SIST EN 16602-70-07:2015

SLOVENSKI STANDARD
SIST EN 16602-70-07:2015
01-januar-2015
Zagotavljanje varnih proizvodov v vesoljski tehniki - Preverjanje in odobritev
strojnega valovnega spajkanja
Space product assurance - Verification and approval of automatic machine wave
soldering
Raumfahrtproduktsicherung - Verifikation und Zulassung von
Maschinenschwalllötverfahren
Assurance produits des projets spatiaux - Validation et approbation du brasage
automatique à la vague
Ta slovenski standard je istoveten z: EN 16602-70-07:2014
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-07:2015 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 16602-70-07:2015

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SIST EN 16602-70-07:2015


EUROPEAN STANDARD
EN 16602-70-07

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2014
ICS 49.140 Supersedes EN 14612:2003
English version
Space product assurance - Verification and approval of
automatic machine wave soldering
Assurance produits des projets spatiaux - Validation et Raumfahrtproduktsicherung - Verifikation und Zulassung
approbation du brasage automatique à la vague von Maschinenschwalllötverfahren
This European Standard was approved by CEN on 20 March 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.






CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-07:2014 E
worldwide for CEN national Members and for CENELEC
Members.

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SIST EN 16602-70-07:2015
EN 16602-70-07:2014 (E)
Table of contents
Foreword . 4
Introduction . 5
1 Scope . 6
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 8
3.1 Terms from other standards . 8
3.2 Terms specific to the present standard . 8
3.3 Abbreviated terms. 9
4 Principles . 10
5 Requirements . 11
5.1 General . 11
5.1.1 PCB design constraints . 11
5.1.2 Rework . 11
5.2 Request for verification of the automatic wave soldering process . 12
5.2.1 General . 12
5.2.2 Technology samples . 12
5.2.3 Examination . 12
5.3 Line audit . 13
5.4 Verification . 13
5.4.1 Planning, management and finance . 13
5.4.2 Description of samples . 13
5.4.3 Initial tests . 14
5.4.4 Environmental exposure . 15
5.4.5 Final tests . 15
5.4.6 Final verification report . 16
5.5 Approval . 16
5.5.1 Notification . 16
5.5.2 Renewal of approval . 16
5.5.3 Withdrawal of approval . 16
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5.5.4 Approval for future project . 17
5.6 Process requirements for wave soldering of printed circuit boards . 17
Annex A (normative) Solder joint discrepancy log – DRD . 20
Annex B (normative) Request for verification of the automatic wave
soldering process - DRD. 22
Annex C (normative) Automatic wave soldering process verification
report – DRD . 24
Annex D (normative) Machine-soldering logbook – DRD . 26
Annex E (normative) Wave soldering process identification document
(PID) – DRD . 27
Bibliography . 28

Figures
Figure 4-1: Sequence of main events for final customer verification and approval of
wave soldering process . 10
Figure A-1 : Example of a solder joint discrepancy log . 21

Tables
Table 5-1: Limits for warp and twist . 14


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SIST EN 16602-70-07:2015
EN 16602-70-07:2014 (E)
Foreword
This document (EN 16602-70-07:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-07:2014) originates from ECSS-Q-ST-70-07C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by April 2015,
and conflicting national standards shall be withdrawn at the latest by April
2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document supersedes EN 14612:2003.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
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Introduction
Wave soldering is regarded as a critical process that can find limited application
during the assembly of components on to printed circuit boards (PCBs)
intended for spacecraft. The preferred procedure is by manual soldering to the
requirements of ECSS-Q-ST-70-08. Generally the small number of identically
designed circuits does not warrant the setting up of unique machine parameters
for each individual layout.
When wave soldering is identified as a suitable alternative to manual soldering
for use in the customer’s projects, it can be essential to follow the steps outlined
in this document before the final customer’s approval is granted. The sequence
of main events is shown in Figure 4-1. Each step is fully completed and the
details recorded, so that a dossier is compiled for each manufacturer’s assembly
line. All dossiers are kept updated by the approval authority and serve as a
reference for the approval authority’s Project Engineers.
A general qualification is not granted for wave soldering. Wave soldering lines
that have been previously verified (see also clause 5.2) can be also approved for
use on named projects, but this depends entirely on the specific project
requirements. Project process approval is requested, as for all materials and
critical processes, by means of ECSS-Q-ST-70.
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1
Scope
This specification defines the basic requirements for the verification and
approval of automatic machine wave soldering for use in spacecraft hardware.
The process requirements for wave soldering of double-sided and multilayer
boards are also defined.
This standard may be tailored for the specific characteristic and constrains of a
space project in conformance with ECSS-S-ST-00.
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2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms
EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance – Nonconformance control
system
EN 16602-70 ECSS-Q-ST-70 Space product assurance - Materials, mechanical
parts and processes
EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance - Manual soldering of
high-reliability electrical connections
EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance - Qualification of printed
circuit boards
EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance - Repair and modification of
printed circuit board assemblies for space use
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3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01
ECSS-Q-ST-70, ECSS-Q-ST-70-08 and ECSS-Q-ST-70-28 apply.
3.2 Terms specific to the present standard
3.2.1 approval authority
entity/organization responsible for executing (or sub-contracting) the
examination of the technology samples, performing the automatic wave
soldering process line-audit, authorizing the implementation of the supplier’s
verification programme, and notifying, renewing or withdrawing the approval
of the verification
NOTE The approval authority is the final customer or
the representative nominated by him. For
example, for ESA programmes, the final
customer is ESA.
3.2.2 component density
number of components per unit board area
3.2.3 ionisable contaminant
process residues that exist as ions and when dissolved, increase electrical
conductivity
NOTE Examples of such process residues flux are
activators, fingerprints, etching and plating
salts.
3.2.4 machine oil
liquid compounds formulated for use as oil in wave-soldering equipment
NOTE They serve primarily to provide a barrier
between the atmosphere and molten solder,
thereby reducing the oxidation (drossing) of the
solder. Certain oils also reduce the surface
tension of molten solder, thereby enhancing the
wetting characteristics of the solder.
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3.2.5 measling
condition existing in the base laminate of a printed circuit board in the form of
discrete white spots or “crosses” below the surface of the base laminate,
reflecting a separation of fibres in the glass cloth at the weave intersection
3.2.6 technology samples
samples of wave-solder assembled boards
NOTE These samples are provided by the supplier in
addition to the application for verification.
3.2.7 wave soldering
process wherein printed circuit boards are brought in contact with a gently
overflowing wave of liquid solder which is circulated by a pump in an
appropriately designed solder pot reservoir
NOTE The prime functions of the molten wave are to
serve as a heat source and heat transfer
medium and to supply solder to the joint area.
3.2.8 wave-soldering equipment
systems that achieve wave soldering
NOTE 1 A typical wave soldering equipment consist of
stations for fluxing, preheating, and soldering by
means of a conveyer.
NOTE 2 Cleaning is usually offered as an option. Normally,
additional cleaning can be required in order to
meet ECSS (or customer specific) cleanliness
standards.
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:

Abbreviation Meaning
process identification document
PID

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4
Principles
The sequence of main events for final customer verification and approval of
wave soldering process is given in Figure 4-1.

Identification of
wave solder
suitability
Process
Final Customer Verification
Verification
Request
Final Customer Assessment
Technology
on samples
samples
Final Customer Line Audit
Verification
Programme
(5.4)
Initial Tests
5 PCB samples
(5.4.3a.)
Environmental
Reference PCB
1 sample Exposure
4 samples
(5.4.3b.)
(5.4.4)
Final tests
(5.4.5)
Final Customer
Report
Approval
(5.4.6)
(5.5)

Figure 4-1: Sequence of main events for final customer verification and approval
of wave soldering process
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5
Requirements
5.1 General
5.1.1 PCB design constraints
a. The supplier shall specify to the designers of printed circuit boards
intended to be manufactured, the design constraints of using an
automatic wave soldering process.
b. The design constraint specification specified in 5.1.1a shall, at least,
include the following statements:
1. To avoid solder bridging, orient circuit tracks that are spaced close
together in line with the pass direction.
2. Avoid large heat sink areas for ground planes and large leads
closely connected to massive metal parts.
5.1.2 Rework
a. For rework of soldered joints, ECSS-Q-ST-70-08 shall apply with a
maximum of 5 % rework on each wave soldered circuit
NOTE Deficient wave-soldered connections are caused
most frequently by the movement of
component leads during solidification, the
presence of solder alloy within stress relief
bends and the entrapment of machine oils and
solder fluxes within the solder fillet. Rework of
any nature is costly. It involves not only the risk
of irreparable lifted pads and measling, but also
the possibility of heat damage to sensitive
components.
b. The supplier shall maintain a solder joint discrepancy log in conformance
with the DRD in Annex A.
NOTE This is an aid to process control, optimization of
parameters and repeatability.
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5.2 Request for verification of the automatic wave
soldering process
5.2.1 General
a. The supplier shall establish a request for verification of the automatic
wave soldering process in conformance with Annex B- DRD
b. The request for verification of the automatic wave soldering process shall
be signed by the supplier’s person responsible for space component
assembly processes.
c. The request for verification of the automatic wave soldering process shall
be submitted to the approval authority.
5.2.2 Technology samples
a. In addition to the request for verification of the automatic wave soldering
process, the supplier shall provide three technology samples of
wave-solder assembled boards whose complexity is typical of that found
in spacecraft and which meet space-quality workmanship standards.
b. The supplier shall perform a cleaning without conformal coating of the
samples specified in 5.2.2a.
c. The technology samples specified in 5.2.2a shall consist of PCBs procured
from a space-approved manufacturing line, which have been assembled
with components according to a documented procedure as specified in
clause 5.6.
d. The supplier shall provide a listing of the manufacturing and assembly
procedures specified in 5.2.2c, as part of the line’s Process Identification
Document (PID).
e. Except for the actual machine soldering procedure, the full component
assembly requirements of ECSS-Q-ST-70-08 shall apply.
f. The assembled board shall be free of flux residues and other
contaminants.
5.2.3 Examination
a. The technology samples shall be assessed by the approval authority or by
a test house recognized by the approval authority.
b. The assessment of the technology samples shall include visual and
metallographic inspections.
c. After examination, the technology samples examination report shall be
sent to the supplier.
NOTE The technology sample examination report is a
customer document provided to the supplier
and used as input for the customer to decide if
the verification programme can be
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implemented (see 5.4.1a). No DRD is specified
for this activity.
5.3 Line audit
a. Provided the technology samples are acceptable, the approval authority
shall audit the wave-soldering and related facilities at a time when the
equipment is in operation.
b. The audit shall also include a further on-site review of the documentation
listed in clauses B.2.1b and B.2.1h.
c. Compliance with the process requirements of clause 5.6 shall be
evaluated.
d. The approval authority shall submit to the supplier a copy of the audit
report.
NOTE The line audit report is a customer document
provided to the supplier and is used as input
for the customer to decide if the verification
programme can be further implemented (see
5.4.1a). No DRD is specified for this activity.
5.4 Verification
5.4.1 Planning, management and finance
a. After the successful completion of the line audit, the supplier shall
provide th
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