1 Materials .11
5.2 Alloys .11
5.3 Solder forms.12
5.4 Flux type and form.13
5.5 Flux residue dryness.14
5.6 Spitting.14
5.7 Solder pool .14
5.8 Labelling for product identification.14
5.9 Workmanship .14
6 Quality assurance provisions.15
6.1 Responsibility for inspection and compliance.15
6.2 Classification of inspections.15
6.3 Materials inspection.20
6.4 Qualification inspections .20
6.5 Quality conformance.21
6.6 Preparation of solder alloy for test.21
7 Preparation for delivery – Preservation, packing and packaging.21

Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3.22
Annex B (normative) Lead-free solder alloys.26

Figure 1 – Report form for solder alloy tests .16
Figure 2 – Report form for solder powder tests .17
Figure 3 – Report form for non-fluxed solder tests .18
Figure 4 – Report form for fluxed wire/ribbon solder tests .19

Table 1 – Solder materials.8
Table 2 – Flux types and designating symbols .10
Table 3 – Flux percentage.11
Table 4 – Standard solder powders .13

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SIST EN 61190-1-3:2007
61190-1-3 © IEC:2007(E) – 3 –
Table 5 – Solder inspections .20
a, b
Table B.1 – Composition, and temperature characteristics of lead-free solder alloys .26
a, b
Table B.2 – Composition and temperature characteristics of common tin-lead alloys .28
Table B.3 – Composition and temperature characteristics for specialty (non-tin/lead)
a,b
alloys .30
Table B.4 – Cross reference from solidus and liquidus temperatures to alloy names by
a
temperature .31
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names .34

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SIST EN 61190-1-3:2007
– 4 – 61190-1-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance
with this document may involve the use of a patent concerning in particular alloy compositions. IEC takes no
position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable and
non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the
holder of this patent right is registered with IEC. Information may be obtained from:

For Sn96Ag2,5Bi1Cu,5:
US PAT No. 4879096
Cookson Electronics Assembly Materials
600 Route 440 Jersey City,New Jersey 07304

For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7 and Sn95,5Ag3,8Cu,7:
US PAT No. 5527628
Iowa State University Research Foundation, Inc.
310 Lab of Mechanics
Ames, Iowa 50011-2131, U.S.A.

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SIST EN 61190-1-3:2007
61190-1-3 © IEC:2007(E) – 5 –
For Sn88In8Ag3,5Bi,5:
JP PAT No. 3040929
For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7 and Sn95,5Ag3,8Cu,7:
JP PAT No. 3027441
Matsushita Electric Industrial Co., Ltd.
Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan

For Sn92In4Ag3,5Bi,5
JP PAT No. 2805595
Mitsui Mining & Smelting Co., Ltd.
Gate City Ohsaki-West Tower 19th Fl. 1-11-1 Osaki, Shinagawa-ku, Tokyo, 141-8584, Japan

For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7, Sn95,5Ag3,8Cu,7 and Sn95,5Ag4,0Cu,5
JP PAT No. 3027441
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan

NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users
remain responsible for establishing the exact legal position relevant to their own situation.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights
other than those identified above. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes a
technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
The text of this standard is based on the following documents:
FDIS Report on voting
91/647/FDIS 91/679/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61190 series, under the general title Attachment materials for
electronic assembly, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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SIST EN 61190-1-3:2007
– 6 – 61190-1-3 © IEC:2007(E)
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications



1 Scope
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for “special” electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This
standard is a quality control document and is not intended to relate directly to the material's
performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder
powders, etc.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61190-1-1:2002, Attachment materials for electronic assembly – Part 1-1: Requirements
for soldering fluxes for high-quality interconnects in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for
solder pastes for high-quality interconnections in electronics assembly

IEC 61189-5, Test methods for electrical materials, interconnection structures and assemblies –
Part 5: Test methods for printed board assemblies
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies –
Part 6: Test methods for materials used in manufacturing electronic assemblies
ISO 9001, Quality management systems – Requirements
ISO 9453, Soft solder alloys – Chemical compositions and forms
ISO-9454-1:1990, Soft soldering fluxes – Classification and requirements – Part 1: Classifi-
cation, labelling and packing
ISO-9454-2:1998, Soft soldering fluxes – Classification and requirements – Part 2: Perform-
ance requirements
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194, as well as the
following apply. Terms marked with an asterisk (*) are taken from IEC 60194 and are reprinted
here for convenience.

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SIST EN 61190-1-3:2007
61190-1-3 © IEC:2007(E) – 7 –
3.1
acceptance tests *
those tests deemed necessary to determine the acceptability of a product and as agreed to by
both purchaser and vendor
3.2
alloy
substance having metallic properties and being composed of two or more chemical elements of
which at least one is an elemental metal
3.3
basis metal *
metal upon which coatings are deposited, also referred to as base metal
3.4
corrosion (chemical/electrolytic) *
attack of chemicals, flux, and flux residues on base metals
3.5
density (phototool) *
mass of a surface per unit volume, usually expressed in grams per cubic centimetre
3.6
dewetting *
condition that results when molten solder coats a surface and then recedes to leave irregularly
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
3.7
eutectic (n.) *
alloy having the composition indicated by the eutectic point on an equilibrium diagram or an
alloy structure of intermixed solid constituents formed by a eutectic reaction
3.8
eutectic (adj.) *
isothermal reversible reaction in which, on cooling, a liquid solution is converted into two or
more intimately mixed solids, with the number of solids formed being the same as the number
of components
3.9
flux *
chemically - and physically-active compound that, when heated, promotes the wetting of a base
metal surface by molten solder by removing minor surface oxidation and other surface films
and by protecting the surfaces from reoxidation during a soldering operation
3.10
flux characterization *
series of tests that determines the basic corrosive and conductive properties of fluxes and flux
residues
3.11
flux residue *
flux-related contaminant that is present on or near the surface of a solder connection
3.12
liquidus
temperature at which a solder alloy changes from a paste form to a liquid form

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SIST EN 61190-1-3:2007
– 8 – 61190-1-3 © IEC:2007(E)
3.13
nonwetting (solder) *
partial adherence of molten solder to a surface that it has contacted and where basis metal
remains exposed
3.14
lead-free solder
solder alloy the lead content of which h is equal to, or less than 0,10 % by mass
3.15
solder *
metal alloy with a melting temperature that is below 450 °C.
NOTE Metal alloy with a melting temperature less than 450 °C is classified as “soft solder”.
3.16
solderability *
ability of a metal to be wetted by molten solder
3.17
solidus
temperature at which a solder alloy changes from a solid to a paste form
3.18
wetting, solder *
formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis
metal.
4 Classification
Soldering materials covered by this standard shall be classified by alloy composition, solder
form, flux type, flux percentage and by other characteristics peculiar to the solder material form.
4.1 Alloy composition
The solder alloys covered by this standard are the alloys listed in Tables B.1, B.2 and B.3 and
include pure tin and pure indium. Each alloy is identified by an alloy name composed of a
series of alphanumeric characters. These characters identify the component elements in the
alloy by chemical symbol and nominal percentage by mass. They terminate with an arbitrarily
assigned alloy variation letter (A, B, C, D). Alloys are also identified by an alloy short name.
This is an alphanumeric designation composed of the chemical symbol for the key element in
the alloy (see Clause A.4), the nominal percentage of that element in the alloy and the
arbitrarily assigned alloy variation letter.
Tables B.1, B.2 and B.3 identify alloy composition, short name and temperature characteristics;
Table B.4 cross-references solidus and liquidus temperatures to alloy names and Table B.5
cross-references ISO alloy numbers and designations from ISO 9453 to alloy names.
4.2 Solder form
Table 1 shows the forms of solder materials covered by this standard listed with their single-
letter designating symbols.
Table 1 – Solder materials
Identifying symbol Solder form
F Flux (only)

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SIST EN 61190-1-3:2007
61190-1-3 © IEC:2007(E) – 9 –
P Paste (cream)
B Bar
D Powder
R Ribbon
W Wire
S Special

4.3 Flux type
The flux types used in/on solders covered by this standard are listed in Table 2. The
requirements for fluxes are covered by IEC 61190-1-1.

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SIST EN 61190-1-3:2007
– 10 – 61190-1-3 © IEC:2007(E)
Table 2 – Flux types and designating symbols
Flux materials Flux activity levels IEC flux ISO flux
a c d
of composition designator designator
b
wt. % halide
Rosin Low (<0,01) L0 ROL0 1.1.1
(RO) Low (<0,15) L1 ROL1 1.1.2.W, 1.1.2.X
Moderate (<0,01) M0 ROM0 1.1.3.W
Moderate (0,15–2,0) M1 ROM1 1.1.2.Y, 1.1.2.Z
High (<0,01) H0 ROH0 1.1.3.X
High (>2,0) H1 ROH1 1.1.2.Z
Resin Low (<0,01) L0 REL0 1.2.1
(RE) Low (<0,15) L1 REL1 1.2.2.W, 1.2.2.X
Moderate (<0,01) M0 REM0 1.2.3.W
Moderate (0, 15 – 2,0) M1 REM1 1.2.2.Y, 1.2.2.Z
High (<0,01) H0 REH0 1.2.3.X
High (>2,0) H1 REH1 1.2.2.Z
Organic Low (<0,01) L0 ORL0 2.1., 2.2.3.E
(OR) Low (<0, 15) L1 ORL1 -
Moderate (<0,01) M0 ORM0 -
Moderate (0, 15 – 2,0) M1 ORM1 2.1.2, 2.2.2
High (<0,01) H0 ORH0 2.2.3.0
High (>2,0) H1 ORH1 2.2.2
Inorganic Low (<0,01) L0 INL0 Not applicable
(IN) Low (<0, 15) L1 INL1 (inorganic ISO flux is
different)
Moderate (<0,01) M0 INM0
Moderate (0, 15 – 2,0) M1 INM1
High (<0,01) H0 INH0
High (>2,0) H1 INH1
a
 Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms.
b
 See 7.1 and 7.2 of IEC 61190-1-1 for comparisons of RO, RE, OR and IN composition classes and L, M and H
activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids ”no-clean.''.
c
 The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 of IEC 61190-1-1 for an
explanation of L, M and H nomenclature.
d
 ISO designations are similar to IEC designators with minor differences in characteristics

4.4 Flux percentage and metal content
The nominal percentage of flux, by mass, in solid-form solder products is identified as the flux
percentage. The flux percentage in/on solid solders is identified by a single alphanumeric
character in accordance with Table 3. “Metal content” refers to the percentage of metal in
solder paste (see IEC 61190-1-2).

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SIST EN 61190-1-3:2007
61190-1-3 © IEC:2007(E) – 11 –
Table 3 – Flux percentage
Design Nominal Allowable Design Nominal Allowable Design Allowable
Nominal
symbol  range symbol  range symbol range
% % % % % %
0 None 5 2,5 2,2 – 2,8 A 5,0 4,7
...