SIST EN 16602-30-11:2015

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila komponent EEERaumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-KomponentenAssurance produit des projets spatiaux - Derating des composants EEESpace product assurance - Derating - EEE components49.140Vesoljski sistemi in operacijeSpace systems and operationsICS:Ta slovenski standard je istoveten z:EN 16602-30-11:2014SIST EN 16602-30-11:2015en,fr,de01-januar-2015SIST EN 16602-30-11:2015SLOVENSKI
STANDARD



SIST EN 16602-30-11:2015



EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 16602-30-11
September 2014 ICS 49.140
English version
Space product assurance - Derating - EEE components
Assurance produit des projets spatiaux - Derating des composants EEE
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten This European Standard was approved by CEN on 13 March 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels © 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-30-11:2014 E SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 2 Table of contents Foreword . 6 Introduction . 7 1 Scope . 8 2 Normative references . 9 3 Terms, definitions and abbreviated terms . 10 3.1 Terms from other standards . 10 3.2 Terms specific to the present standard . 10 3.3 Abbreviated terms. 11 4 User responsibility . 13 5 Derating . 14 5.1 Overview . 14 5.2 Principles of derating . 14 5.3 Applicability and component selection . 15 5.4 Derating parameters . 17 5.5 Additional rules and recommendations . 18 6 Tables for load ratios or limits . 19 6.1 Overview . 19 6.2 Capacitors: ceramic - family-group code: 01-01 and 01-02 . 20 6.3 Capacitors: solid tantalum - family-group code: 01-03 . 21 6.4 Capacitors: non-solid tantalum - family-group code: 01-04 . 22 6.5 Capacitors: Plastic metallized - family-group code: 01-05 . 23 6.6 Capacitors: glass and porcelain - family-group code: 01-06 . 24 6.7 Capacitors: mica and reconstituted mica - family-group code: 01-07 . 25 6.8 Capacitors: feedthrough - family-group code: 01-10 . 26 6.9 Capacitors: semiconductor technology (MOS type) - family-group code: 01-11 . 27 6.10 Capacitors: miscellaneous (variable capacitors) - family-group code: 01-99 . 28 6.11 Connectors - family-group code: 02-01, 02-02, 02-03, 02-07 and 02-09 . 29 6.12 Connectors RF - family-group code: 02-05 . 30 SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 3 6.13 Piezo-electric devices: crystal resonator - family-group code: 03-01 . 31 6.14 Diodes - family-group code: 04-01, 04-02, 04-03, 04-04, 04-06, 04-08, 04-10 and 04-14 . 32 6.15 Diodes: RF/microwave - family-group code: 04-05, 04-11 to 04-13, 04-15, 04-16 and 04-17 . 34 6.16 Feedthrough filters - family-group code: 05-01 . 35 6.17 Fuses: Cermet (metal film on ceramic) - family-group code: 06-01 . 36 6.18 Inductors and transformers - family-group code: 07-01 to 07-03 and 14-01 . 37 6.19 Integrated circuits: logic - family-group code: 08-10, 08-20, 08-21, 08-29 to 08-42, and 08-80 . 38 6.20 Integrated circuits: non-volatile memories - family-group code: 08-22, 08-23 and 08-24 . 39 6.21 Integrated circuits: linear - family-group code: 08-50 to 08-60 and 08-69 . 40 6.22 Integrated circuits: linear converters - family-group code: 08-61 and 08-62 . 41 6.23 Integrated circuits: MMICs - family-group code: 08-95 . 42 6.24 Integrated circuits: miscellaneous - family-group code: 08-99 . 43 6.25 Relays and switches - family-group code: 09-01, 09-02 and 16-01 . 44 6.26 Resistors - family-group code: 10-01 to 10-11 . 47 6.27 Thermistors - family-group code: 11-01 to 11-03 . 50 6.28 Transistors: bipolar - family-group code: 12-01 to 12-04 and 12-09 . 51 6.29 Transistors: FET - family-group code: 12-05 and 12-06 . 52 6.30 Transistors: RF: bipolar - family-group code: 12-10 and 12-13 . 53 6.31 Transistors: RF: FET - family-group code: 12-12, 12-14, 12-15(FET) and 12-16(FET) . 55 6.32 Wires and cables - family-group code: 13-01 to 13-03 . 57 6.33 Opto-electronics - family-group code: 18-01 to 18-05 . 59 6.34 RF passive components: family-group code: 30-01, 30-07, 30-09, 30-10 and 30-99 . 60 6.35 Fibre optic components: fibre and cable: family-group-code: 27-01 . 61 6.36 Hybrids . 62 Bibliography . 68
Figures Figure 5-1: Parameter stress versus strength relationship . 15
Tabless Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-02 . 20 Table 6-2: Derating of parameters for capacitors family-group code 01-03 . 21 Table 6-3: Derating of parameters for capacitors family-group code . 22 SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 4 Table 6-4: Derating of parameters for capacitors family-group code 01-05 . 23 Table 6-5: Derating of parameters for capacitors family-group code 01-06 . 24 Table 6-6: Derating of parameters for capacitors family-group code 01-07 . 25 Table 6-7: Derating of parameters for capacitors family-group code 01-10 . 26 Table 6-8: Derating of parameters for capacitors family-group code 01-11 . 27 Table 6-9: Derating of parameters for capacitors family-group code 01-99 . 28 Table 6-10: Derating of parameters for connectors family-group code 02-01, 02-02, 02-03, 02-07 and 02-09 . 29 Table 6-11: Derating of parameters for connectors RF family-group code 02-05 . 30 Table 6-12: Derating of parameters for piezo-electric devices family-group code 03-01 . 31 Table 6-13: Derating of parameters for Diode (signal/switching, rectifier including Schottky, pin) . 32 Table 6-14: Derating of parameters for Diode (Zener, reference, transient suppression) . 32 Table 6-15: Derating of parameters for Diodes family-group code 04-05, 04-11 to 04-13, 04-15, 04-16 and 04-17 . 34 Table 6-16: Derating of parameters for Feedthrough filters family-group code 05-01 . 35 Table 6-17: Derating of parameters for Fuses family-group code 06-01 . 36 Table 6-18: Derating of parameters for Inductors and transformers family-group code 07-01 to 07-03 and 14-01 . 37 Table 6-19: Derating of parameters for Integrated circuits family-group code: 08-10, 08-20, 08-21, 08-29 to 08-42, and 08-80 . 38 Table 6-20: Derating of parameters for Integrated circuits family-group code: 08-22, 08-23 and 08-24 . 39 Table 6-21: Derating of parameters for Integrated circuits family-group code 08-50 to 08-60 and 08-69 . 40 Table 6-22: Derating of parameters for Integrated circuits family-group code 08-61 and 08-62 . 41 Table 6-23: Derating of parameters for Relays and switches family-group code 09-01, 09-02 and 16-01 . 45 Table 6-24: Derating of parameters for Metal film precision resistor (type RNC, except RNC 90) . 47 Table 6-25: Derating of parameters for Metal film semi-precision resistor (type RLR). 47 Table 6-26: Derating of parameters for Foil resistor (type RNC 90) . 48 Table 6-27: Derating of parameters Wire-wound high precision resistor (type RBR 56). 48 Table 6-28: Derating of parameters for Wire-wound power resistor (type RWR, RER) . 48 Table 6-29: Derating of parameters for Chip resistor (RM), network resistor . 49 Table 6-30: Derating of parameters for Carbon composition resistor . 49 Table 6-31: Derating of parameters for Heaters . 49 Table 6-32: Derating of parameters for Thermistors family-group code 11-01 to 11-03 . 50 Table 6-33: Derating of parameters for Transistors family-group code 12-01 to 12-04 and 12-09 . 51 SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 5 Table 6-34: Derating of parameters for Transistors family-group code 12-05 and 12-06 . 52 Table 6-35: Derating of parameters for Transistors family-group code 12-10 and 12-13 . 54 Table 6-36: Derating of parameters for Transistors family-group code 12-12, 12-14, 12-15(FET) and 12-16(FET) . 55 Table 6-37: Derating of parameters for Wires and cables family-group code 13-01 to 13-03 . 57 Table 6-38: Bundle factor K for calculation of the derated current for each individual wire in bundles of N wires . 58 Table 6-39: Derating of parameters for Opto-electronics family-group code 18-01 to 18-05 . 59 Table 6-40: Derating of parameters for RF passive components from family-group code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power < 5 W . 60 Table 6-41: Derating of parameters for RF passive components from family-group code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power ≥ 5 W . 60 Table 6-42: Derating of parameters for Fibre optic components . 61
SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 6 Foreword This document (EN 16602-30-11:2014) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16602-30-11:2014) originates from ECSS-Q-ST-30-11C Rev 1. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by March 2015, and conflicting national standards shall be withdrawn at the latest by March 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 7 Introduction This Standard specifies derating requirements applicable to electronic, electrical and electromechanical components.
Derating is a long standing practice applied to components used on spacecrafts. Benefits of this practice are now proven, but for competitiveness reasons, it becomes necessary to find an optimized reliability. Too high a derating can lead to over-design, over-cost and over-sizing of components, the direct consequence being excess volume and weight. The aim is to obtain reliable and high performance equipment without over-sizing of the components. For this reason and if possible, this Standard provides derating requirements depending on mission duration and mean temperature, taking into account demonstrated limits of component capabilities. SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 8 1 Scope This Standard applies to all parties involved at all levels in the realization of space segment hardware and its interfaces.
The objective of this Standard is to provide customers with a guaranteed performance and reliability up to the equipment end-of-life. To this end, the following are specified:
• Load ratios or limits to reduce stress applied to components; • Application rules and recommendations. This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00. SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 9 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this ECSS Standard. For dated references, subsequent amendments to, or revisions of any of these publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references the latest edition of the publication referred to applies.
EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic and electromechanical (EEE) components
ESCC 2269010 Evaluation test programme for monolithic microwave integrated circuits (MMICS)
ESCC 2265010 Evaluation Test Programme for Discrete Microwave Semiconductors
SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 10 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and definitions from ECSS-ST-00-01 apply. 3.2 Terms specific to the present standard 3.2.1 ambient temperature temperature surrounding a component 3.2.2 case temperature
temperature on the component package surface 3.2.3 derating
process of designing a product such that its components operate at a significantly reduced level of stress to increase reliability and to insure useful life
and design margins. 3.2.4 hot spot temperature highest measured or predicted temperature within any component 3.2.5 junction temperature
highest measured or predicted temperature at the junction within a semiconductor or micro-electronic device NOTE
Predicted temperature can be taken as Tcase + thermal resistance between junction and case times actual power (Watt) of the device. 3.2.6 load ratio
permissible operating level after derating has been applied; given as a percentage of a parameter rating 3.2.7 operating conditions
parameter stress and environment (temperature, vibration, shock and radiation) in which components are expected to operate SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 11 3.2.8 term "performance" deleted 3.2.9 RadPack package designed to provide some form of radiation protection 3.2.10 rating
maximum parameter value specified and guaranteed by the component manufacturer and component procurement specification NOTE
Rating is considered as a limit not to be exceeded during operation and constitutes in most cases the reference for derating. 3.2.11 surge strong rush or sweep [Collins dictionary and thesaurus] 3.2.12 transient brief change in the state of a system [Collins dictionary and thesaurus] 3.3 Abbreviated terms For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01 and the following apply: Abbreviation Meaning A/D analog to digital ASIC application specific integrated circuit C capacitance DRAM dynamic random access memory EEPROM electrical erasable programmable read only memory EPROM erasable programmable read only memory ESCC European Space Component Coordination ESR equivalent series resistance f frequency FET field effect transistor GaAs gallium arsenide ISO International Organization for Standardization InP indium posphide LED light emitting diode MOS metal on silicon SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 12 Abbreviation Meaning MIL (spec) specification of the US Department of Defense MMIC monolithic microwave integrated circuit NASA
National Aeronautics and Space Administration P power PROM programmable read only memory RadHard radiation hardened Ri insulation resistance RF radio-frequency SEBO single event burn-out SEGR single event gate rupture Si, SiGe silicon, silicon germanium SOA safe operating area SRAM static random access memory Tj junction temperature Tjmax absolute maximum rated junction temperature Top operating temperature VCE collector-emitter voltage
SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 13 4 User responsibility a. The user of this Standard shall verify that the ordered assurance level of procured components is compatible with the intended application. SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 14 5 Derating 5.1 Overview The term derating refers to the intentional reduction of electrical, thermal and mechanical stresses on components to levels below their specified rating. Derating is a means of extending component life, increasing reliability and enhancing the end-of-life performance of equipment.
Derating participates in the protection of components from unexpected application anomalies and board design variations. The load ratios or limits given in clause 6 were derived from information available at the time of writing this Standard and do not preclude further derating for specific applications. This Standard also defines how to handle transients. 5.2 Principles of derating The component parameter strength defines the limits and the performance component technology in the particular application and varies from manufacturer to manufacturer, from type to type, and from lot to lot and can be represented by a statistical distribution. Likewise, component stress can be represented by a statistical distribution. Figure 5-1 illustrates the strength of a component and the stress applied at a given time, where each characteristic is represented by a probability density function.
A component operates in a reliable way if its parameter strength exceeds the parameter stress. The designer should ensure that the stress applied does not exceed the component parameter strength. This is represented by the intersection (shaded area) in Figure 5-1. The larger the shaded area, the higher the possibility of failure becomes.
There are two ways, which may be used simultaneously, in which the shaded area can be decreased: • Decrease the stress applied (which moves the stress distribution to the left).
• Increase the component parameter strength (by selecting over-sized components) thereby moving the strength distribution to the right.
The goal is to minimize the stress-to-strength ratio of the component. Derating moves the parameter stress distribution to the left while the selection processes applied to the components for space applications contribute to moving the SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 15 parameter strength distribution to the right. The selection processes also reduce the uncertainty associated with the component parameter strength. Derating reduces the probability of failure, improves the end-of-life performance of components and provides additional design margins. Another effect of derating is to provide a safety margin for design. It allows integrating parameter distribution from one component to another, and from one procurement to another.
stress distributionprobability densityregion of stress and strength interference where failures can occurstrength distributionparameter
Figure 5-1: Parameter stress versus strength relationship 5.3 Applicability and component selection 5.3.1 Overview This Standard applies to all components, selected for space applications, that are used for a significant duration. The meaning of “significant duration” is a period that contributes to the component life, for instance, one month is considered to be a significant duration. These requirements apply to screened components procured in accordance with approved space specifications.
This Standard only applies to approved components for which quality was proven after rigorous testing in accordance with ECSS-Q-ST-60. Derating applies on
normal operational conditions,
where
“normal” is
opposed to “fault” and “Operational” indicates
all functional
modes of the unit. Derating analysis is performed at the equipment maximum hot acceptance temperature, unless otherwise specified.
5.3.2 Requirements a. Derating shall be applied in consideration of temperature limits recommended by the manufacturer. b. The derating requirements of this Standard shall not be used as a justification to upgrade the quality level of components. SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 16 c. The derating requirements shall be taken into account at the beginning of the design cycle of an equipment for any consequential design trade-off to be made. Specific attention shall be paid to, for example, breadboards and engineering models where parameter derating was not considered. d. Component families and groups excluded in this Standard are due to the lack of experimental data and failure history. For these components, the user shall consult a component design and reliability specialist to apply the requirements of this Standard. e. Components may be excluded from this Standard if they are used for short durations of less than one month provided the device ratings are not exceeded; for example, components used in solar generator deployment systems, redundancy commutation and launchers (except in some specific cases, noted family by family). In these cases, the designer shall ensure that the applied stress level does not exceed the component maximum rating.
f. The derating requirements are not applicable to test conditions (e.g. circuit or equipment level qualification and EMC) for which the maximum ratings shall not be exceeded. g. Derating requirements are not applicable to fault conditions, for which the maximum rating shall not be exceeded, with the exception defined in 5.3.2h. h. Where components are required to operate in protection mode or in fail-safe mode in order to prevent failure propagation (e.g. short-circuit protection), the components concerned shall meet the derating requirements and application rules when performing the protection or fail-safe function under the worst failure case (i.e. highest stress applied to the components that can last throughout the mission). 5.3.3 Requirements ESCC exceptions a. For a particular type or manufacturer, when a specific derating rule is defined in the appendix of the approved ESCC detail specification issued by the ESCC Executive, it shall take precedence over the generic requirement of this standard.
b. Users shall check for application the actual status of the ESCC Derating exceptions on the following ESCC web site page: ESCC Derating deviations
NOTE
A list of the ESCC detail specifications applicable at the time of publication and containing deviations to general derating requirements of this standard is available in informative Annex B.
c. Users shall clearly identify in the Parts Stress Analysis document the list of the ESCC Derating exceptions taken into consideration in their analysis.
SIST EN 16602-30-11:2015



EN 16602-30-11:2014 (E) 17 5.4 Derating parameters 5.4.1 Overview Derating requirements are provided in clause 6 for each component family.
For each category, the parameters to be derated are identified. The main parameters to be derated are:
• junction or case temperature;
• power (rating, dissipation); • voltage; • current. The parameters to be derated depend on component type. A stress balancing concept offers flexibility between one stress versus another (voltage and temperature). In some cases, e.g. resistors, derating has a direct impact on component performance. 5.4.2 Requirements for transient and surge conditions a. For transient or surge conditions, if ratings are provided, the same derating figures as for steady-state equivalent parameters shall be used. b. For transient or surge conditions, if ratings are not provided, then it shall be assured that the transient or surge values are below the steady-state specified maximum ratings. c. For all periodic signals or transient
conditions which are repeated or made incessant, the steady-state derating figures shall apply. d. <> e. As an exception
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