EN 61190-1-3:2002

SLOVENSKI SIST EN 61190-1-3:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ICS 25.160.50; 31.190 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61190-1-3
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-3: Exigences relatives aux Teil 1-3: Anforderungen an
alliages à braser de catégorie Eletroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel für das
fluxées et non-fluxées pour les Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2002)
(CEI 61190-1-3:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2002 E
Foreword
The text of document 91/279/FDIS, future edition 1 of IEC 61190-1-3, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-3 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes B and ZA are normative and annex A is informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2002 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 61190-1-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60194 1999 Printed board design, manufacture and--
assembly - Terms and definitions
1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections
in electronics assembly
1) 2)
IEC 61190-1-2 - Part 1-2: Requirements for solder EN 61190-1-2 2002
pastes for high-quality interconnections
in electronics assembly
1) 2)
ISO 9002 - Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
ISO 9453 1990 Soft solder alloys - Chemical EN 29453 1993
compositions and forms
1) 2)
ISO 9454-1 - Soft soldering fluxes - Classification EN 29454-1 1993
and requirements
Part 1: Classification, labelling
and packaging
1) 2)
ISO 9454-2 - Part 2: Performance requirements EN ISO 9454-2 2000

1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE IEC
61190-1-3
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Matériaux de fixation pour
les assemblages électroniques –
Partie 1-3:
Exigences relatives aux alliages à braser
de catégorie électronique et brasures solides
fluxées et non fluxées pour les applications
de brasage électronique
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders for
electronic soldering applications
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
V
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

61190-1-3 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.9
2 Normative references.9
3 Classification .11
3.1 Alloy composition.11
3.2 Solder form .11
3.3 Flux type .11
3.4 Flux percentage and metal content .13
3.5 Other characteristics.15
4 Terms and definitions .15
5 Requirements .19
5.1 Materials .19
5.2 Alloys .19
5.3 Solder forms.21
5.4 Flux type and form.25
5.5 Flux residue dryness.25
5.6 Spitting.25
5.7 Solder-pool.25
5.8 Labelling for product identification.27
5.9 Workmanship .27
6 Quality assurance provisions.27
6.1 Responsibility for inspection and compliance.27
6.2 Classification of inspections.29
6.3 Material inspection.39
6.4 Qualification inspection.39
6.5 Quality conformance.41
6.6 Preparation of solder alloy for test.41
7 Preparation for delivery.41
7.1 Preservation, packing, and packaging .41
Annex A (informative).43
A.1 Intended use.43
A.2 Acquisition requirements.45
A.3 Standard solder product packages .47
A.4 Protocol for establishing short names for IEC 61190-1-3 alloys.47
A.5 Standard description of solid solder products .49
Annex B (normative) Solder alloys.51
Bibliography .65

61190-1-3 © IEC:2002 – 5 –
Figure 1 – Report form for solder alloy tests .31
Figure 2 – Report form for solder powder tests .33
Figure 3 – Report form for non-fluxed solder tests .35
Figure 4 – Report form for fluxed wire/ribbon solder tests .37
Table 1 – Solder materials.11
Table 2 – Flux types and designating symbols .13
Table 3 – Flux percentage.15
Table 4 – Standard solder powders .23
Table 5 – Solder inspections .39
Table B.1 – Composition and temperature characteristics of lead-free solder alloys .51
Table B.2 – Composition and temperature characteristics of common tin-lead alloys.53
Table B.3 – Composition and temperature characteristics for speciality
(non-tin/lead) alloys.57
Table B.4 – Cross-reference from solidus and liquidus temperatures
to alloy names by temperature.59
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations
to IEC 61190-1-3 alloy names .63

61190-1-3 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
in
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