SIST EN 61190-1-3:2003

SLOVENSKI SIST EN 61190-1-3:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ICS 25.160.50; 31.190 Referenčna številka
SIST EN 61190-1-3:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61190-1-3
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-3: Exigences relatives aux Teil 1-3: Anforderungen an
alliages à braser de catégorie Eletroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel für das
fluxées et non-fluxées pour les Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2002)
(CEI 61190-1-3:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2002 E

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EN 61190-1-3:2002 - 2 -
Foreword
The text of document 91/279/FDIS, future edition 1 of IEC 61190-1-3, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-3 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes B and ZA are normative and annex A is informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2002 was approved by CENELEC as a
European Standard without any modification.
__________

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- 3 - EN 61190-1-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60194 1999 Printed board design, manufacture and--
assembly - Terms and definitions
1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections
in electronics assembly
1) 2)
IEC 61190-1-2 - Part 1-2: Requirements for solder EN 61190-1-2 2002
pastes for high-quality interconnections
in electronics assembly
1) 2)
ISO 9002 - Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
ISO 9453 1990 Soft solder alloys - Chemical EN 29453 1993
compositions and forms
1) 2)
ISO 9454-1 - Soft soldering fluxes - Classification EN 29454-1 1993
and requirements
Part 1: Classification, labelling
and packaging
1) 2)
ISO 9454-2 - Part 2: Performance requirements EN ISO 9454-2 2000

1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE IEC
61190-1-3
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Matériaux de fixation pour
les assemblages électroniques –
Partie 1-3:
Exigences relatives aux alliages à braser
de catégorie électronique et brasures solides
fluxées et non fluxées pour les applications
de brasage électronique
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders for
electronic soldering applications
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
V
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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61190-1-3 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.9
2 Normative references.9
3 Classification .11
3.1 Alloy composition.11
3.2 Solder form .11
3.3 Flux type .11
3.4 Flux percentage and metal content .13
3.5 Other characteristics.15
4 Terms and definitions .15
5 Requirements .19
5.1 Materials .19
5.2 Alloys .19
5.3 Solder forms.21
5.4 Flux type and form.25
5.5 Flux residue dryness.25
5.6 Spitting.25
5.7 Solder-pool.25
5.8 Labelling for product identification.27
5.9 Workmanship .27
6 Quality assurance provisions.27
6.1 Responsibility for inspection and compliance.27
6.2 Classification of inspections.29
6.3 Material inspection.39
6.4 Qualification inspection.39
6.5 Quality conformance.41
6.6 Preparation of solder alloy for test.41
7 Preparation for delivery.41
7.1 Preservation, packing, and packaging .41
Annex A (informative).43
A.1 Intended use.43
A.2 Acquisition requirements.45
A.3 Standard solder product packages .47
A.4 Protocol for establishing short names for IEC 61190-1-3 alloys.47
A.5 Standard description of solid solder products .49
Annex B (normative) Solder alloys.51
Bibliography .65

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61190-1-3 © IEC:2002 – 5 –
Figure 1 – Report form for solder alloy tests .31
Figure 2 – Report form for solder powder tests .33
Figure 3 – Report form for non-fluxed solder tests .35
Figure 4 – Report form for fluxed wire/ribbon solder tests .37
Table 1 – Solder materials.11
Table 2 – Flux types and designating symbols .13
Table 3 – Flux percentage.15
Table 4 – Standard solder powders .23
Table 5 – Solder inspections .39
Table B.1 – Composition and temperature characteristics of lead-free solder alloys .51
Table B.2 – Composition and temperature characteristics of common tin-lead alloys.53
Table B.3 – Composition and temperature characteristics for speciality
(non-tin/lead) alloys.57
Table B.4 – Cross-reference from solidus and liquidus temperatures
to alloy names by temperature.59
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations
to IEC 61190-1-3 alloy names .63

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61190-1-3 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/279/FDIS 91/289/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A is for information only.
Annex B forms an integral part of this standard.
The committee has decided that the contents of this publication will remain unchanged until 2007.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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61190-1-3 © IEC:2002 – 9 –
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
1 Scope
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder
paste, for electronic soldering applications as well as for special electronic grade solders. For
the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2,
respectively. This standard is a quality control document and is not intended to relate directly to
the material performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Some examples of
special solders are anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy
solder powders, etc.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194:1999, Printed board design, manufacture and assembly – Terms and definitions
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
1)
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for
1)
solder pastes for high-quality interconnections in electronics assembly
ISO 9002, Quality Systems – Model for Quality Assurance in Production, Installation and
Servicing
ISO 9453:1990, Soft solder alloys – Chemical compositions and forms
ISO-9454-1, Soft soldering fluxes – Classification and requirements – Part 1: Classification,
labelling and packaging
ISO-9454-2, Soft soldering fluxes – Classification and requirements – Part 2: Performance
requirements
___________
1)
 To be published.

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61190-1-3 © IEC:2002 – 11 –
3 Classification
Soldering materials covered by this standard shall be classified by alloy composition, solder
form, flux type, flux percentage, and by other characteristics peculiar to the solder material
form.
3.1 Alloy composition
The solder alloys covered by this standard are the alloys listed in annex B, table B.1, and
include pure tin and pure indium. Each alloy is identified by an alloy name, which is composed
of a series of alphanumeric characters that identify the component elements in the alloy by
chemical symbol and nominal percentage by mass, and ending with an arbitrarily assigned
alloy variation letter (A, B, C, D, E). Alloys are also identified by an alloy short name, which is a
five-character alphanumeric designation composed of the chemical symbol for the key element
in the alloy (see A.4), the nominal percentage of that element in the alloy, and the arbitrarily
assigned alloy variation letter. Annex B, table B.1, identifies alloy composition, the alloy short
name, and alloy temperature characteristics. Annex B, table B.2, cross-references solidus and
liquidus temperatures to alloy names. Annex B, table B.3, cross-references alloy short names
to alloy names. Annex B, table B.4, cross-references ISO alloy numbers and designations from
ISO 9453 to alloy names.
3.2 Solder form
The forms of solder materials covered by this set of standards are listed with their single-letter
designating symbols in table 1.
Table 1 – Solder materials
Identifying symbol Solder form
F Flux (only)
P Paste (cream)
BBar
D Powder
R Ribbon
WWire
S Special
3.3 Flux type
The flux types used in/on solders covered by this set of standards are listed in table 2. The
requirements for fluxes are covered by IEC 61190-1-1.

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61190-1-3 © IEC:2002 – 13 –
Table 2 – Flux types and designating symbols
Flux materials Flux activity levels
c d
IEC flux designator ISO flux designator
a b
of composition (weight % halide)
Low (<0,01) L0 ROL0 1.1.1
Low (<0,15) L1 ROL1 1.1.2.W, 1.1.2.X
Rosin Moderate (0) M0 ROM0 1.1.3.W
(RO) Moderate (0,5-2,0) M1 ROM1 1.1.2.Y, 1.1.2.Z
High (0) H0 ROH0 1.1.3.X
High (>2,0) H1 ROH1 1.1.2.Z
Low (<0,01) L0 REL0 1.2.1
Low (<0,15) L1 REL1 1.2.2.W, 1.2.2.X
Resin Moderate (0) M0 REM0 1.2.3.W
(RE) Moderate (0,5-2,0) M1 REM1 1.2.2.Y, 1.2.2.Z
High (0) H0 REH0 1.2.3.X
High (>2,0) H1 REH1 1.2.2.Z
Low (0) L0 ORL0 2.1., 2.2.3.E
Low (<0,5) L1 ORL1 –
Organic Moderate (0) M0 ORM0 –
(OR) Moderate (0,5-2,0) M1 ORM1 2.1.2, 2.2.2
High (0) H0 ORH0 2.2.3.0
High (>2,0) H1 ORH1 2.2.2
Low (0) L0 INL0 Not applicable
Low (<0,5) L1 INL1 (Inorganic ISO flux
is different)
Inorganic Moderate (0) M0 INM0
(IN) Moderate (0,5-2,0) M1 INM1
High (0) H0 INH0
High (>2,0) H1 INH1
a
Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms.
b
The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 of IEC 61190-1-1 for an
explanation of L, M and H nomenclature.
c
See 7.2 and 7.3 of IEC 61190-1-1 for comparisons of RO, RE, OR and IN composition classes and L, M and H
activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids “no-clean”.
d
ISO designations are similar to IEC designators with minor differences in characteristics.
3.4 Flux percentage and metal content
The nominal percentage of flux, by mass, in solid-form solder products is identified as the flux
percentage. The flux percentage in/on solid solders is identified by a single alphanumeric
character in accordance with table 3. Metal content refers to the percentage of metal in solder
paste (see IEC 61190-1-2).

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61190-1-3 © IEC:2002 – 15 –
Table 3 – Flux percentage
Designation Nominal Allowable
symbol percentage percentage range
0 None
1 0,5 0,2 - 0,8
2 1,0 0,7 - 1,3
3 1,5 1,2 - 1,8
4 2,0 1,7 - 2,3
5 2,5 2,2 - 2,8
6 3,0 2,7 - 3,3
7 3,5 3,2 - 3,8
8 4,0 3,7 - 4,3
9 4,5 4,2 - 4,8
A 5,0 4,7 - 5,3
B 5,5 5,2 - 5,8
C 6,0 5,7 - 6,3
D 6,5 6,2 - 6,8
3.5 Other characteristics
Standard bar solders are further classified by unit mass. Wire solders are further classified by
wire size (outside diameter) and unit mass. Ribbon solders are further classified by thickness,
width and unit mass. Powder solders are further classified by powder particle size distribution
and unit mass.
4 Terms and definitions
1)
For the purpose of this part of IEC 61190, the terms and definitions given in English only in
IEC 60194 and the following apply.
4.1
acceptance tests
tests deemed necessary to determine the acceptability of a product and as agreed to by both
purchaser and vendor
[IEC 60194]
4.2
alloy
substance having metallic properties and being composed of two or more chemical elements of
which at least one is an elemental metal
4.3
basis metal
metal upon which coatings are deposited, (also referred to as base metal)
[IEC 60194, modified]
4.4
corrosion (chemical/electrolytic)
attack of chemicals, flux, and flux residues on base metals
___________
1)
 Certain definitions of IEC 60194 have been translated into French.

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61190-1-3 © IEC:2002 – 17 –
4.5
density (phototool)
logarithm of the value of opacity, usually expressed in grams per cubic centimeter
[IEC 60194, modified]
4.6
dewetting
condition that results when molten solder coats a surface and then recedes to leave irregularly
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
4.7
eutectic (n.)
alloy having the composition indicated by the eutectic point on an equilibrium diagram or an
alloy structure of intermixed solid constituents formed by a eutectic reaction
[IEC 60194]
4.8
eutectic (v.)
isothermal reversible reaction in which, on cooling, a liquid solution is converted into two or
more intimately mixed solids, with the number of solids formed being the same as the number
of components in the system
[IEC 60194]
4.9
flux
chemically and physically active compound that, when heated, promotes the wetting of a base
metal surface by molten solder by removing minor surface oxidation and other surface films
and by protecting the surfaces from reoxidation during a soldering operation
[IEC 60194 modified]
4.10
flux characterization
series of tests that determines the basic corrosive and conductive properties of fluxes and flux
residues
[IEC 60194]
4.11
flux residue
flux-related contaminant that is present on or near the surface of a solder connection
[IEC 60194]
4.12
liquidus
temperature at which a solder alloy changes from a paste form to a liquid form
4.13
non-wetting (solder)
partial adherence of molten solder to a surface that it has contacted and of which the basis
metal remains exposed
[IEC 60194]
4.14
solder
metal alloy with a melting temperature that is below 485 °C
NOTE Metal alloy with a melting temperature less than 450 °C is classified as "soft solder".
[IEC 60194, modified]

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61190-1-3 © IEC:2002 – 19 –
4.15
solderability
ability of the surface of a metal to be wetted by molten solder
[IEC 60194]
4.16
solidus
temperature at which a solder alloy changes from a solid to a paste form
4.17
wetting, solder
formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis
metal
[IEC 60194, modified]
5 Requirements
5.1 Materials
Materials shall be used which permit the solder product to conform to the specified
requirements. The use of recovered or recycled materials is encouraged. Recovered or
recycled materials must conform to or exceed comparable standards for virgin raw materials.
5.2 Alloys
The solder alloy shall be as specified (see annex B). For purposes of this standard, electronic
grade solder alloys are all of the alloys listed in annex B, table B.1, including pure tin (Sn99)
and pure indium (In99). The elements listed in annex B, table B.1, for an alloy are considered
to be the component elements of that alloy. Only the component elements of an alloy are
desirable and all other elements are impurities for that alloy. To the maximum extent feasible
and unless otherwise specified, solder alloy metal, including solder powder, shall be a homo-
genous mixture of the component elements of the alloy, so that each particle of the metal is the
same alloy. Unless otherwise specified, the percentage by mass of impurity elements in alloys
which are identified with an A, B, C, or E suffix shall not exceed the following values and the
values listed in 5.2.1, 5.2.2, 5.2.3, and 5.2.5 respectively, and the percentage by mass of
impurity elements in alloys which are identified with a D suffix shall conform to the
requirements in 5.2.4.
Ag: 0,05 Au: 0,05 Cu: 0,08 Ni: 0,01 Sn: 0,25
Al: 0,001 Bi: 0,10 Fe: 0,02 Pb: 0,20 Zn: 0,001
As: 0,03 Cd: 0,002 In: 0,10
The percentage of each element in an alloy shall be determined by any standard analytical
procedure. Wet chemistry shall be used as the referee procedure.
5.2.1 Variation A alloys
In alloys which are identified with an A suffix, the percentage by mass of antimony (Sb) as an
impurity element shall not exceed 0,50.
5.2.2 Variation B alloys
In alloys which are identified with a B suffix, the percentage by mass of antimony as an impurity
element shall not exceed 0,20.

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61190-1-3 © IEC:2002 – 21 –
5.2.3 Variation C alloys
In alloys which are identified with a C suffix, the percentage by mass of antimony as an
impurity element shall not exceed 0,05.
5.2.4 Variation D alloys
Alloys identified with a D suffix are ultra-pure alloys that are intended for use in barrier-free die
attachment applications. In alloys identified with a D suffix, the combined total percentage
by mass of all impurity elements shall not exceed 0,05 and the combined total percentage by
mass of each of the following sets of impurity elements shall not exceed 0,0005:
Set 1: Be, Hg, Mg, and Zn.  Set 2: As, Bi, P, and Sb.
5.2.5 Variation E alloys
In the alloy identified with an E suffix, the percentage of lead (Pb) shall not exceed 0,10 and
the percentage of antimony (Sb) shall not exceed 0,20.
5.3 Solder forms
This standard covers solders in the form of bars, wires, ribbons, and powders, and special
solders. Normally bar solders and solder powder are not fluxed, and wire, ribbon, and special
solders may be non-fluxed, flux-cored, flux-coated, or both flux-cored and flux-coated. Users
should determine from prospective sources the standard solder form characteristics that are
available and should specify standard characteristics to the maximum extent feasible.
5.3.1 Bar solder
The nominal cross-section area, the nominal length, and the nominal mass shall be as specified
(see A.2 item c). Unless otherwise specifi
...