EN 61190-1-3:2007

SLOVENSKI STANDARD
01-oktober-2007
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Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-3: Anforderungen an
Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von
Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques -- Partie 1-3: Exigences
relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et
non-fluxées pour les applications de brasage électronique
Ta slovenski standard je istoveten z: EN 61190-1-3:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61190-1-3
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.190 Supersedes EN 61190-1-3:2002

English version
Attachment materials for electronic assembly -
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2007)
Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-3: Exigences relatives Teil 1-3: Anforderungen
aux alliages à braser de catégorie an Elektroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel
fluxées et non-fluxées pour les für das Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2007)
(CEI 61190-1-3:2007)
This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2007 E
Foreword
The text of document 91/647/FDIS, future edition 2 of IEC 61190-1-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-3 on 2007-05-01.
This European Standard supersedes EN 61190-1-3:2002.
The main changes with regard to EN 61190-1-3:2002 concern a definition of lead-free solder alloy and an
amendment to Table B.1 concerning lead-free solder alloys.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61190-1-3:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions

1) 2)
IEC 61189-5 - Test methods for electrical materials, EN 61189-5 2006
interconnection structures and assemblies -
Part 5: Test methods for printed board
assemblies
1) 2)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies

IEC 61190-1-1 2002 Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly
1) 2)
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly
1) 2)
ISO 9001 - Quality systems - Model for quality assurance EN ISO 9001 2000
in design/ development, production,
installation and servicing
1) 2)
ISO 9453 - Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms
ISO 9454-1 1990 Soft soldering fluxes - Classification and EN 29454-1 1993
requirements -
Part 1: Classification, labelling and packaging

ISO 9454-2 1998 Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements

1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 61190-1-3
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications

PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61190-1-3 © IEC:2007(E)
CONTENTS
FOREWORD.4

1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 Classification .8
4.1 Alloy composition.8
4.2 Solder form .8
4.3 Flux type .9
4.4 Flux percentage and metal content .10
4.5 Other characteristics.11
5 Requirements .11
5.1 Materials .11
5.2 Alloys .11
5.3 Solder forms.12
5.4 Flux type and form.13
5.5 Flux residue dryness.14
5.6 Spitting.14
5.7 Solder pool .14
5.8 Labelling for product identification.14
5.9 Workmanship .14
6 Quality assurance provisions.15
6.1 Responsibility for inspection and compliance.15
6.2 Classification of inspections.15
6.3 Materials inspection.20
6.4 Qualification inspections .20
6.5 Quality conformance.21
6.6 Preparation of solder alloy for test.21
7 Preparation for delivery – Preservation, packing and packaging.21

Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3.22
Annex B (normative) Lead-free solder alloys.26

Figure 1 – Report form for solder alloy tests .16
Figure 2 – Report form for solder powder tests .17
Figure 3 – Report form for non-fluxed solder tests .18
Figure 4 – Report form for fluxed wire/ribbon solder tests .19

Table 1 – Solder materials.8
Table 2 – Flux types and designating symbols .10
Table 3 – Flux percentage.11
Table 4 – Standard solder powders .13

61190-1-3 © IEC:2007(E) – 3 –
Table 5 – Solder inspections .20
a, b
Table B.1 – Composition, and temperature characteristics of lead-free solder alloys .26
a, b
Table B.2 – Composition and temperature characteristics of common tin-lead alloys .28
Table B.3 – Composition and temperature characteristics for specialty (non-tin/lead)
a,b
alloys .30
Table B.4 – Cross reference from solidus and liquidus temperatures to alloy names by
a
temperature .31
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names .34

– 4 – 61190-1-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with condi
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