SIST EN 61188-5-8:2008

SLOVENSKI STANDARD
01-september-2008
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Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment
(land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-8:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Flächenmatrix-Bauelemente
(BGA, FBGA, CGA, LGA)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-8:
Considérations sur les liaisons pistes-soudures - Composants matriciels (BGA, FBGA,
CGA, LGA)
Ta slovenski standard je istoveten z: EN 61188-5-8:2008
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61188-5-8
NORME EUROPÉENNE
March 2008
EUROPÄISCHE NORM
ICS 31.180
English version
Printed boards and printed board assemblies -
Design and use -
Part 5-8: Attachment (land/joint) considerations -
Area array components (BGA, FBGA, CGA, LGA)
(IEC 61188-5-8:2007)
Cartes imprimées  Leiterplatten und Flachbaugruppen -
et cartes imprimées équipées - Konstruktion und Anwendung -
Conception et utilisation - Teil 5-8: Betrachtungen zur Montage
Partie 5-8: Considérations sur les liaisons (Anschlussfläche/Verbindung) -
pistes-soudures - Flächenmatrix-Bauelemente
Composants matriciels (BGA, FBGA, CGA, LGA)
(BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007)
(CEI 61188-5-8:2007)
This European Standard was approved by CENELEC on 2008-02-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-8:2008 E
Foreword
The text of document 91/705/FDIS, future edition 1 of IEC 61188-5-8, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61188-5-8 on 2008-02-01.
This European Standard is to be read in conjunction with EN 61188-5-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-11-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2011-02-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-8:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
__________
– 3 – EN 61188-5-8:2008
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-2-58 – Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods + corr. December 2004
for solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60191-2 Series Mechanical standardization of – –
semiconductor devices -
Part 2: Dimensions
1) 2)
IEC 61188-5-1 – Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements

1) 2)
IEC 62090 – Product package labels for electronic EN 62090 2003
components using bar code and two-
dimensional symbologies
1)
Undated reference.
2)
Valid edition at date of issue.

IEC 61188-5-8
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-8: Attachment (land/joint) considerations – Area array components (BGA,
FBGA, CGA, LGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.180 ISBN 2-8318-9343-7
– 2 – 61188-5-8 © IEC:2007(E)
CONTENTS
FOREWORD.04
INTRODUCTION.1H1H6

1 Scope.2H2H7
2 Normative references .3H3H7
3 General information.4H4H8
3.1 General component description .5H5H8
3.2 Marking .6H6H8
3.3 Carrier packaging format .7H7H9
3.4 Process considerations .8H8H9
4 BGA (square) .9H9H9
4.1 Field of application .10H10H9
4.2 Component descriptions .11H11H9
4.2.1 Basic construction .12H12H9
4.2.2 Termination materials .13H13H10
4.2.3 Marking .14H14H11
4.2.4 Carrier package format .15H15H11
4.2.5 Process considerations.16H16H11
4.3 Component dimensions (square) .17H17H11
4.3.1 PBGA 1,5 mm pitch component dimensions (square).18H18H12
4.3.2 PBGA 1,27 mm pitch component dimensions (square).19H19H14
4.3.3 PBGA 1,00 mm pitch component dimensions (square).20H20H15
4.4 Solder joint fillet design .21H21H17
4.4.1 Solder joint fillet design – Non-collapsing, collapsing (level 3) .22H22H17
4.5 Land pattern dimensions .23H23H18
4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square) .24H24H19
4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square) .25H25H21
4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square) .26H26H23
5 FBGA (square) .27H27H25
6 BGA (rectangular) .28H28H25
6.1 Field of application .29H29H25
6.2 Component descriptions .30H30H25
6.2.1 Basic construction .31H31H25
6.2.2 Termination materials .32H32H25
6.2.3 Marking .33H33H26
6.2.4 Carrier package format .34H34H26
6.2.5 Process considerations.35H35H26
6.3 Component dimensions (rectangular) .36H36H26
6.4 Solder joint fillet design .37H37H27
6.4.1 Solder joint fillet design – Collapsing (level 3) .38H38H27
6.4.2 Land approximation .39H39H28
6.4.3 Total variation .40H40H28
6.5 Land pattern dimensions .41H41H28
7 FBGA (rectangular) .42H42H29
8 CGA .43H43H29
9 LGA.44H44H29

61188-5-8 © IEC:2007(E) – 3 –
Bibliography.45H45H30

Figure 1 – Area array land pattern configuration .46H46H7
Figure 2 – BGA physical configuration examples .47H47H10
Figure 3 – High land and eutectic solder ball and joint comparison .48H48H10
Figure 4 – BGA (square) .49H49H11
Figure 5 – General BGA dimensional characteristics.50H50H12
Figure 6 – Solder joint fillet design.51H51H18
Figure 7 – BGA (square) land pattern dimensions .52H52H19

Table 1 – Ball diameter sizes .53H53H8
Table 2 – BGA products with pitch of 1,5 mm.54H54H13
Table 3 – BGA products with pitch of 1,27 mm.55H55H14
Table 4 – BGA products with pitch of 1,0 mm.56H56H16
Table 5 – BGA product land patterns with pitch of 1,50 mm .57H57H20
Table 6 – BGA product land patterns with pitch of 1,27 mm .58H58H22
Table 7 – BGA product land patterns with pitch of 1,00 mm .59H59H24
Table 8 – Rectangular BGA products with pitch of 1,27 mm .60H60H27
Table 9 – Rectangular BGA product land patterns with pitch of 1,27 mm.61H61H29

– 4 – 61188-5-8 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-8: Attachment (land/joint) considerations –
Area array components (BGA, FBGA, CGA, LGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-8 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/705/FDIS 91/737/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-8 is to be read in conjunction with IEC 61188-5-1.

61188-5-8 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date 0F indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 6 – 61188-5-8 © IEC:2007(E)
INTRODUCTION
This part of IEC 61188 covers land patterns for area array components which include ball grid
array (BGA) parts (rigid, flexible or ceramic substrate); fine pitch ball grid array (FBGA) parts
(rigid or flexible substrate); column grid array (CGA) parts (ceramic substrates) and land grid
array (LGA) parts (ceramic substrates). Each clause contains information in accordance with
the area array family of components and their requirements for appropriate land patterns.
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land geometries and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus the reflow soldering process.
Although other standards in the IEC 61188-5 series define three levels of land pattern
dimensioning, this standard will only define two levels. One level (level 2) is for non collapsing
BGA balls; the other level (level 3) is for those BGA components where the ball does collapse
around the land. All land descriptions are non-solder mask defined. Each land pattern has
been assigned an identification number to indicate the characteristics of the specific
robustness of the land patterns. Users also have the opportunity to organize the information
so that it is most useful for their particular design.
If a user has good reason to use a concept different from that of IEC 61188-5-1, or if the user
prefers unusual land geometries, this standard should be used for checking the resulting ball
to land relationship.
It is the responsibility of the user to verify the SMD land patterns used for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use. In addition, the size and shape of the proposed land pattern may
vary according to the solder resist aperture, the size of the land pattern extension (dog bone),
the via within the extension, or if the via is in the land pattern itself.
Dimensions of the components listed in this standard are of those available in the market, and
regarded as reference only.
61188-5-8 © IEC:2007(E) – 7 –
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-8: Attachment (land/joint) considerations –
Area array components (BGA, FBGA, CGA, LGA)

1 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with area array terminations in the form of solder balls,
solder columns or protective coated lands. The intent of the information presented herein is to
provide the appropriate size, shape and tolerances of surface mount land patterns to ensure
sufficient area for the appropriate solder joint, and also allow for inspection, testing and
reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design and the land pattern dimensions.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is
capable of establishing a reliable solder joint no matter which solder alloy is used to make
that joint (lead-free, tin lead, etc.).
Process requirements for solder reflow are different depending on the solder alloy and should
be analyzed so that the process is taking place above the liquidus temperature of the alloy,
and remains above that temperature a sufficient time to form a reliable metallurgical bond.
Area array land patterns do not use "land protrusion" concepts and attempt to match the
characteristics of the physical and dimensional termination properties. There are several
configurations available, as shown in Figure 1. However, the tables provided show only the
optimum dimension across the outer construction of the land.

Circle Hexagon
Via in Pad
Dog Bone
IEC  2028/07
Figure 1 – Area array land pattern configuration
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.

– 8 – 61188-5-8 © IEC:2007(E)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests: Test Td – Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60191-2 (all parts), Mechanical standardization of semiconductor devices – Part 2:
Dimensions
IEC 61188-5-1, Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
3 General information
3.1 General component description
The area array family is characterized by terminations that are on a particular pitch and
contain a number of rows and columns for the total IO termination pin count. The BGA family
uses a solder ball as a termination and may have a square or rectangular package
configuration. The family includes both moulded plastic and ceramic case styles. The
acronyms PBGA (plastic ball grid array), CBGA (ceramic ball grid array), FBGA (fine pitch ball
grid array), and TBGA (tape ball grid array) are also used to describe the family since they all
use a ball termination in an array format. Other enhancements such as the addition of thermal
heat distributors may be included in any of the package types described.
There are several ball pitch variations within the family; these range from 1,50 mm to 0,25 mm
as shown in Table 1. The lower pitch items (below 0,40 mm) are predicted for future
component configurations.
Table 1 – Ball diameter sizes
Solder bump Solder bump
Pitch
nominal diameter diameter variation
mm
mm mm
1,50; 1,27 0,75 0,90 – 0,65
1,00 0,60 0,70 – 0,50
1,00; 0,80 0,50 0,55 – 0,45
1,00; 0,80; 0,75 0,45 0,50 – 0,40
0,80; 0,75; 0.65 0,40 0,45 – 0,35
0,80; 0,75; 0,65; 0,50 0,30 0,35 – 0,25
0,40 0,25 0,28 – 0,22
0,30 0,20 0,22 – 0,18
0,25 0,15 0,17 – 0,13
3.2 Marking
The area array family of parts are generally marked with the manufacturer’s part numbers,
manufacturer’s name or symbol and a pin 1 indicator. Some parts may have a pin 1 feature in
the case shape instead of a pin 1 marking. Additional markings may include date-code
manufacturing lot and/or manufacturing location. Bar code marking should be in accordance
with IEC 62090.
61188-5-8 © IEC:2007(E) – 9 –
3.3 Carrier packaging format
Carrier tray packaging format or tape and reel may be provided. Either format is acceptable
and is usually specified by the component manufacturer or the assembler. Choice of format is
usually dependent on size of component and volume to be assembled. Bulk packaging is not
acceptable because of termination coplanarity issues and the requirements for placement and
soldering.
3.4 Process considerations
Area array packages are normally processed by reflow solder operations. There is also a
process difference between the solder application for those terminations that collapse slightly
during soldering as defined in level 3 of this standard, and those terminations that do not
collapse (level 2) where a significant amount of additional solder paste is required.
In conjunction with the right land size, the volume of the solder paste application is a
fundamental parameter to keep under control in order to have a good reflow quality yield and
reliable solder joint. Paste volume deposition may be a matter of SPC adoption at the print
process step.
Fine pitch ball parts may require special processing outside the normal pick/place and reflow
manufacturing operations. This requirement relates to the amount of solder paste, the
precision of the placement machine and the soldering process profile, in order to permit all
parts to become attached at the same time that the FBGA is reflowed.
4 BGA (square)
4.1 Field of application
This clause provides the component and land pattern dimensions for square type BGA (ball
grid array) components. The basic construction of the BGA device is also covered. At the end
of this clause is a listing of the tolerances and target solder joint dimensions used to arrive at
the land pattern dimensions.
4.2 Component descriptions
BGAs are widely used in a variety of applications for commercial, industrial or military
electronics.
4.2.1 Basic construction
The ball grid array has been developed for applications requiring low height and high density.
The BGA components may take many forms, as illustrated in Figure 2. Variations include the
method of die attach (wire bonding, flip chip, etc.), the substrate material (organic rigid or
flexible material, ceramic, etc.) and the method of protecting the device from the environment
(plastic encapsulation, hermetic sealing etc.). All variations can use the same land patterns
defined in this clause, as all types may be used in many printed circuit board assemblies for
device applications.
– 10 – 61188-5-8 © IEC:2007(E)

IC die
Epoxy
Au bond
overmold
Plastic BGA with wire bond
wires
chip attach
AG filled
BT/glass
Solder balls
die attach
PCB
(62/36/2 Sn/Pb/Ag)
IEC  2029/07
Silicon die
Thermal grease
Solder balls
Underfill
Ceramic BGA, hermetically
(97PB/3Sn)
sealed, with flip chip die
Sealing
attach
adhesive
Multiplayer alumina substrate
Solder
Solder balls
(37PB/63Sn)
(90PB/10Sn)
IEC  2030/07
Thermal grease
Silicon die
Underfill
Tape bonded grid array,
with flip chip die attach and
Heat spreader
enhanced thermal heat
Adhesive Copper ring Copper ring
spreader
Flex circuit
Solder balls Solder balls
(95Pb/5Sn) (90Pb/10Sn)
IEC  2031/07
Figure 2 – BGA physical configuration examples

4.2.2 Termination materials
The BGA ball termination may consist of a variety of metal alloys. Some of these include balls
with some lead content such as 37Pb63Sn, 90Pb10Sn, 95Pb5Sn, while others do not contain
lead such as Sn96,5Ag3,0Cu0,5, Sn96,5Ag3,5, Sn-9Zn-0,003Al. It is a good recommendation
to use the same alloy, in a paste form, to attach the BGA balls to the mounting substrate,
however, some of the balls that do not collapse, as shown in Figure 3, require a paste that is
more conducive to reflow temperatures.

Collapsing Non-collapsing
CBGA substrate
PBGA substrate
Eutectic ball
Ball
(Pb/Sn)
(90/10 Pb/Sn)
PWB
PWB
IEC  2032/07
Figure 3 – High land and eutectic solder ball and joint comparison

61188-5-8 © IEC:2007(E) – 11 –
4.2.3 Marking
All parts shall be marked with a part number and an index area. The index area shall identify
the location of pin 1.
4.2.4 Carrier package format
The carrier package format for BGAs may be tray or tape and reel format. In most instances,
BGAs are delivered in a carrier tray.
4.2.5 Process considerations
BGAs are usually processed using standard reflow solder processes. Parts should be capable
of withstanding three cycles through a standard reflow system operating within a range of
235 °C to 260 °C depending on the attachment alloy being used. Each cycle shall consist of a
60 s to 90 s exposure at the particular temperature selected. The construction of the BGA
resin system used for encapsulation, as shown in Figure 4, shall be capable of withstanding
the process temperature exposure. This capability may be verified through test methods
indicated in IEC 60068-2-58, Method 2, for three cycles with an appropriate dwell time to
allow the specimens to cool.
It is important to consider that plastic BGAs are moisture sensitive device/components.
Precaution shall be taken during the printed board assembly process in order to avoid MSD
damages (delamination, cracks, etc). Traceability for baking PBGA, might be required mainly
when attached in a double sided/reflow printed board assembly.

Chip
Resin
Au wires
Solder balls
Printed substrate
IEC  2033/07
Figure 4 – BGA (square)
4.3 Component dimensions (square)
This subclause contains the physical dimensions of various PBGAs that have been
standardized so that land pattern analysis can be performed. Figure 5 provides the general
characteristic of the component and shows a depopulated version of the BGA device. Each
manufacturer of a semiconductor may take the fully populated version and remove those
terminations (balls), as appropriate, to establish the final configuration of the part.
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA sheets.

– 12 – 61188-5-8 © IEC:2007(E)

E A L
A1
S
x
Inde Pin 1
IEC  2034/07
Figure 5 – General BGA dimensional characteristics
The following tables have been segmented according to the know pitch of those devices
presently in use. The requirements are fully documented in IEC 60191-2. The information is
provided for fully populated parts only, so that all the corresponding land patterns can be
derived. Users of the information are cautioned to be sure that their land pattern version is
identical to the part that they have purchased from the component supplier. It should also be
known that not every supplier follows the same removal of termination pattern for a similar
product. Thus, when looking for multiple sources, the user shall establish complete
compliance with the design image in the computer library before making the commitment that
the end use patterns may be used to mount different BGA component supplier parts.
4.3.1 PBGA 1,5 mm pitch component dimensions (square)
Table 2 defines the requirements for BGA components with a pitch of 1,5 mm.
b
e
61188-5-8 © IEC:2007(E) – 13 –
Table 2 – BGA products with pitch of 1,5 mm

A H C
Pin A1
Pin A1
indicator
F
IEC  2035/07
FE full even matrix
FO full odd matrix
Component Contact A B C D W P H F or G
identifier array
rows x
Max. Max. Max. Max. Nom. Basic Max. Nom.
columns
PBGA 7x7 FE16 4x4 7,00 7,00 4,50 4,50 0,75 1,50 3,50 1,25
PBGA 7x7 FO9 3x3 7,00 7,00 3,00 3,00 0,75 1,50 3,50 2,00
PBGA 8x8 FO25 5x5 8,00 8,00 6,00 6,00 0,75 1,50 3,50 1,00
PBGA 8x8 FE16 4x4 8,00 8,00 4,50 4,50 0,75 1,50 3,50 1,75
PBGA 9x9 FE36 6x6 9,00 9,00 7,50 7,50 0,75 1,50 3,50 0,75
PBGA 9x9 FO25 5x5 9,00 9,00 6,00 6,00 0,75 1,50 3,50 1,50
PBGA 10x10 FE36 6x6 10,00 10,00 7,50 7,50 0,75 1,50 3,50 1,25
PBGA 10x10 FO25 5x5 10,00 10,00 6,00 6,00 0,75 1,50 3,50 2,00
PBGA 11x11 FO49 7x7 11,00 11,00 9,00 9,00 0,75 1,50 3,50 1,00
PBGA 11x11 FE36 6x6 11,00 11,00 7,50 7,50 0,75 1,50 3,50 1,75
PBGA 12x12 FE64 8x8 12,00 12,00 10,50 10,50 0,75 1,50 3,50 0,75
PBGA 12x12 FO49 7x7 12,00 12,00 9,00 9,00 0,75 1,50 3,50 1,50
PBGA 13x13 FE64 8x8 13,00 13,00 10,50 10,50 0,75 1,50 3,50 1,25
PBGA 13x13 FO49 7x7 13,00 13,00 9,00 9,00 0,75 1,50 3,50 2,00
PBGA 14x14 FO81 9x9 14,00 14,00 12,00 12,00 0,75 1,50 3,50 1,00
PBGA 14x14 FE64 8x8 14,00 14,00 10,50 10,50 0,75 1,50 3,50 1,75
PBGA 15x15 FE100 10x10 15,00 15,00 13,50 13,50 0,75 1,50 3,50 0,75
PBGA 15x15 FO81 9x9 15,00 15,00 12,00 12,00 0,75 1,50 3,50 1,50
PBGA 17x17 FO121 11x11 17,00 17,00 15,00 15,00 0,75 1,50 3,50 1,00
PBGA 17x17 FE100 10x10 17,00 17,00 13,50 13,50 0,75 1,50 3,50 1,75
PBGA 19X19 FE144 12x12 19,00 19,00 16,50 16,50 0,75 1,50 3,50 1,25
PBGA 19X19 FO121 11x11 19,00 19,00 15,00 15,00 0,75 1,50 3,50 2,00
PBGA 21X21 FE196 14x14 21,00 21,00 19,50 19,50 0,75 1,50 3,50 0,75
PBGA 21X21 FO169 13x13 21,00 21,00 18,00 18,00 0,75 1,50 3,50 1,5
PBGA 23X23 FO225 15x15 23,00 23,00 21,00 21,00 0,75 1,50 3,50 1,00
PBGA 23X23 FE196 14x14 23,00 23,00 19,50 19,50 0,75 1,50 3,50 1,75
PBGA 25X25 FE256 16x16 25,00 25,00 22,50 22,50 0,75 1,50 3,50 1,25
PBGA 25X25 FO225 15x15 25,00 25,00 21,00 21,00 0,75 1,50 3,50 2,00
PBGA 27X27 FE324 18x18 27,00 27,00 25,50 25,50 0,75 1,50 3,50 0,75
PBGA 27X27 FO289 17x17 27,00 27,00 24,00 24,00 0,75 1,50 3,50 1,50
PBGA 29X29 FO361 19x19 29,00 29,00 27,00 27,00 0,75 1,50 3,50 1,00
PBGA 29X29 FE324 18x18 29,00 29,00 25,50 25,50 0,75 1,50 3,50 1,75
PBGA 31X31 FE400 20x20 31,00 31,00 28,50 28,50 0,75 1,50 3,50 1,25
PBGA 31X31 FO361 19x19 31,00 31,00 27,00 27,00 0,75 1,50 3,50 2,00
PBGA 33X33 FE484 22x22 33,00 33,00 31,50 31,50 0,75 1,50 3,50 0,75
PBGA 33X33 FO441 21x21 33,00 33,00 30,00 30,00 0,75 1,50 3,50 1,50
PBGA 35X35 FO529 23x23 35,00 35,00 33,00 33,00 0,75 1,50 3,50 1,00
PBGA 35X35 FE484 22x22 35,00 35,00 31,50 31,50 0,75 1,50 3,50 1,75
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Table 2 (continued)
Component Contact A B C D W P H F or G
identifier array
rows x
Max. Max. Max. Max. Nom. Basic Max. Nom.
columns
PBGA 37,5X37,5 25x25 37,50 37,50 36,00 36,00 0,75 1,50 3,50 0,75
FO625
PBGA 37,5X37,5 24x24 37,50 37,50 34,50 34,50 0,75 1,50 3,50 1,50
FE576
PBGA 40X40 FE676 26x26 40,00 40,00 37,50 37,50 0,75 1,50 3,50 1,25
PBGA 40X40 FO625 25x25 40,00 40,00 36,00 36,00 0,75 1,50 3,50 2,00
PBGA 42,5X42,5 28x28 42,50 42,50 40,50 40,50 0,75 1,50 3,50 1,00
FE784
PBGA 42,5X42,5 27x27 42,50 42,50 39,00 39,00 0,75 1,50 3,50 1,75
FO729
PBGA 45X45 FE900 30x30 45,00 45,00 43,50 43,50 0,75 1,50 3,50 0,75
PBGA 45X45 FO841 29x29 45,00 45,00 42,00 42,00 0,75 1,50 3,50 1,50
PBGA 47,5X47,5
31x31 47,50 47,50 45,00 45,00 0,75 1,50 3,50 1,25
FO961
PBGA 47,5X47,5
30x30 47,50 47,50 43,50 43,50 0,75 1,50 3,50 2,00
FE900
PBGA 50X50 FO1089 33x33 50,00 50,00 48,00 48,00 0,75 1,50 3,50 1,00
PBGA 50X50 FE1024 32x32 50,00 50,00 46,50 46,50 0,75 1,50 3,50 1,75
Unit dimensions are in millimetres.
4.3.2 PBGA 1,27 mm pitch component dimensions (square)
Table 3 defines the requirements for BGA components with a pitch of 1,27 mm.
Table 3 – BGA products with pitch of 1,27 mm

A H C
Pin A1
Pin A1
indicator
F
IEC  2035/07
FE full even matrix
FO full odd matrix
Component Contact A B C D W P H F or G
identifier array
rows x
Max. Max. Max. Max. Nom. Basic Max. Nom.
columns
PBGA 7x7 FO25 5x5 7,00 7,00 5,08 5,08 0,75 1,27 3,50 0,96
PBGA 7x7 FE16 4x4 7,00 7,00 3,81 3,81 0,75 1,27 3,50 1,6
PBGA 8x8 FE36 6x6 8,00 8,00 6,35 6,35 0,75 1,27 3,50 0,82
PBGA 8x8 FO25 5x5 8,00 8,00 5,08 5,08 0,75 1,27 3,50 1,46
PBGA 9x9 FE36 6x6 9,00 9,00 6,35 6,35 0,75 1,27 3,50 1,32
PBGA 9x9 FO25 5x5 9,00 9,00 5,08 5,08 0,75 1,27 3,50 1,96
PBGA 10x10 FO49 7x7 10,00 10,00 7,62 7,62 0,75 1,27 3,50 1,19
PBGA 10x 10 FE36 6x6 10,00 10,00 6,35 6,35 0,75 1,27 3,50 1,82

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61188-5-8 © IEC:2007(E) – 15 –
Table 3 (continued)
PBGA 11x11 FE64 8x8 11,00 11,00 8,89 8,89 0,75 1,27 3,50 1,05
PBGA 11x11 FO49 7x7 11,00 11,00 7,62 7,62 0,75 1,27 3,50 1,69
Component Contact A B C D W P H F or G
identifier array
rows x
Max. Max. Max. Max. Nom. Basic Max. Nom.
columns
PBGA 12x12 FO81 9x9 12,00 12,00 10,16 10,16 0,75 1,27 3,50 0,92
PBGA 12x12 FE64 8x8 12,00 12,00 8,89 8,89 0,75 1,27 3,50 1,56
PBGA 13x13 FE100 10x10 13,00 13,00 11,43 11,43 0,75 1,27 3,50 0,78
PBGA 13x13 FO81 9x9 13,00 13,00 10,16 10,16 0,75 1,27 3,50 1,42
PBGA 14x14 FE100 10x10 14,00 14,00 11,43 11,43 0,75 1,27 3,50 1,28
PBGA 14x14 FO81 9x9 14,00 14,00 10,16 10,16 0,75 1,27 3,50 1,92
PBGA 15x15 FO121 11x11 15,00 15,00 12,70 12,70 0,75 1,27 3,50 1,15
PBGA 15x15 FE100 10x10 15,00 15,00 11,43 11,43 0,75 1,27 3,50 1,78
PBGA 17x17 FO169 13x13 17,00 17,00 15,24 15,24 0,75 1,27 3,50 0,88
PBGA 17x17 FE144 12x12 17,00 17,00 13,97 13,97 0,75 1,27 3,50 1,51
PBGA 19X19 FE196 14x14 19,00 19,00 16,51 16,51 0,75 1,27 3,50 1,24
PBGA 19X19 FO169 13x13 19,00 19,00 15,24 15,24 0,75 1,27 3,50 1,88
PBGA 21X21 FE256 16x16 21,00 21,00 19,05 19,05 0,75 1,27 3,50 0,971
PBGA 21X21 FO225 15x15 21,00 21,00 17,78 17,78 0,75 1,27 3,50 1,6
PBGA 23X23 FE324 18x18 23,00 23,00 21,59 21,59 0,75 1,27 3,50 0,70
PBGA 23X23 FO289 17x17 23,00 23,00 20,32 20,32 0,75 1,27 3,50 1,34
PBGA 25X25 FO361 19x19 25,00 25,00 22,86 22,86 0,75 1,27 3,50 1,07
PBGA 25X25 FE324 18x18 25,00 25,00 21,59 21,59 0,75 1,27 3,50 1,70
PBGA 27X27 FO441 21x21 27,00 27,00 25,40 25,40 0,75 1,27 3,50 0,80
PBGA 27X27 FE400 20x20 27,00 27,00 24,13 24,13 0,75 1,27 3,50 1,43
PBGA 29X29 FE484 22x22 29,00 29,00 26,67 26,67 0,75 1,27 3,50 1,16
PBGA 29X29 FO441 21x21 29,00 29,00 25,40 25,40 0,75 1,27 3,50 1,80
PBGA 31X31 FE576 24x24 31,00 31,00 29,21 29,21 0,75 1,27 3,50 0,89
PBGA 31X31 FO529 23x23 31,00 31,00 27,94 27,94 0,75 1,27 3,50 1,53
PBGA 33X33 FO625 25x25 33,00 33,00 30,48 30,48 0,75 1,27 3,50 1,26
PBGA 33X33 FE576 24x24 33,00 33,00 29,21 29,21 0,75 1,27 3,50 1,89
PBGA 35X35 FO729 27x27 35,00 35,00 33,02 33,02 0,75 1,27 3,50 0,99
PBGA 35X35 FE676 26x26 35,00 35,00 31,75 31,75 0,75 1,27 3,50 1,62
PBGA 37,5X37,5 29x29 37,50 37,50 35,56 35,56 0,75 1,27 3,50 0,97
FO841
PBGA 37,5X37,5 28x28 37,50 37,50 34,29 34,29 0,75 1,27 3,50 1,60
FE784
PBGA 40X40 FO961 31x31 40,00 40,00 38,10 38,10 0,75 1,27 3,50 0,95
PBGA 40X40 FE900 30x30 40,00 40,00 36,83 36,83 0,75 1,27 3,50 1,58
PBGA 42,5X42,5 33x33 42,50 42,50 40,64 40,64 0,75 1,27 3,50 0,93
FO1089
PBGA 42,5X42,5 32x32 42,50 42,50 39,37 39,37 0,75 1,27 3,50 1,56
FE1024
PBGA 45X45 FO1225 35x35 45,00 45,00 43,18 43,18 0,75 1,27 3,50 0,91
PBGA 45X45 FO1156 34x34 45,00 45,00 41,91 41,91 0,75 1,27 3,50 1,54
PBGA 47,5X47,5
37x37 47,50 47,50 45,72 45,72 0,75 1,27 3,50 0,89
FO1369
PBGA 47,5X47,5
36x36 47,50 47,50 44,45 44,45 0,75 1,27 3,50 1,52
FE1296
PBGA 50X50 FO1521 39x39 50,00 50,00 48,26 48,26 0,75 1,27 3,50 0,87
PBGA 50X50 FE1444 38x38 50,00 50,00 46,99 46,99 0,75 1,27 3,50 1,50
Unit dimensions are in millimetres.

4.3.3 PBGA 1,00 mm pitch component dimensions (square)
Table 4 defines the requirements for BGA components with a pitch of 1,00 mm.

– 16 – 61188-5-8 © IEC:2007(E)
Table 4 – BGA products with pitch of 1,0 mm

A H C
Pin A1
Pin A1
indicator
F
IEC  2035/07
FE full even matrix
FO full odd matrix
Component Contact A B C D W P H F or G
identifier array
rows x
Max. Max. Max. Max. Nom. Basic Max. Nom.
columns
PBGA 7x7 FE36 6x6 7,00 7,00 5,00 5,00 0,60 1,00 3,50 1,00
PBGA 7x7 FO25 5x5 7,00 7,00 4,00 4,00 0,60 1,00 3,50 1,50
PBGA 8x8 F049 7x7 8,00 8,00 6,00 6,00 0,60 1,00 3,50 1,00
PBGA 8x8 FE36 6x6 8,00 8,00 5,00 5,00 0,60 1,00 3,50 1,50
PBGA 9x9 FE64 8x8 9,00 9,00 7,00 7,00 0,60 1,00 3,50 1,00
PBGA 9x9 FO49 7x7 9,00 9,00 6,00 6,00 0,60 1,00 3,50 1,50
PBGA 10x10 FO81 9x9 10,00 10,00 8,00 8,00 0,60 1,00 3,50 1,00
PBGA 10x10 FE64 8x8 10,00 10,00 7,00 7,00 0,60 1,00 3,50 1,50
PBGA 11x11 FE100 10x10 11,00 11,00 9,00 9,00 0,60 1,00 3,50 1,00
PBGA 11x11 FO81 9x9 11,00 11,00 8,00 8,00 0,60 1,00 3,50 1,50
PBGA 12x12 FO121 11x11 12,00 12,00 10,00 10,00 0,60 1,00 3,50 1,00
PBGA 12x12 FE100 10x10 12,00 12,00 9,00 9,00 0,60 1,00 3,50 1,50
PBGA 13x13 FE144 12x12 13,00 13,00 11,00 11,00 0,60 1,00 3,50 1,00
PBGA 13x13 FO121 11x11 13,00 13,00 10,00 10,00 0,60 1,00 3,50 1,50
PBGA 14x14 FO169 13x13 14,00 14,00 12,00 12,00 0,60 1,00 3,50 1,00
PBGA 14x14 FE144 12x12 14,00 14,00 11,00 11,00 0,60 1,00 3,50 1,50
PBGA 15x15 FE196 14x14 15,00 15,00 13,00 13,00 0,60 1,00 3,50 1,00
PBGA 15x15 FO169 13x13 15,00 15,00 12,00 12,00 0,60 1,00 3,50 1,50
PBGA 17x17 FE256 16x16 17,00 17,00 15,00 15,00 0,60 1,00 3,50 1,00
PGBA 17x17 FO225 15x15 17,00 17,00 14,00 14,00 0,60 1,00 3,50 1,50
PBGA 19X19 FE324 18X18 19,00 19,00 17,00 17,00 0,60 1,00 3,50 1,00
PBGA 19x19 FO289 17x17 19,00 19,00 16,00 16,00 0,60 1,00 3,50 1,50
PBGA 21X21 FE400 20X20 21,00 21,00 19,00 19,00 0,60 1,00 3,50 1,00
PBGA 21x21 FO361 19x19 21,00 21,00 18,00 18,00 0,60 1,00 3,50 1,50
PBGA 23X23 FE484 22X22 23,00 23,00 21,00 21,00 0,60 1,00 3,50 1,00
PBGA 23x23 FO441 21x21 23,00 23,00 20,00 20,00 0,60 1,00 3,50 1,50
PBGA 25X25 FE576 24X24 25,00 25,00 23,00 23,00 0,60 1,00 3,50 1,00
PBGA 25x25 FO529 23x23 25,00 25,00 22,00 22,00 0,60 1,00 3,50 1,50
PBGA 27X27 FE676 26X26 27,00 27,00 25,00 25,00 0,60 1,00 3,50 1,00
PBGA 27X27 FO625 25x25 27,00 27,00 24,00 24,00 0,60 1,00 3,50 1,50
PBGA 29X29 FE784 28X28 29,00 29,00 27,00 27,00 0,60 1,00 3,50 1,00
PBGA 29X29 FO729 27x27 29,00 29,00 26,00 26,00 0,60 1,00 3,50 1,50
PBGA 31X31 FE900 30X30 31,00 31,00 29,00 29,00 0,60 1,00 3,50 1,00
PBGA 31X31 FO841 29x29 31,00 31,00 28,00 28,00 0,60 1,00 3,50 1,50
PBGA 33X33 FE1024 32X32 33,00 33,00 31,00 31,00 0,60 1,00 3,50 1,00
PBGA 33X33 FO961 31x31 33,00 33,00 30,00 30,00 0,60 1,00 3,50 1,50
PBGA 35X35 FE1156 34X34 35,00 35,00 33,00 33,00 0,60 1,00 3,50 1,00
PBGA 35X35 FO1089 33x33 35,00 35,00 32,00 32,00 0,60 1,00 3,50 1,50
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