SIST EN IEC 62680-1-2:2023
(Main)Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification (IEC 62680-1-2:2022)
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification (IEC 62680-1-2:2022)
IEC 62680-1-2:2022 specification defines a power delivery system covering all elements of a USB system including: Hosts, Devices, Hubs, Chargers and cable assemblies. This specification describes the architecture, protocols, power supply behavior, connectors and cabling necessary for managing power delivery over USB at up to 100W. This specification is intended to be fully compatible and extend the existing USB infrastructure. It is intended that this specification will allow system OEMs, power supply and peripheral developers adequate flexibility for product versatility and market differentiation without losing backwards compatibility. This sixt edition cancels and replaces the fifth edition published in 2021 and constitutes a technical revision. Extended Power Range (EPR) including Adjustable Voltage Supply (AVS) has been added. This docuemnt is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision 3.1, Version 1.1.
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2: Gemeinsame Komponenten - Festlegung für die USB-Stromversorgung (IEC 62680-1-2:2022)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2: Composants communs - Spécification de l'alimentation électrique par port USB (IEC 62680-1-2:2022)
L'IEC 62680-1-2:2022 spécification de l'alimentation électrique par port USB définit un système d'alimentation électrique qui couvre tous les éléments d'un système USB, y compris: hôtes, dispositifs, hubs, chargeurs et assemblages de câbles. La présente spécification décrit l'architecture, les protocoles, le comportement de l'alimentation électrique, les connecteurs et le câblage nécessaires à la gestion de l'alimentation électrique sur USB jusqu'à 100 W. La présente spécification est destinée à être entièrement compatible avec les infrastructures USB existantes et à en assurer une extension. Il est prévu que cette spécification offre aux OEM de systèmes, ainsi qu'aux développeurs d'alimentations électriques et de périphériques, une souplesse appropriée pour une polyvalence des produits et leur différenciation sur le marché, sans perdre en compatibilité ascendante. Cette sixième édition annule et remplace la cinquième édition parue en 2021 et constitue une révision technique.
Le présent document est la publication de l'USB-IF relative à l'alimentation électrique par port USB, révision 3.1, version 1.1. Plage de puissance étendue (EPR) y compris alimentation à tension réglable (AVS) a été ajoutée.
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2. del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC 62680-1-2:2022)
Specifikacija IEC 62680-1-2:2022 opredeljuje sistem napajanja, ki zajema vse elemente sistema USB, vključno z: gostitelji, napravami, vozlišči, polnilniki in sklopi kablov. Ta specifikacija opisuje arhitekturo, protokole, delovanje napajalnika, konektorje in kable, ki so potrebni za upravljanje napajanja prek USB do 100 W. Njen namen je popolna združljivost z obstoječo infrastrukturo USB ter njena razširitev. Predvideva se, da bo ta specifikacija proizvajalcem originalne opreme, napajalnikov in perifernih naprav omogočila ustrezno prilagodljivost za vsestransko ponudbo izdelkov in razlikovanje na trgu brez izgube združljivosti za nazaj. Ta šesta izdaja razveljavlja in nadomešča peto izdajo, objavljeno leta 2021, in predstavlja tehnično popravljeno izdajo. Dodana je bila tehnologija EPR (Extended Power Range) vključno z AVS (Adjustable Voltage Supply). Dokument je publikacija USB-IF Specifikacija za napajanje univerzalnega serijskega vodila, revizija 3.1, različica 1.1.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 62680-1-2:2023
01-marec-2023
Nadomešča:
SIST EN IEC 62680-1-2:2021
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC
62680-1-2:2022)
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery specification (IEC 62680-1-2:2022)
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2:
Gemeinsame Komponenten - Festlegung für die USB-Stromversorgung (IEC 62680-1-
2:2022)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB (IEC
62680-1-2:2022)
Ta slovenski standard je istoveten z: EN IEC 62680-1-2:2022
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
SIST EN IEC 62680-1-2:2023 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 62680-1-2:2023
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SIST EN IEC 62680-1-2:2023
EUROPEAN STANDARD EN IEC 62680-1-2
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2022
ICS 29.220; 33.120; 35.200 Supersedes EN IEC 62680-1-2:2021
English Version
Universal serial bus interfaces for data and power - Part 1-2:
Common components - USB Power Delivery specification
(IEC 62680-1-2:2022)
Interfaces de bus universel en série pour les données et Schnittstellen des Universellen Seriellen Busses für Daten
l'alimentation électrique - Partie 1-2: Composants communs und Energie - Teil 1-2: Gemeinsame Komponenten -
- Spécification de l'alimentation électrique par port USB Festlegung für die USB-Stromversorgung
(IEC 62680-1-2:2022) (IEC 62680-1-2:2022)
This European Standard was approved by CENELEC on 2022-10-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62680-1-2:2022 E
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SIST EN IEC 62680-1-2:2023
EN IEC 62680-1-2:2022 (E)
European foreword
The text of document 100/3716/CDV, future edition 6 of IEC 62680-1-2, prepared by IEC/TC 100
"Audio, video and multimedia systems and equipment" was submitted to the IEC-CENELEC parallel
vote and approved by CENELEC as EN IEC 62680-1-2:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-07-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-10-10
document have to be withdrawn
This document supersedes EN IEC 62680-1-2:2021 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62680-1-2:2022 was approved by CENELEC as a
European Standard without any modification.
2
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SIST EN IEC 62680-1-2:2023
IEC 62680-1-2
®
Edition 6.0 2022-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification
Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-5288-8
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 62680-1-2:2023
– 2 – IEC 62680-1-2:2022
© USB-IF:2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –
Part 1-2: Common components – USB Power Delivery specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia
home systems and applications for end-user networks, of IEC technical committee 100: Audio,
video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure
and editorial rules used in this publication reflect the practice of the organization which
submitted it.
The text of this International Standard is based on the following documents:
Draft Report on voting
100/3716/CDV 100/3763/RVC
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
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SIST EN IEC 62680-1-2:2023
IEC 62680-1-2:2022 – 3 –
© USB-IF:2021
A list of all parts in the IEC 62680 series, published under the general title Universal serial bus
interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.
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SIST EN IEC 62680-1-2:2023
– 4 – IEC 62680-1-2:2022
© USB-IF:2021
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of
a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision
3.1, Version 1.1.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a
support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT,
OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY
FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OR INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER
INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS
FORUM.”
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SIST EN IEC 62680-1-2:2023
IEC 62680-1-2:2022 – 5 –
© USB-IF:2021
Universal Serial Bus
Power Delivery Specification
Revision: 3.1
Version: 1.1
Release date: July 2021
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SIST EN IEC 62680-1-2:2023
– 6 – IEC 62680-1-2:2022
© USB-IF:2021
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS
EMBODIED IN THE USB POWER DELIVERY SPECIFICATION TO USE AND REPRODUCE THE
SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR,
EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS THAT WOULD COMPLY
WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE THE OF SPECIFICATION FOR
THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION TO TARGET THE SPECIFICATION
OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS COPYRIGHT LICENSE,
NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY PATENT
LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR
LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB
3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE
TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON
BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING
ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR
PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF
INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT
PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
USB Type-C® and USB4™ are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
Thunderbolt™ is a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this
specification that complete proper certification and executing a Thunderbolt™ trademark license – see
http://usb.org/compliance for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2010-2021, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel Corporation,
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
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SIST EN IEC 62680-1-2:2023
IEC 62680-1-2:2022 – 7 –
© USB-IF:2021
Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
Editors
Bob Dunstan
Richard Petrie
Contributors
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SIST EN IEC 62680-1-2:2023
– 8 – IEC 62680-1-2:2022
© USB-IF:2021
Charles Wang ACON, Advanced-Connectek, Inc. Sean O'Neal Bizlink Technology, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc. Tiffany Hsiao Bizlink Technology, Inc.
Dennis Chuang ACON, Advanced-Connectek, Inc. Weichung Ooi Bizlink Technology, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc. Rahul Bhushan Broadcom Corp.
Sunney Yang ACON, Advanced-Connectek, Inc. Asila nahas Cadence Design Systems, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc. Claire Ying Cadence Design Systems, Inc.
Joseph Scanlon Advanced Micro Devices Jie min Cadence Design Systems, Inc.
Sujan Thomas Advanced Micro Devices Mark Summers Cadence Design Systems, Inc.
Caspar Lin Allion Labs, Inc. Michal Staworko Cadence Design Systems, Inc.
Casper Lee Allion Labs, Inc. Sathish Kumar Cadence Design Systems, Inc.
Ganesan
Danny Shih Allion Labs, Inc.
Alessandro Canova Tech
Howard Chang Allion Labs, Inc.
Ingrassia
Greg Stewart Analogix Semiconductor, Inc.
Andrea Colognese Canova Tech
Mehran Badii Analogix Semiconductor, Inc.
Antonio Orzelli Canova Tech
Alexei Kosut Apple
Davide Ghedin Canova Tech
Bill Cornelius Apple
Matteo Casalin Canova Tech
Carlos Colderon Apple
Michael Marioli Canova Tech
Chris Uiterwijk Apple
Nicola Canova Tech
Colin Whitby- Apple
Scantamburlo
Strevens
Paolo Pilla Canova Tech
Corey Axelowitz Apple
Yi-Feng Lin Canyon Semiconductor
Corey Lange Apple
YuHung Lin Canyon Semiconductor
Dave Conroy Apple
David Tsai Chrontel, Inc.
David Sekowski Apple
Anshul Gulati Cypress Semiconductor
Girault Jones Apple
Anup Nayak Cypress Semiconductor
James Orr Apple
Benjamin Kropf Cypress Semiconductor
Jason Chung Apple
Dhanraj Rajput Cypress Semiconductor
Jay Kim Apple
Ganesh
Cypress Semiconductor
Jeff Wilcox Apple
Subramaniam
Jennifer Tsai Apple
Jagadeesan Raj Cypress Semiconductor
Karl Bowers Apple
Junjie cui Cypress Semiconductor
Keith Porthouse Apple
Manu Kumar Cypress Semiconductor
Kevin Hsiue Apple
Muthu M Cypress Semiconductor
Matt Mora Apple
Nicholas Bodnaruk Cypress Semiconductor
Paul Baker Apple
Pradeep Bajpai Cypress Semiconductor
Reese Schreiber Apple
Rajaram R Cypress Semiconductor
Ricardo Janezic Apple
Rama Vakkantula Cypress Semiconductor
Pregitzer
Rushil Kadakia Cypress Semiconductor
Ruchi Chaturvedi Apple
Simon Nguyen Cypress Semiconductor
Sameer Kelkar Apple
Steven Wong Cypress Semiconductor
Sasha Tietz Apple
Subu Sankaran Cypress Semiconductor
Scott Jackson Apple
Sumeet Gupta Cypress Semiconductor
Sree Raman Apple
Tejender Sheoran Cypress Semiconductor
William Ferry Apple
Venkat Cypress Semiconductor
Zaki Moussaoui Apple
Mandagulathar
Jeff Liu ASMedia Technology Inc.
Xiaofeng Shen Cypress Semiconductor
Kuo Lung Li ASMedia Technology Inc.
Zeng Wei Cypress Semiconductor
Ming-Wei Hsu ASMedia Technology Inc.
Adie Tan Dell Inc.
PS Tseng ASMedia Technology Inc.
Adolfo Montero Dell Inc.
Sam Tzeng ASMedia Technology Inc.
Bruce Montag Dell Inc.
Thomas Hsu ASMedia Technology Inc.
Gary Verdun Dell Inc.
Weikao Chang ASMedia Technology Inc.
Ken Nicholas Dell Inc.
Yang Cheng ASMedia Technology Inc.
Marcin Nowak Dell Inc.
Shawn Meng Bizlink Technology Inc.
Merle Wood Dell Inc.
Bernard Shyu Bizlink Technology, Inc.
Mohammed Hijazi Dell Inc.
Eric Wu Bizlink Technology, Inc.
Siddhartha Reddy Dell Inc.
Morphy Hsieh Bizlink Technology, Inc.
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SIST EN IEC 62680-1-2:2023
IEC 62680-1-2:2022 – 9 –
© USB-IF:2021
Terry Matula Dell Inc. Fred Fons Foxconn / Hon Hai
Jay Hu Derun Semiconductor Jie Zheng Foxconn / Hon Hai
Shelly Liu Derun Semiconductor Patrick Casher Foxconn / Hon Hai
Bindhu Vasu Dialog Semiconductor (UK) Ltd Steve Sedio Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd Terry Little Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd Bob McVay Fresco Logic Inc.
Duc Doan Dialog Semiconductor (UK) Ltd Christopher Meyers Fresco Logic Inc.
Holger Petersen Dialog Semiconductor (UK) Ltd Dian Kurniawan Fresco Logic Inc.
Jianming Yao Dialog Semiconductor (UK) Ltd Tom Burton Fresco Logic Inc.
John Shi Dialog Semiconductor (UK) Ltd Abraham Levkoy Google Inc.
KE Hong Dialog Semiconductor (UK) Ltd Adam Rodriguez Google Inc.
Kevin Mori Dialog Semiconductor (UK) Ltd Alec Berg Google Inc.
Larry Ping Dialog Semiconductor (UK) Ltd Benson Leung Google Inc.
Mengfei Liu Dialog Semiconductor (UK) Ltd Chao Fei Google Inc.
Scott Brown Dialog Semiconductor (UK) Ltd Dave Bernard Google Inc.
Yimin Chen Dialog Semiconductor (UK) Ltd David Schneider Google Inc.
Yong Li Dialog Semiconductor (UK) Ltd Diana Zigterman Google Inc.
Justin Lee Diodes Incorporated Eric Herrmann Google Inc.
Dan Ellis DisplayLink (UK) Ltd. Jim Guerin Google Inc.
Jason Young DisplayLink (UK) Ltd. Juan Fantin Google Inc.
Kevin Jacobs DisplayLink (UK) Ltd. Ken Wu Google Inc.
Paulo Alcobia DisplayLink (UK) Ltd. Kyle Tso Google Inc.
Peter Burgers DisplayLink (UK) Ltd. Mark Hayter Google Inc.
Richard Petrie DisplayLink (UK) Ltd. Nathan Kolluru Google Inc.
Chien-Cheng Kuo eEver Technology, Inc. Nithya Jagannathan Google Inc.
Shyanjia Chen eEver Technology, Inc. Srikanth Google Inc.
Lakshmikanthan
Abel Astley Ellisys
Todd Broch Google Inc.
Chuck Trefts Ellisys
Toshak Singhal Google Inc.
Emmanuel Durin Ellisys
Vincent Palatin Google Inc.
Mario Pasquali Ellisys
Xuelin Wu Google Inc.
Tim Wei Ellisys
Zhenxue Xu Google Inc.
Chien-Cheng Kuo Etron Technology, Inc.
Alan Kinningham Granite River Labs
Jack Yang Etron Technology, Inc.
Balamurugan Granite River Labs
Richard Crisp Etron Technology, Inc.
Manialagan
Shyanjia Chen Etron Technology, Inc.
Mike Engbretson Granite River Labs
TsungTa Lu Etron Technology, Inc.
Mike Wu Granite River Labs
Christian Klein Fairchild Semiconductor
Mukesh Tatiya Granite River Labs
Oscar Freitas Fairchild Semiconductor
Rajaraman V Granite River Labs
Souhib Harb Fairchild Semiconductor
Sivaram Murugesan Granite River Labs
Amanda Ying Feature Integration Technology
Tim Lin Granite River Labs
Inc.
Vishal Kakade Granite River Labs
Jacky Chan Feature Integration Technology
Inc. Alan Berkema Hewlett Packard
Kenny Hsieh Feature Integration Technology Lee Atkinson Hewlett Packard
Inc.
Rahul Lakdawala Hewlett Packard
KungAn Lin Feature Integration Technology
Robin Castell Hewlett Packard
Inc.
Ron Schooley Hewlett Packard
Paul Yang Feature Integration Technology
Suketa Partiwala Hewlett Packard
Inc.
Steve Chen Hewlett Packard
Su Jaden Feature Integration Technology
Vaibhav Malik Hewlett Packard
Inc.
Walter Fry Hewlett Packard
Yu-Lin Chu Feature Integration Technology
Hideyuki HAYAFUJI Hosiden Corporation
Inc.
Keiji Mine Hosiden Corporation
Yulin Lan Feature Integration Technology
Masaki Yamaoka Hosiden Corporation
Inc.
Takashi Muto Hosiden Corporation
AJ Yang Foxconn / Hon Hai
Bob Hall Foxconn / Hon Hai Yasunori Nishikawa Hosiden Corporation
Alan Berkema HP Inc.
Chihyin Kan Foxconn / Hon Hai
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– 10 – IEC 62680-1-2:2022
© USB-IF:2021
Kenneth Chan HP Inc. Venkataramani Intel Corporation
Gopalakrishnan
Lee Atkinson HP Inc.
Ziv Kabiry Intel Corporation
Lee Leppo HP Inc.
Jia Wei Intersil Corporation
Rahul Lakdawala HP Inc.
Al Hsiao ITE Tech. Inc.
Robin Castell HP Inc.
Greg Song ITE Tech. Inc.
Roger Benson HP Inc.
Richard Guo ITE Tech. Inc.
Steve Chen HP Inc.
Victor Lin ITE Tech. Inc.
Bai Sean Huawei Technologies Co., Ltd.
Y.C. Chou ITE Tech. Inc.
Chunjiang Zhao Huawei Technologies Co., Ltd.
Kenta Minejima Japan Aviation Electronics
JianQuan Wu Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Li Zongjian Huawei Technologies Co., Ltd.
Mark Saubert Japan Aviation Electronics
Liansheng Zheng Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Lihua Duan Huawei Technologies Co., Ltd.
Toshio Shimoyama Japan Aviation Electronics
Min Chen Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Wang Feng Huawei Technologies Co., Ltd.
Brian Fetz Keysight Technologies Inc.
Wei Haihong Huawei Technologies Co., Ltd.
Jit Lim Keysight Technologies Inc.
James Xie Hynetek Semiconductor Co., Ltd
Babu Mailachalam Lattice Semiconductor Corp
Yingyang Ou Hynetek Semiconductor Co., Ltd
Gianluca Mariani Lattice Semiconductor Corp
Robert Heaton Indie Semiconductor
Joel Coplen Lattice Semiconductor Corp
Vincent Wang Indie Semiconductor
Thomas Watza Lattice Semiconductor Corp
Benjamin Kropf Infineon Technologies
Vesa Lauri Lattice Semiconductor Corp
Sie Boo Chiang Infineon Technologies
Do Kyun Kim LG electronics
Tue Fatt David Wee Infineon Technologies
Bruce Chuang Leadtrend
Wee Tar Richard Ng Infineon Technologies
Eilian Liu Leadtrend
Wolfgang Furtner Infineon Technologies
Daniel H Jacobs LeCroy Corporation
Bob Dunstan Intel Corporation
Jake Jacobs LeCroy Corporation
Brad Saunders Intel Corporation
Kimberley McKay LeCroy Corporation
Chee Lim Nge Intel Corporation
Mike Engbretson LeCroy Corporation
Christine Krause Intel Corporation
Mike Micheletti LeCroy Corporation
Chuen Ming Tan Intel Corporation
Roy Chestnut LeCroy Corporation
Dan Froelich Intel Corporation
Tyler Joe LeCroy Corporation
David Harriman Intel Corporation
Phil Jakes Lenovo
David Hines Intel Corporation
Aaron Melgar Lion Semiconductor
David Thompson Intel Corporation
Chris Zhou Lion Semiconductor
Guobin Liu Intel Corporation
Sehyung Jeon Lion Semiconductor
Harry Skinner Intel Corporation
Wonyoung Kim Lion Semiconductor
Henrik Leegaard Intel Corporation
Yongho Kim Lion Semiconductor
Jenn Chuan Cheng Intel Corporation
Dave Thompson LSI Corporation
Jervis Lin Intel Corporation
Alan Kinningham Luxshare-ICT
John Howard Intel Corporation
Alan Liu Luxshare-ICT
Karthi Vadivelu Intel Corporation
Daniel Chen Luxshare-ICT
Leo Heiland Intel Corporation
Eric Wen Luxshare-ICT
Maarit Harkonen Intel Corporation
James Stevens Luxshare-ICT
Nge Chee Lim Intel Corporation
Josue Castillo Luxshare-ICT
Paul Durley Intel Corporation
Pat Young Luxshare-ICT
Rahman Ismail Intel Corporation
Scott Shuey Luxshare-ICT
Rajaram Regupathy Intel Corporation
Chikara Kakizawa Maxim Integrated Products
Ronald Swartz Intel Corporation
Jacob Scott Maxim Integrated Products
Sarah Sharp Intel Corporation
Ken Helfrich Maxim Integrated Products
Scott Brenden Intel Corporation
Michael Miskho Maxim Integrated Products
Sridharan Intel Corporation
Chris Yokum MCCI Corporation
Ranganathan
Geert Knapen MCCI Corporation
Steve McGowan Intel Corporation
Terry Moore MCCI Corporation
Tim McKee Intel Corporation
Velmurugan MCCI Corporation
Toby Opferman Intel Corporation
Selvaraj
Uma Medepalli Intel Corporation
Satoru Kumashiro MegaChips Corporation
---------------------- Page: 14 ----------------------
SIST EN IEC 62680-1-2:2023
IEC 62680-1-2:2022 – 11 –
© USB-IF:2021
Brian Marley Microchip Technology Inc. Bart Vertenten NXP Semiconductors
Dave Perchlik Microchip Technology Inc. Dennis Ha NXP Semiconductors
Don Perkins Microchip Technology Inc. Dong Nguyen NXP Semiconductors
Fernando Gonzalez Microchip Technology Inc. Guru Prasad NXP Semiconductors
John Sisto Microchip Technology Inc. Ken Jaramillo NXP Semiconductors
Josh Averyt Microchip Technology Inc. Krishnan TN NXP Semiconductors
Kiet Tran Microchip Technology Inc. Michael Joehren NXP Semiconductors
Mark Bohm Microchip Technology Inc. Robert de Nie NXP Semiconductors
Matthew Kalibat Microchip Technology Inc. Rod Whitby NXP Semiconductors
Mick Davis Microchip Technology Inc. Vijendra Kuroodi NXP Semiconductors
Prasanna Microchip Technology Inc. Winston Langeslag NXP Semiconductors
Vengateshan
Robert Heaton Obsidian Technology
Rich Wahler Microchip Technology Inc.
Andrew Yoo ON Semiconductor
Richard Petrie Microchip Technology Inc.
Brady Maasen ON Semiconductor
Ronald Kunin Microchip Technology Inc.
Bryan McCoy ON Semiconductor
Shannon Cash Microchip Technology Inc.
Christian Klein ON Semiconductor
Thomas Farkas Microchip Technology Inc.
Cor Voorwinden ON Semiconductor
Venkataraman
Microchip Technology Inc.
Edward Berrios ON Semiconductor
Krishnamoorthy
Michael Smith ON Semiconductor
Andrew Yang Microsoft Corporation
Oscar Freitas ON Semiconductor
Anthony Chen Microsoft Corporation
Tom Duffy ON Semiconductor
Arvind Murching Microsoft Corporation
Brian Collins Parade Technologies Inc.
Dave Perchlik Microsoft Corporation
Craig Wiley Parade Technologies Inc.
David Voth Microsoft Corporation
Aditya Kulkarni Power Integrations
Geoff Shew Microsoft Corporation
Akshay Nayaknur Power Integrations
Jayson Kastens Microsoft Corporation
Amruta Patra Power Integrations
Kai Inha Microsoft Corporation
Rahul Joshi Power Integrations
Marwan Kadado Microsoft Corporation
Ricardo Pregiteer Power Integrations
Michelle Bergeron Microsoft Corporation
Shruti Anand Power Integrations
Nathan Sherman Microsoft Corporation
Amit gupta Qualcomm, Inc
Rahul Ramadas Microsoft Corporation
George Paparrizos Qualcomm, Inc
Randy Aull Microsoft Corporation
Giovanni Garcea Qualcomm, Inc
Shiu Ng Microsoft Corporation
Jack Pham Qualcomm, Inc
Tieyong Yin Microsoft Corporation
James Goel Qualcomm, Inc
Timo Toivola Microsoft Corporation
Joshua Warner Qualcomm, Inc
Toby Nixon Microsoft Corporation
Karyn Vuong Qualcomm, Inc
Vahid Vassey Microsoft Corporation
Lalan Mishra Qualcomm, Inc
Vivek Gupta Microsoft Corporation
Vamsi Samavedam Qualcomm, Inc
Yang You Microsoft Corporation
Vatsal Patel Qualcomm, Inc
Adib Al Abaji Molex LLC
Chris Sporck Qualcomm, Inc.
Aaron Xu Monolithic Power Systems Inc.
Craig Aiken Qualcomm, Inc.
Bo Zhou Monolithic
...
SLOVENSKI STANDARD
oSIST prEN IEC 62680-1-2:2022
01-marec-2022
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery specification
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2:
Gemeinsame Komponenten - Festlegung für die USB-Stromversorgung
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB
Ta slovenski standard je istoveten z: prEN IEC 62680-1-2:2022
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
oSIST prEN IEC 62680-1-2:2022 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
oSIST prEN IEC 62680-1-2:2022
---------------------- Page: 2 ----------------------
oSIST prEN IEC 62680-1-2:2022
100/3716/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62680-1-2 ED6
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-01-28 2022-04-22
SUPERSEDES DOCUMENTS:
100/3708/RR
IEC TA 18 : MULTIMEDIA HOME SYSTEMS AND APPLICATIONS FOR END-USER NETWORKS
SECRETARIAT: SECRETARY:
Japan Mr Keisuke Koide
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
TITLE:
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery
specification
PROPOSED STABILITY DATE: 2026
NOTE FROM TC/SC OFFICERS:
Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
---------------------- Page: 3 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -2-
-2-
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER
Part 1-2: Common components – USB Power Delivery specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all
questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC
publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and
Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National
Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the
International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus
of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in
that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC
cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to
the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the
corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment
services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by
independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its
technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature
whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,
or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable
for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC
shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia home systems
and applications for end-user networks, of IEC technical committee 100: Audio, video and multimedia
systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure and
editorial rules used in this publication reflect the practice of the organization which submitted it.
The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
---------------------- Page: 4 ----------------------
oSIST prEN IEC 62680-1-2:2022
-3- IEC CDV 62680-1-2 Ed6© IEC 2021
Full information on the voting for the approval of this International Standard can be found in the report on
voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this document will remain unchanged until the stability date
indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific document. At
this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
The National Committees are requested to note that for this document the stability date is .
THIS TEXT IS INCLUDED FOR THE INFORMATION OF THE NATIONAL COMMITTEES AND WILL BE DELETED AT THE
PUBLICATION STAGE.
---------------------- Page: 5 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -4-
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of a special
agreement between the IEC and the USB-IF.
This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision 3.1, Version
1.1.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of companies that
developed the Universal Serial Bus specification. The USB-IF was formed to provide a support organization and
forum for the advancement and adoption of Universal Serial Bus technology. The Forum facilitates the
development of high-quality compatible USB peripherals (devices), and promotes the benefits of USB and the
quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY
PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE AUTHORS OF ANY USB
SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY
PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OR INFORMATION IN THIS
SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a reciprocal,
RAND-Z licensing arrangement for compliant products. For more information, please see:
https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER INTO ANY
USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS FORUM.”
Page 4 USB Power Delivery Specification Revision 3.1, Version 1.1
---------------------- Page: 6 ----------------------
oSIST prEN IEC 62680-1-2:2022
-5- IEC CDV 62680-1-2 Ed6© IEC 2021
Universal Serial Bus
Power Delivery Specification
Revision: 3.1
Version: 1.1
Release date: July 2021
---------------------- Page: 7 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -6-
1 LIMITED COPYRIGHT LICENSE
2 THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS EMBODIED IN
3 THE USB POWER DELIVERY SPECIFICATION TO USE AND REPRODUCE THE SPECIFICATION FOR THE SOLE
4 PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR, EVALUATING WHETHER TO IMPLEMENT THE
5 SPECIFICATION IN PRODUCTS THAT WOULD COMPLY WITH THE SPECIFICATION. WITHOUT LIMITING THE
6 FOREGOING, USE THE OF SPECIFICATION FOR THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION
7 TO TARGET THE SPECIFICATION OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS
8 COPYRIGHT LICENSE, NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY
9 PATENT LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR LICENSING
10 COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB 3.0 ADOPTERS
11 AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE TERMS ON YOUR OWN BEHALF
12 AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON BEHALF OF YOUR EMPLOYER.
13 INTELLECTUAL PROPERTY DISCLAIMER
14 THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY
15 WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE
16 AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY
17 PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE
18 PROVISION OF THIS SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED,
19 BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
20 Please send comments via electronic mail to techsup@usb.org
21 For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
22 USB Type-C® and USB4™ are trademarks of the Universal Serial Bus Implementers Forum (USB-IF). Thunderbolt™ is
23 a trademark of Intel Corporation.
24 You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this specification that
25 complete proper certification and executing a Thunderbolt™ trademark license – see http://usb.org/compliance for
26 further information.
27 All product names are trademarks, registered trademarks, or service marks of their respective owners.
28 Copyright © 2010-2021, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel Corporation, Microsoft
29 Corporation, Renesas, STMicroelectronics, and Texas Instruments.
30 All rights reserved.
Page 6 USB Power Delivery Specification Revision 3.1, Version 1.1
---------------------- Page: 8 ----------------------
oSIST prEN IEC 62680-1-2:2022
-7- IEC CDV 62680-1-2 Ed6© IEC 2021
31 Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
32 Editors
Bob Dunstan
Richard Petrie
33 Contributors
Charles Wang ACON, Advanced-Connectek, Inc. Reese Schreiber Apple
Conrad Choy ACON, Advanced-Connectek, Inc. Ricardo Janezic Apple
Pregitzer
Dennis Chuang ACON, Advanced-Connectek, Inc.
Ruchi Chaturvedi Apple
Steve Sedio ACON, Advanced-Connectek, Inc.
Sameer Kelkar Apple
Sunney Yang ACON, Advanced-Connectek, Inc.
Sasha Tietz Apple
Vicky Chuang ACON, Advanced-Connectek, Inc.
Scott Jackson Apple
Joseph Scanlon Advanced Micro Devices
Sree Raman Apple
Sujan Thomas Advanced Micro Devices
William Ferry Apple
Caspar Lin Allion Labs, Inc.
Zaki Moussaoui Apple
Casper Lee Allion Labs, Inc.
Jeff Liu ASMedia Technology Inc.
Danny Shih Allion Labs, Inc.
Kuo Lung Li ASMedia Technology Inc.
Howard Chang Allion Labs, Inc.
Ming-Wei Hsu ASMedia Technology Inc.
Greg Stewart Analogix Semiconductor, Inc.
PS Tseng ASMedia Technology Inc.
Mehran Badii Analogix Semiconductor, Inc.
Sam Tzeng ASMedia Technology Inc.
Alexei Kosut Apple
Thomas Hsu ASMedia Technology Inc.
Bill Cornelius Apple
Weikao Chang ASMedia Technology Inc.
Carlos Colderon Apple
Yang Cheng ASMedia Technology Inc.
Chris Uiterwijk Apple
Shawn Meng Bizlink Technology Inc.
Colin Whitby- Apple
Strevens Bernard Shyu Bizlink Technology, Inc.
Corey Axelowitz Apple Eric Wu Bizlink Technology, Inc.
Corey Lange Apple Morphy Hsieh Bizlink Technology, Inc.
Dave Conroy Apple Sean O'Neal Bizlink Technology, Inc.
David Sekowski Apple Tiffany Hsiao Bizlink Technology, Inc.
Girault Jones Apple Weichung Ooi Bizlink Technology, Inc.
James Orr Apple Rahul Bhushan Broadcom Corp.
Jason Chung Apple Asila nahas Cadence Design Systems, Inc.
Jay Kim Apple Claire Ying Cadence Design Systems, Inc.
Jeff Wilcox Apple Jie min Cadence Design Systems, Inc.
Jennifer Tsai Apple Mark Summers Cadence Design Systems, Inc.
Karl Bowers Apple Michal Staworko Cadence Design Systems, Inc.
Sathish Kumar
Keith Porthouse Apple Cadence Design Systems, Inc.
Ganesan
Kevin Hsiue Apple
Alessandro Canova Tech
Matt Mora Apple
Ingrassia
Paul Baker Apple
Andrea Colognese Canova Tech
---------------------- Page: 9 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -8-
Antonio Orzelli Canova Tech Jianming Yao Dialog Semiconductor (UK) Ltd
Davide Ghedin Canova Tech John Shi Dialog Semiconductor (UK) Ltd
Matteo Casalin Canova Tech KE Hong Dialog Semiconductor (UK) Ltd
Michael Marioli Canova Tech Kevin Mori Dialog Semiconductor (UK) Ltd
Nicola Canova Tech Larry Ping Dialog Semiconductor (UK) Ltd
Scantamburlo
Mengfei Liu Dialog Semiconductor (UK) Ltd
Paolo Pilla Canova Tech
Scott Brown Dialog Semiconductor (UK) Ltd
Yi-Feng Lin Canyon Semiconductor
Yimin Chen Dialog Semiconductor (UK) Ltd
YuHung Lin Canyon Semiconductor
Yong Li Dialog Semiconductor (UK) Ltd
David Tsai Chrontel, Inc.
Justin Lee Diodes Incorporated
Anshul Gulati Cypress Semiconductor
Dan Ellis DisplayLink (UK) Ltd.
Anup Nayak Cypress Semiconductor
Jason Young DisplayLink (UK) Ltd.
Benjamin Kropf Cypress Semiconductor
Kevin Jacobs DisplayLink (UK) Ltd.
Dhanraj Rajput Cypress Semiconductor
Paulo Alcobia DisplayLink (UK) Ltd.
Ganesh Cypress Semiconductor
Peter Burgers DisplayLink (UK) Ltd.
Subramaniam
Richard Petrie DisplayLink (UK) Ltd.
Jagadeesan Raj Cypress Semiconductor
Chien-Cheng Kuo eEver Technology, Inc.
Junjie cui Cypress Semiconductor
Shyanjia Chen eEver Technology, Inc.
Manu Kumar Cypress Semiconductor
Abel Astley Ellisys
Muthu M Cypress Semiconductor
Chuck Trefts Ellisys
Nicholas Bodnaruk Cypress Semiconductor
Emmanuel Durin Ellisys
Pradeep Bajpai Cypress Semiconductor
Mario Pasquali Ellisys
Rajaram R Cypress Semiconductor
Tim Wei Ellisys
Rama Vakkantula Cypress Semiconductor
Chien-Cheng Kuo Etron Technology, Inc.
Rushil Kadakia Cypress Semiconductor
Jack Yang Etron Technology, Inc.
Simon Nguyen Cypress Semiconductor
Richard Crisp Etron Technology, Inc.
Steven Wong Cypress Semiconductor
Shyanjia Chen Etron Technology, Inc.
Subu Sankaran Cypress Semiconductor
TsungTa Lu Etron Technology, Inc.
Sumeet Gupta Cypress Semiconductor
Christian Klein Fairchild Semiconductor
Tejender Sheoran Cypress Semiconductor
Oscar Freitas Fairchild Semiconductor
Venkat
Cypress Semiconductor
Souhib Harb Fairchild Semiconductor
Mandagulathar
Amanda Ying Feature Integration Technology
Xiaofeng Shen Cypress Semiconductor
Inc.
Zeng Wei Cypress Semiconductor
Jacky Chan Feature Integration Technology
Adie Tan Dell Inc.
Inc.
Adolfo Montero Dell Inc.
Kenny Hsieh Feature Integration Technology
Bruce Montag Dell Inc. Inc.
Gary Verdun Dell Inc. KungAn Lin Feature Integration Technology
Inc.
Ken Nicholas Dell Inc.
Feature Integration Technology
Paul Yang
Marcin Nowak Dell Inc.
Inc.
Merle Wood Dell Inc.
Su Jaden Feature Integration Technology
Mohammed Hijazi Dell Inc.
Inc.
Siddhartha Reddy Dell Inc.
Yu-Lin Chu Feature Integration Technology
Terry Matula Dell Inc.
Inc.
Jay Hu Derun Semiconductor
Yulin Lan Feature Integration Technology
Shelly Liu Derun Semiconductor
Inc.
Bindhu Vasu Dialog Semiconductor (UK) Ltd
AJ Yang Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd
Bob Hall Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd
Chihyin Kan Foxconn / Hon Hai
Duc Doan Dialog Semiconductor (UK) Ltd
Fred Fons Foxconn / Hon Hai
Holger Petersen Dialog Semiconductor (UK) Ltd
Jie Zheng Foxconn / Hon Hai
Page 8 USB Power Delivery Specification Revision 3.1, Version 1.1
---------------------- Page: 10 ----------------------
oSIST prEN IEC 62680-1-2:2022
-9- IEC CDV 62680-1-2 Ed6© IEC 2021
Patrick Casher Foxconn / Hon Hai Masaki Yamaoka Hosiden Corporation
Steve Sedio Foxconn / Hon Hai Takashi Muto Hosiden Corporation
Terry Little Foxconn / Hon Hai Yasunori Nishikawa Hosiden Corporation
Bob McVay Fresco Logic Inc. Alan Berkema HP Inc.
Christopher Meyers Fresco Logic Inc. Kenneth Chan HP Inc.
Dian Kurniawan Fresco Logic Inc. Lee Atkinson HP Inc.
Tom Burton Fresco Logic Inc. Lee Leppo HP Inc.
Abraham Levkoy Google Inc. Rahul Lakdawala HP Inc.
Adam Rodriguez Google Inc. Robin Castell HP Inc.
Alec Berg Google Inc. Roger Benson HP Inc.
Benson Leung Google Inc. Steve Chen HP Inc.
Chao Fei Google Inc. Bai Sean Huawei Technologies Co., Ltd.
Dave Bernard Google Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
David Schneider Google Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Diana Zigterman Google Inc. Li Zongjian Huawei Technologies Co., Ltd.
Eric Herrmann Google Inc. Liansheng Zheng Huawei Technologies Co., Ltd.
Jim Guerin Google Inc. Lihua Duan Huawei Technologies Co., Ltd.
Juan Fantin Google Inc. Min Chen Huawei Technologies Co., Ltd.
Ken Wu Google Inc. Wang Feng Huawei Technologies Co., Ltd.
Kyle Tso Google Inc. Wei Haihong Huawei Technologies Co., Ltd.
Mark Hayter Google Inc. James Xie Hynetek Semiconductor Co., Ltd
Nathan Kolluru Google Inc. Yingyang Ou Hynetek Semiconductor Co., Ltd
Nithya Jagannathan Google Inc. Robert Heaton Indie Semiconductor
Srikanth Google Inc. Vincent Wang Indie Semiconductor
Lakshmikanthan
Benjamin Kropf Infineon Technologies
Todd Broch Google Inc.
Sie Boo Chiang Infineon Technologies
Toshak Singhal Google Inc.
Tue Fatt David Wee Infineon Technologies
Vincent Palatin Google Inc.
Wee Tar Richard Ng Infineon Technologies
Xuelin Wu Google Inc.
Wolfgang Furtner Infineon Technologies
Zhenxue Xu Google Inc.
Bob Dunstan Intel Corporation
Alan Kinningham Granite River Labs
Brad Saunders Intel Corporation
Balamurugan Granite River Labs
Chee Lim Nge Intel Corporation
Manialagan
Christine Krause Intel Corporation
Mike Engbretson Granite River Labs
Chuen Ming Tan Intel Corporation
Mike Wu Granite River Labs
Dan Froelich Intel Corporation
Mukesh Tatiya Granite River Labs
David Harriman Intel Corporation
Rajaraman V Granite River Labs
David Hines Intel Corporation
Sivaram Murugesan Granite River Labs
David Thompson Intel Corporation
Tim Lin Granite River Labs
Guobin Liu Intel Corporation
Vishal Kakade Granite River Labs
Harry Skinner Intel Corporation
Alan Berkema Hewlett Packard
Henrik Leegaard Intel Corporation
Lee Atkinson Hewlett Packard
Jenn Chuan Cheng Intel Corporation
Rahul Lakdawala Hewlett Packard
Jervis Lin Intel Corporation
Robin Castell Hewlett Packard
John Howard Intel Corporation
Ron Schooley Hewlett Packard
Karthi Vadivelu Intel Corporation
Suketa Partiwala Hewlett Packard
Leo Heiland Intel Corporation
Steve Chen Hewlett Packard
Maarit Harkonen Intel Corporation
Vaibhav Malik Hewlett Packard
Nge Chee Lim Intel Corporation
Walter Fry Hewlett Packard
Paul Durley Intel Corporation
Hideyuki HAYAFUJI Hosiden Corporation
Rahman Ismail Intel Corporation
Keiji Mine Hosiden Corporation
Rajaram Regupathy Intel Corporation
---------------------- Page: 11 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -10-
Ronald Swartz Intel Corporation Eric Wen Luxshare-ICT
Sarah Sharp Intel Corporation James Stevens Luxshare-ICT
Scott Brenden Intel Corporation Josue Castillo Luxshare-ICT
Sridharan Intel Corporation Pat Young Luxshare-ICT
Ranganathan
Scott Shuey Luxshare-ICT
Steve McGowan Intel Corporation
Chikara Kakizawa Maxim Integrated Products
Tim McKee Intel Corporation
Jacob Scott Maxim Integrated Products
Toby Opferman Intel Corporation
Ken Helfrich Maxim Integrated Products
Uma Medepalli Intel Corporation
Michael Miskho Maxim Integrated Products
Venkataramani Intel Corporation
Chris Yokum MCCI Corporation
Gopalakrishnan
Geert Knapen MCCI Corporation
Ziv Kabiry Intel Corporation
Terry Moore MCCI Corporation
Jia Wei Intersil Corporation
Velmurugan MCCI Corporation
Al Hsiao ITE Tech. Inc.
Selvaraj
Greg Song ITE Tech. Inc.
Satoru Kumashiro MegaChips Corporation
Richard Guo ITE Tech. Inc.
Brian Marley Microchip Technology Inc.
Victor Lin ITE Tech. Inc.
Dave Perchlik Microchip Technology Inc.
Y.C. Chou ITE Tech. Inc.
Don Perkins Microchip Technology Inc.
Kenta Minejima Japan Aviation Electronics
Fernando Gonzalez Microchip Technology Inc.
Industry Ltd. (JAE)
John Sisto Microchip Technology Inc.
Mark Saubert Japan Aviation Electronics
Josh Averyt Microchip Technology Inc.
Industry Ltd. (JAE)
Kiet Tran Microchip Technology Inc.
Toshio Shimoyama Japan Aviation Electronics
Mark Bohm Microchip Technology Inc.
Industry Ltd. (JAE)
Matthew Kalibat Microchip Technology Inc.
Brian Fetz Keysight Technologies Inc.
Mick Davis Microchip Technology Inc.
Jit Lim Keysight Technologies Inc.
Prasanna Microchip Technology Inc.
Babu Mailachalam Lattice Semiconductor Corp
Vengateshan
Gianluca Mariani Lattice Semiconductor Corp
Rich Wahler Microchip Technology Inc.
Joel Coplen Lattice Semiconductor Corp
Richard Petrie Microchip Technology Inc.
Thomas Watza Lattice Semiconductor Corp
Ronald Kunin Microchip Technology Inc.
Vesa Lauri Lattice Semiconductor Corp
Shannon Cash Microchip Technology Inc.
Do Kyun Kim LG electronics
Thomas Farkas Microchip Technology Inc.
Bruce Chuang Leadtrend
Venkataraman Microchip Technology Inc.
Eilian Liu Leadtrend
Krishnamoorthy
Daniel H Jacobs LeCroy Corporation
Andrew Yang Microsoft Corporation
Jake Jacobs LeCroy Corporation
Anthony Chen Microsoft Corporation
Kimberley McKay LeCroy Corporation
Arvind Murching Microsoft Corporation
Mike Engbretson LeCroy Corporation
Dave Perchlik Microsoft Corporation
Mike Micheletti LeCroy Corporation
David Voth Microsoft Corporation
Roy Chestnut LeCroy Corporation
Geoff Shew Microsoft Corporation
Tyler Joe LeCroy Corporation
Jayson Kastens Microsoft Corporation
Phil Jakes Lenovo
Kai Inha Microsoft Corporation
Aaron Melgar Lion Semiconductor
Marwan Kadado Microsoft Corporation
Chris Zhou Lion Semiconductor
Michelle Bergeron Microsoft Corporation
Sehyung Jeon Lion Semiconductor
Nathan Sherman Microsoft Corporation
Wonyoung Kim Lion Semiconductor
Rahul Ramadas Microsoft Corporation
Yongho Kim Lion Semiconductor
Randy Aull Microsoft Corporation
Dave Thompson LSI Corporation
Shiu Ng Microsoft Corporation
Alan Kinningham Luxshare-ICT
Tieyong Yin Microsoft Corporation
Alan Liu Luxshare-ICT
Timo Toivola Microsoft Corporation
Daniel Chen Luxshare-ICT
Toby Nixon Microsoft Corporation
Page 10 USB Power Delivery Specification Revision 3.1, Version 1.1
---------------------- Page: 12 ----------------------
oSIST prEN IEC 62680-1-2:2022
-11- IEC CDV 62680-1-2 Ed6© IEC 2021
Vahid Vassey Microsoft Corporation George Paparrizos Qualcomm, Inc
Vivek Gupta Microsoft Corporation Giovanni Garcea Qualcomm, Inc
Yang You Microsoft Corporation Jack Pham Qualcomm, Inc
Adib Al Abaji Molex LLC James Goel Qualcomm, Inc
Aaron Xu Monolithic Power Systems Inc. Joshua Warner Qualcomm, Inc
Bo Zhou Monolithic Power Systems Inc. Karyn Vuong Qualcomm, Inc
Christian Sporck Monolithic Power Systems Inc. Lalan Mishra Qualcomm, Inc
Di Han Monolithic Power Systems Inc. Vamsi Samavedam Qualcomm, Inc
Zhihong Yu Monolithic Power Systems Inc. Vatsal Patel Qualcomm, Inc
Dan Wagner Motorola Mobility Inc. Chris Sporck Qualcomm, Inc.
Ben Crowe MQP Electronics Ltd. Craig Aiken Qualcomm, Inc.
Pat Crowe MQP Electronics Ltd. Narendra Mehta Qualcomm, Inc.
Sten Carlsen MQP Electronics Ltd. Terry Remple Qualcomm, Inc.
Kenji Oguma NEC Corporation Will Kun Qualcomm, Inc.
Frank Borngräber Nokia Corporation Yoram Rimoni Qualcomm, Inc.
Kai Inha Nokia Corporation Fan-Hau Hsu Realtek Semiconductor Corp.
Pekka Leinonen Nokia Corporation Tsung-Peng Chuang Realtek Semiconductor Corp.
Richard Petrie Nokia Corporation Atsushi Mitamura Renesas Electronics Corp.
Sten Carlsen Nokia Corporation Bob Dunstan Renesas Electronics Corp.
Abhijeet Kulkarni NXP Semiconductors Brian Allen Renesas Electronics Corp.
Ahmad Yazdi NXP Semiconductors Dan Aoki Renesas Electronics Corp.
Bart Vertenten NXP Semiconductors Hajime Nozaki Renesas Electronics Corp.
Dennis Ha NXP Semiconductors John Carpenter Renesas Electronics Corp.
Dong Nguyen NXP Semiconductors Kiichi Muto Renesas Electronics Corp.
Guru Prasad NXP Semiconductors Masami Katagiri Renesas Electronics Corp.
Ken Jaramillo NXP Semiconductors Nobuo Furuya Renesas Electronics Corp.
Krishnan TN NXP Semiconductors Patrick Yu Renesas Electronics Corp.
Michael Joehren NXP Semiconductors Peter Teng Renesas Electronics Corp.
Robert de Nie NXP Semiconductors Philip Leung Renesas Electronics Corp.
Rod Whitby NXP Semiconductors Steve Roux Renesas Electronics Corp.
Vijendra Kuroodi NXP Semiconductors Tetsu Sato Renesas Electronics Corp.
Winston Langeslag NXP Semiconductors Toshifumi Yamaoka Renesas Electronics Corp.
Robert Heaton Obsidian Technology Chunan Kuo Richtek Technology Corporation
Andrew Yoo ON Semiconductor Heinz Wei Richtek Technology Corporation
Brady Maasen ON Semiconductor TZUHSIEN CHUANG Richtek Technology Corporation
Bryan McCoy ON Semiconductor Tatsuya Irisawa Ricoh Company Ltd.
Christian Klein ON Semiconductor Akihiro Ono Rohm Co. Ltd.
Cor Voorwinden ON Semiconductor Chris Lin Rohm Co. Ltd.
Edward Berrios ON Semiconductor Hidenori Nishimoto Rohm Co. Ltd.
Michael Smith ON Semiconductor Kris Bahar Rohm Co. Ltd.
Oscar Freitas ON Semiconductor Manabu Miyata Rohm Co. Ltd.
Tom Duffy ON Semiconductor Ruben Balbuena Rohm Co. Ltd.
Brian Collins Parade Technologies Inc. Takashi Sato Rohm Co. Ltd.
Craig Wiley Parade Technologies Inc. Vijendra Kuroodi Rohm Co. Ltd.
Aditya Kulkarni Power Integrations Yusuke Kondo Rohm Co. Ltd.
Akshay Nayaknur Power Integrations Kazuomi Nagai ROHM Co., Ltd.
Amruta Patra Power Integrations Matti Kulmala Salcomp Plc
Rahul Joshi Power Integrations Toni Lehimo Salcomp Plc
Ricardo Pregiteer Power Integrations Tong Kim Samsung Electronics Co. Ltd.
Shruti Anand Power Integrations Alvin Cox Seagate Technology LLC
Amit gupta Qualcomm, Inc Emmanuel Lemay Seagate Technology LLC
---------------------- Page: 13 ----------------------
oSIST prEN IEC 62680-1-2:2022
IEC CDV 62680-1-2 Ed6© IEC 2021 -12-
John Hein Seagate Technology LLC Joel Huloux STMicroelectronics
Marc Noblitt Seagate Technology LLC John Bloomfield STMicroelectronics
Michael Morgan Seagate Technology LLC Ma
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