SIST EN 60747-16-5:2014

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - 16-5. del: Mikrovalovna integrirana vezja - Oscilatorji (IEC 60747-16-5:2013)Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators31.200Integrirana vezja, mikroelektronikaIntegrated circuits. Microelectronics31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60747-16-5:2013SIST EN 60747-16-5:2014en01-maj-2014SIST EN 60747-16-5:2014SLOVENSKI
STANDARD
EUROPEAN STANDARD EN 60747-16-5 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2013
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2013 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60747-16-5:2013 E
ICS 31.080.99
English version
Semiconductor devices -
Part 16-5: Microwave integrated circuits -
Oscillators (IEC 60747-16-5:2013)
Dispositifs à semiconducteurs -
Partie 16-5: Circuits intégrés hyperfréquences -
Oscillateurs (CEI 60747-16-5:2013)
Halbleiterbauelemente -
Teil 16-5: Integrierte Mikrowellenschaltkreise -
Oszillatoren (IEC 60747-16-5:2013)
This European Standard was approved by CENELEC on 2013-07-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
Foreword The text of document 47E/452/FDIS, future edition 1 of IEC 60747-16-5, prepared by SC 47E, "Discrete semiconductor devices", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60747-16-5:2013. The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-04-24 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-07-24
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60747-16-5:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60679-1:2007 NOTE
Harmonized as EN 60679-1:2007 (not modified).
- 3 - EN 60747-16-5:2013
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60617 Data base Graphical symbols for diagrams - -
IEC 60747-1 + corr. August
+ A1 2006 2008 2010 Semiconductor devices -
Part 1: General - -
IEC 60747-4 2007 Semiconductor devices - Discrete devices -
Part 4: Microwave diodes and transistors - -
IEC 60747-16-3 + A1 2002 2009 Semiconductor devices -
Part 16-3: Microwave integrated circuits - Frequency converters EN 60747-16-3 + A1 2002 2009
IEC 61340-5-1 - Electrostatics -
Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements EN 61340-5-1 -
IEC/TR 61340-5-2 - Electrostatics -
Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide CLC/TR 61340-5-2 -
IEC 60747-16-5 Edition 1.0 2013-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators
Dispositifs à semiconducteurs –
Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-83220-827-4
– 2 – 60747-16-5  IEC:2013 CONTENTS FOREWORD . 6 1 Scope . 8 2 Normative references . 8 3 Terms and definitions . 8 4 Essential ratings and characteristics . 11 4.1 General requirements . 11 4.1.1 Circuit identification and types . 11 4.1.2 General function description . 11 4.1.3 Manufacturing technology . 11 4.1.4 Package identification . 11 4.2 Application description . 11 4.2.1 Conformance to system and/or interface information . 11 4.2.2 Overall block diagram . 11 4.2.3 Reference data . 11 4.2.4 Electrical compatibility . 12 4.2.5 Associated devices . 12 4.3 Specification of the function . 12 4.3.1 Detailed block diagram – Functional blocks . 12 4.3.2 Identification and function of terminals . 12 4.3.3 Function description . 13 4.4 Limiting values (absolute maximum rating system) . 13 4.4.1 Requirements . 13 4.4.2 Electrical limiting values . 14 4.4.3 Temperatures . 14 4.5 Operating conditions (within the specified operating temperature range) . 15 4.6 Electrical characteristics . 15 4.7 Mechanical and environmental ratings, characteristics and data . 16 4.8 Additional information . 16 5 Measuring methods . 16 5.1 General . 16 5.1.1 General precautions . 16 5.1.2 Characteristic impedance . 17 5.1.3 Handling precautions . 17 5.1.4 Types . 17 5.2 Oscillation frequency (fosc) . 17 5.2.1 Purpose . 17 5.2.2 Circuit diagram . 17 5.2.3 Principle of measurement . 17 5.2.4 Circuit description and requirements . 17 5.2.5 Precautions to be observed . 17 5.2.6 Measurement procedure . 18 5.2.7 Specified conditions . 18 5.3 Output power (Po,osc) . 18 5.3.1 Purpose . 18 5.3.2 Circuit diagram . 18 5.3.3 Principle of measurement . 18 SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 3 – 5.3.4 Circuit description and requirements . 18 5.3.5 Precautions to be observed . 18 5.3.6 Measurement procedure . 18 5.3.7 Specified conditions . 18 5.4 Phase noise (L (f)) . 19 5.4.1 Purpose . 19 5.4.2 Measuring methods . 19 5.5 Tuning sensitivity (Sf,v) . 24 5.5.1 Purpose . 24 5.5.2 Circuit diagram . 24 5.5.3 Principle of measurement . 24 5.5.4 Circuit description and requirements . 24 5.5.5 Precautions to be observed . 24 5.5.6 Measurement procedure . 24 5.5.7 Specified conditions . 24 5.6 Frequency pushing (fosc,push) . 24 5.6.1 Purpose . 24 5.6.2 Circuit diagram . 25 5.6.3 Principle of measurement . 25 5.6.4 Circuit description and requirements . 25 5.6.5 Precautions to be observed . 25 5.6.6 Measurement procedure . 25 5.6.7 Specified conditions . 25 5.7 Frequency pulling (fosc,pull) . 25 5.7.1 Purpose . 25 5.7.2 Circuit diagram . 25 5.7.3 Principle of measurement . 26 5.7.4 Circuit description and requirements . 26 5.7.5 Precautions to be observed . 26 5.7.6 Measurement procedure . 26 5.7.7 Specified conditions . 27 5.8 n-th order harmonic distortion ratio (Pnth/P1) . 27 5.8.1 Purpose . 27 5.8.2 Circuit diagram . 27 5.8.3 Principle of measurement . 27 5.8.4 Circuit description and requirements . 27 5.8.5 Measurement procedure . 27 5.8.6 Specified conditions . 27 5.9 Output power flatness (∆Po,osc) . 28 5.9.1 Purpose . 28 5.9.2 Circuit diagram . 28 5.9.3 Principle of measurement . 28 5.9.4 Circuit description and requirements . 28 5.9.5 Precautions to be observed . 28 5.9.6 Measurement procedure . 28 5.9.7 Specified conditions . 28 5.10 Tuning linearity . 28 5.10.1 Purpose . 28 5.10.2 Circuit diagram . 28 SIST EN 60747-16-5:2014

– 4 – 60747-16-5  IEC:2013 5.10.3 Principle of measurement . 29 5.10.4 Circuit description and requirements . 29 5.10.5 Precautions to be observed . 29 5.10.6 Measurement procedure . 29 5.10.7 Specified conditions . 30 5.11 Frequency temperature coefficient (αf,temp) . 30 5.11.1 Purpose . 30 5.11.2 Circuit diagram . 30 5.11.3 Principle of measurement . 30 5.11.4 Circuit description and requirements . 31 5.11.5 Precautions to be observed . 31 5.11.6 Measurement procedure . 31 5.11.7 Specified conditions . 31 5.12 Output power temperature coefficient (αP,temp). 31 5.12.1 Purpose . 31 5.12.2 Circuit diagram . 31 5.12.3 Principle of measurement . 31 5.12.4 Circuit description and requirements . 32 5.12.5 Precautions to be observed . 32 5.12.6 Measurement procedure . 32 5.12.7 Specified conditions . 32 5.13 Spurious distortion ratio (Ps/P1) . 32 5.13.1 Purpose . 32 5.13.2 Circuit diagram . 32 5.13.3 Principle of measurement . 32 5.13.4 Circuit description and requirements . 33 5.13.5 Measurement procedure . 33 5.13.6 Specified conditions . 33 5.14 Modulation bandwidth (Bmod). 33 5.14.1 Purpose . 33 5.14.2 Circuit diagram . 33 5.14.3 Principle of measurement . 34 5.14.4 Circuit description and requirements . 34 5.14.5 Precautions to be observed . 34 5.14.6 Measurement procedure . 34 5.14.7 Specified conditions . 35 5.15 Sensitivity flatness . 35 5.15.1 Purpose . 35 5.15.2 Circuit diagram . 35 5.15.3 Principle of measurement . 35 5.15.4 Circuit description and requirements . 36 5.15.5 Precautions to be observed . 36 5.15.6 Measurement procedure . 36 5.15.7 Specified conditions . 36 6 Verifying methods . 36 6.1 Load mismatch tolerance (ΨL) . 36 6.1.1 Purpose . 36 6.1.2 Verifying method 1 (spurious intensity) . 36 SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 5 – 6.1.3 Verifying method 2 (no discontinuity of frequency tuning characteristics of VCO) . 37 6.2 Load mismatch ruggedness (ΨR) . 38 6.2.1 Purpose . 38 6.2.2 Circuit diagram . 38 6.2.3 Circuit description and requirements . 38 6.2.4 Precautions to be observed . 38 6.2.5 Test Procedure . 38 6.2.6 Specified conditions . 39 Bibliography . 40
Figure 1 – Circuit diagram for the measurement of the oscillation frequency fosc . 17 Figure 2 – Circuit diagram for the measurement of the phase noise L (f) (method 1) . 20 Figure 3 – Circuit diagram for the measurement of the phase noise L (f) (method 2) . 21 Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 3) . 22 Figure 5 – Circuit diagram for the measurement of the frequency pulling fosc,pull . 26 Figure 6 – Tuning linearity . 29 Figure 7 – Circuit diagram for the measurement of the oscillation frequency temperature coefficient αf,temp . 30 Figure 8 – Circuit diagram for the measurement of the modulation bandwidth Bmod . 34 Figure 9 – Sensitivity flatness . 36
Table 1 – Comparison of phase noise measuring methods . 19
– 6 – 60747-16-5  IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60747-16-5 has been prepared by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47E/452/FDIS 47E/454/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60747 series, published under the general title Semiconductor devices, can be found on the IEC website. SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 7 – The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
– 8 – 60747-16-5  IEC:2013 SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
1 Scope This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators. This standard is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscillator modules such as synthesizers which require external controllers. NOTE This document is not applicable to the quartz crystal controlled oscillators. They are specified by IEC 60679-1. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60617, Graphical symbols for diagrams (available from ) IEC 60747-1:2006, Semiconductor devices – Part 1: General 1)
Amendment 1:2010 IEC 60747-4:2007, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and transistors IEC 60747-16-3:2002, Semiconductor devices – Part 16-3: Microwave integrated circuits – Frequency converters 2)
Amendment 1:2009 IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide
3 Terms and definitions 3.1
oscillation frequency fosc frequency measured at the output port ___________ 1) A consolidated edition (2010) exists, including IEC 60747-1:2006 and its Amendment 1.
2) A consolidated edition (2010) exists, including IEC 60747-16-3:2002 and its Amendment 1. SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 9 – 3.2
output power Po,osc power measured at the output port 3.3
phase noise L
(f) frequency-domain measure of the short-term frequency stability of an oscillator, normally expressed as the power spectral density of the phase fluctuations, S3(f), where the phase fluctuation function is 3(t) = 2π Ft-2πF0t
Note 1 to entry: The spectral density of phase fluctuation can be directly related to the spectral density of frequency fluctuation by ()()Hz/rad220fSfFfSy3= where F is the oscillator frequency; F0 is the average oscillator frequency; f
is the Fourier frequency. Note 2 to entry:
L (f) is pronounced "script-ell of f". [SOURCE: IEC 60679-1:2007, 3.2.25, modified – A symbol and two notes have been added. The explanation of the spectral density of phase fluctuation has been moved to a note] 3.4
tuning sensitivity Sf,v ratio of the change of oscillation frequency to the variation of the control voltage
3.5
frequency pushing fosc,push change of the oscillation frequency with the variation of the bias voltage
3.6
frequency pulling fosc,pull change of the oscillation frequency with all phase angles for constant load reflection coefficient
3.7
n-th order harmonic distortion ratio Pnth/P1 ratio of the power of the n-th order harmonic component at the output port to the output power at the oscillation frequency 3.8
oscillation frequency range difference between the oscillation frequencies at the maximum control voltage and at the minimum control voltage SIST EN 60747-16-5:2014

– 10 – 60747-16-5  IEC:2013 3.9
output power flatness ∆Po,osc difference between the maximum and the minimum output power within the control voltage range 3.10
tuning linearity ratio of the maximum departure of the oscillation frequency from an ideal straight line between its values at the minimum and maximum control voltages to the oscillation frequency range 3.11
oscillation frequency temperature coefficient αf,temp ratio of the change in oscillation frequency to the corresponding change in temperature 3.12
output power temperature coefficient αP,temp ratio of the change in output power to the corresponding change in temperature 3.13
spurious distortion ratio Ps/P1=ratio of the power of the maximum spurious component at the output port to the output power at the oscillation frequency 3.14
load mismatch tolerance ΨL maximum load VSWR (voltage standing-wave ratio) in the range where the device oscillates with no unexpected spurious intensity and/or no discontinuity of frequency tuning characteristics (in case of VCO) at all phase angles 3.15
load mismatch ruggedness ΨR maximum load VSWR in the range where the device withstand load mismatch with no degradation at all phase angles with specified conditions
[SOURCE: IEC 60747-4:2007, 7.2.22] 3.16
modulation bandwidth Bmod modulating frequency at which the frequency deviation decreases by 3 dB from its dc value 3.17
sensitivity flatness ratio of the maximum departure of the tuning sensitivity from an ideal straight line between its values at the minimum and maximum control voltages to the oscillation frequency range SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 11 – 4 Essential ratings and characteristics 4.1 General requirements 4.1.1 Circuit identification and types The identification of type (device name), the category of circuit and technology applied shall be given.
Microwave oscillators are divided into two categories: – type A: fixed oscillator; – type B: voltage controlled oscillator. 4.1.2 General function description A general description of the function performed by the integrated circuit microwave oscillators and the features for the application shall be made. 4.1.3 Manufacturing technology The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film integrated circuit, micro-assembly, etc. shall be stated. This statement shall include details of the semiconductor technologies such as Schottky barrier diode, MESFET, Si bipolar transistor, etc. IEC 60747-4 shall be referred to for terminology and letter symbols, essential ratings and characteristics and measuring methods of such microwave devices. 4.1.4 Package identification The following statements shall be made: a) chip or packaged form; b) IEC and/or national reference number of the outline drawing, or drawing of non-standard package including terminal numbering; c) principal package material, for example, metal, ceramic, plastic. 4.2 Application description 4.2.1 Conformance to system and/or interface information It should be stated whether the integrated circuit conforms to an application system and/or an interface standard or a recommendation. Detailed information concerning application systems, equipment and circuits such as very small aperture terminal (VSAT) systems, broadcasting satellite (BS) receivers, microwave landing systems, etc. should also be given. 4.2.2 Overall block diagram A block diagram of the applied systems should be given if necessary. 4.2.3 Reference data The most important properties that permit comparison between derivative types should be given. SIST EN 60747-16-5:2014

– 12 – 60747-16-5  IEC:2013 4.2.4 Electrical compatibility It should be stated whether the integrated circuit is electrically compatible with other particular integrated circuits, or families of integrated circuits, or whether special interfaces are required. Details should be given concerning the type of output circuits, e.g. output impedances, d.c. block, open-drain, etc. Interchangeability with other devices, if any, should also be given.
4.2.5 Associated devices If applicable, the following should be stated: – devices necessary for correct operation (list with type number, name and function); – peripheral devices with direct interfacing (list with type number, name and function). 4.3 Specification of the function 4.3.1 Detailed block diagram – Functional blocks A detail block diagram or equivalent circuit information of the integrated circuit microwave
oscillators shall be given. The block diagram shall be composed of the following: a) functional blocks; b) mutual interconnections among the functional blocks; c) individual functional units within the functional blocks; d) mutual interconnections among the individual functional blocks; e) function of each external connection; f) inter-dependence between the separate functional blocks. The block diagram shall identify the function of each external connection and, where no ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has metallic parts, any connection to them from external terminals shall be indicated. The connections with any associated external electrical elements shall be stated, where necessary. As additional information, the complete electrical circuit diagram can be reproduced, but not necessarily with indications of the values of the circuit components. The graphical symbol for the function shall be given. Rules governing such diagrams may be obtained from IEC 60617. 4.3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, output terminals).
The terminal functions 1) to 4) shall be indicated in a table as follows:
Terminal number
Terminal symbol
1) Terminal
designation
2) Function
Function of terminal 3) Output identification 4) Type of
output circuits
(1) Terminal designation
A terminal designation to indicate the function of the terminal shall be given. Supply terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals (with abbreviation NU) shall be distinguished.
(2) Function
A brief indication of the terminal function shall be given: – each function of multi-role terminals, i.e. terminals having multiple functions; SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 13 – – each function of integrated circuit selected by mutual pin connections, programming and/or application of function selection data to the function selection pin, such as mode selection pin. (3) Output identification
Output and multiplex output terminals shall be distinguished. (4) Type of output circuits
The type of output circuit, e.g. output impedances, with or without d.c. block, etc., shall be distinguished.
If the baseplate of the package is used as a ground terminal, the type of ground, e.g. analog ground, digital ground, shall be stated in the column of 2) Function. EXAMPLE
4.3.3 Function description The function performed by the circuit shall be specified, including the following information: – basic function; – relation to external terminals; – operation mode (e.g., set-up method, preference, etc.). 4.4 Limiting values (absolute maximum rating system) 4.4.1 Requirements The table for these values shall contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an influence on the values of the ratings, the ratings shall be prescribed for the integrated circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this shall be stated. – All voltages are referenced to a specified reference terminal (Vss, ground, etc.).
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the manufacturer shall indicate whether he refers to the absolute magnitude or to the algebraic value of the quantity.
Bias voltage(s) NC Output(s) NC NU Ground Control voltage(s) Integrated circuit microwave oscillator IEC
1332/13 SIST EN 60747-16-5:2014

– 14 – 60747-16-5  IEC:2013 – The ratings given shall cover the operation of the multi-function integrated circuit over the specified range of operating temperatures. Where such ratings are temperature-dependent, these dependence shall be indicated.
4.4.2 Electrical limiting values
Limiting values shall be specified as follows: Parameters Min. Max. Bias voltage(s) (where appropriate) Bias current(s) (where appropriate) Control voltage(s) (where appropriate) Control current(s) (where appropriate)
+
+
+
+ Terminal voltage(s) (where appropriate) + + Terminal current(s) (where appropriate) Power dissipation
+
+ It is necessary to select either Bias voltage(s) or Bias current(s), either Control voltage(s) or Control current(s), and either Terminal voltage(s) or Terminal current(s).
The detail specification may indicate those values within the table including footnotes a and b.
Parameters a, b Symbols Min. Max. Unit
a Where appropriate, in accordance with the type of circuit considered. b For power supply voltage range: –
limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a special electrical reference point; –
where appropriate, limiting value between specified supply terminals; –
when more than one voltage supply is required, a statement shall be made as to whether the sequence in which these supplies are applied is significant: if so, the sequence shall be stated; –
when more than one supply is needed, it may be necessary to state the combinations of ratings for these supply voltages and currents.
4.4.3 Temperatures a) Operating temperature (ambient or reference-point temperature) b) Storage temperature c) Channel temperature
d) Lead temperature (for soldering) The detail specification may indicate those values within the table including the note.
Parameters (Note) Symbols Min. Max. Unit
NOTE Where appropriate, in accordance with the type of circuit considered.
60747-16-5  IEC:2013 – 15 – 4.5 Operating conditions (within the specified operating temperature range) Operating conditions are not to be inspected, but may be used for quality assessment purpose.
a) Power supplies – Positive and/or negative values b) Initialization sequences (where appropriate) If special initialization sequences are necessary, power supply sequencing and initialization procedure shall be specified. c) Input voltage(s) (where appropriate) d) Output current(s) (where appropriate) e) Voltage and/or current of other terminal(s) f) External elements (where appropriate) g) Operating temperature range 4.6 Electrical characteristics The characteristics shall apply over the full operating temperature range, unless otherwise specified. Each characteristic shall be stated either: a) over the specified range of operating temperatures, or b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
Parameters Min. Typ. Max. Types A B Bias operating current
+ + + + Control operating current
+ +
+ Oscillation frequency, fosc + + + + + Output power, Po,osc + + + + + Phase noise, L (f)
+ + + Tuning sensitivity, Sf,v + +
+ Frequency pushing, fosc,push
+ + + Frequency pulling, fosc,pull
+ + + n-th order harmonic distortion ratio, Pnth/P1
+ + + Oscillation frequency range +
+
+ Output power flatness, ∆Po,osc
+ +
+ Tuning linearity
+ +
+ Oscillation frequency temperature coefficient, αf,temp
+ + + + Output power temperature coefficient, αP,temp
+ + + + Spurious distortion ratio, Ps/P1
+ + + SIST EN 60747-16-5:2014
– 16 – 60747-16-5  IEC:2013 Parameters Min. Typ. Max. Types A B Load mismatch tolerance, ΨL (where appropriate)
+ + + Load mismatch ruggedness, ΨR (where appropriate)
+ + + Modulation bandwidth, Bmod (where appropriate)
+
+ Sensitivity flatness (where appropriate)
+
+
4.7 Mechanical and environmental ratings, characteristics and data Any specific mechanical and environmental ratings applicable shall be stated (see also 5.10 and 5.11 of IEC 60747-1:2006). 4.8 Additional information Where appropriate, the following information shall be given: a) Equivalent output circuit: Detail information shall be given regarding the type of output circuits, e.g. output impedances, d.c. block, open-drain, etc. b) Internal protection: A statement shall be given to indicate whether the integrated circuit contains internal protection against high static voltages or electrical fields. c) Capacitors at terminals: If capac
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